Patents by Inventor Guo Ouyang

Guo Ouyang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220093320
    Abstract: Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.
    Type: Application
    Filed: December 2, 2021
    Publication date: March 24, 2022
    Applicant: Shenzhen Sunlord Electronics Co., Ltd.
    Inventors: Xiaoyue ZHA, Guo OUYANG, Jingjing REN
  • Patent number: 10020110
    Abstract: A surface mount power inductor component for a circuit board includes a magnetic body, at least one conductive coil, and surface mount terminations for completing an electrical connection between the conductive coil and the circuit board. One of the body and the surface mount terminations is configured to accommodate a separately provided component in a vertically stacked relation with the separately provided circuit board component being located between the circuit board and the body.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: July 10, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Renford Hanley, Guo Ouyang, Dengyan Zhou, Robert James Bogert, Yipeng Yan
  • Publication number: 20160260536
    Abstract: A surface mount power inductor component for a circuit board includes a magnetic body, at least one conductive coil, and surface mount terminations for completing an electrical connection between the conductive coil and the circuit board. One of the body and the surface mount terminations is configured to accommodate a separately provided component in a vertically stacked relation with the separately provided circuit board component being located between the circuit board and the body.
    Type: Application
    Filed: May 16, 2016
    Publication date: September 8, 2016
    Inventors: Renford Hanley, Guo Ouyang, Dengyan Zhou, Robert James Bogert, Yipeng Yan
  • Patent number: 9275787
    Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: March 1, 2016
    Assignee: COOPER TECHNOLOGIES COMPANY
    Inventors: Yipeng Yan, Robert James Bogert, Guo Ouyang, Zhigang Cheng
  • Publication number: 20160005528
    Abstract: An electromagnet component assembly includes a preformed conductive winding formed in at least first and second pieces for assembly with a single magnetic core with a simplified and relatively low cost manufacture. The assembly provides a power inductor operable at higher current, higher power levels with reduced direct current resistance.
    Type: Application
    Filed: September 15, 2015
    Publication date: January 7, 2016
    Inventors: Yipeng Yan, Robert James Bogert, Brent Elliot, Guo Ouyang
  • Patent number: 8400245
    Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: March 19, 2013
    Assignee: Cooper Technologies Company
    Inventors: Yipeng Yan, Robert James Bogert, Guo Ouyang, Zhigang Cheng
  • Publication number: 20100013587
    Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.
    Type: Application
    Filed: August 5, 2009
    Publication date: January 21, 2010
    Inventors: Yipeng Yan, Robert James Bogert, Guo Ouyang, Zhigang Cheng