Patents by Inventor Guoguo WANG

Guoguo WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • To package for DFB laser with TEC vertically mounted in groove of heatsink
    Patent number: 11973311
    Abstract: An optical sub-module includes a base body having a first base surface and a second base surface that are opposite to each other, a plurality of pins each penetrating through the second base surface and the first base surface, a heat sink disposed on the first base surface and having a groove facing the plurality of pins, a temperature regulator disposed in the groove, and a light emitter disposed on the temperature regulator. The temperature regulator includes a first heat exchange surface and a second heat exchange surface that are opposite to each other, the first heat exchange surface is in contact with an inner wall of the groove, and the light emitter is disposed at the second heat exchange surface so as to perform heat transfer with the temperature regulator.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: April 30, 2024
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventor: Guoguo Wang
  • OPTICAL SUB-MODULE AND OPTICAL MODULE
    Publication number: 20200287347
    Abstract: An optical sub-module includes a base body having a first base surface and a second base surface that are opposite to each other, a plurality of pins each penetrating through the second base surface and the first base surface, a heat sink disposed on the first base surface and having a groove facing the plurality of pins, a temperature regulator disposed in the groove, and a light emitter disposed on the temperature regulator. The temperature regulator includes a first heat exchange surface and a second heat exchange surface that are opposite to each other, the first heat exchange surface is in contact with an inner wall of the groove, and the light emitter is disposed at the second heat exchange surface so as to perform heat transfer with the temperature regulator.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 10, 2020
    Inventor: Guoguo WANG