Abstract: The present invention discloses a CEEMDAN-based method for screening and monitoring soil moisture stress in farmland, characterised by the steps: preprocessing of remote sensing images, construction of NDVI long time series, CEEMDAN decomposition, calculation of statistical descriptors, screening of soil moisture stress sequences, ground data measurement, construction of soil moisture stress characteristic curves, fitting of soil moisture stress response characteristic curves and predicting the content of soil moisture stress. The invention adopts CEEMDAN decomposition, which solves the problems of noise residue and low reconstruction accuracy in the previous methods, and the high reconstruction accuracy of decomposed component data is more conducive to capturing the transient effects of soil moisture stress, and realizes the screening and extraction of soil moisture stress by combining with the ground measured data.

Abstract: The present disclosure relates to a decoding method, apparatus and computer-readable storage medium, which relates to the field of computer technology. The method of the present disclosure includes buffering one or more stream segments of a data stream which are received, wherein the data stream comprises an audio stream; parsing the one or more stream segments buffered until header information is obtained through the parsing; storing the header information; and decoding stream segments of the audio stream among various stream segments received according to the header information until the audio stream is completely decoded.

Abstract: Disclosed are flexible glass and a preparation method therefor; weight proportions of the raw materials used in the flexible glass are: 60.04-63.01 parts silicon dioxide, 16.7-21.5 parts aluminum oxide, 12.93-19.85 parts boron oxide, 2.43-14.19 parts calcium carbonate, 0.16-2.07 parts magnesium oxide. 0.5-2.74 parts strontium carbonate and 0-4.16 parts barium nitrate. The method includes: step 1: pouring raw materials into a mixer, and uniformly mixing to form a mixture; step 2: adding the mixture into a glass furnace, heating to melt the glass, and the melted glass entering a platinum feeding channel for clarification and flowing into a tube drawing tunnel; step 3: drawing the liquid glass into a long glass tube; step 4: using a laser cutting machine to transversely and longitudinally cut the glass tube according to specification requirements, forming a glass sheet; step 5: inspecting the glass sheet, and preparing a flexible glass product.

Abstract: Disclosed are electronic glass having high liquidus viscosity and a preparation method. The proportions of the raw materials used in the electronic glass are: SiO2: 65.56-68.6%; Al2O3: 10.58-14%; B2O3: 7-11%; SrO: 0.27-3.26%; BaO: 7.20-10.12%; CaO: 0.22-1.22%; MgO: 0-1.05%; MgO+CaO+SrO+BaO<13%; and the liquidus viscosity of the electronic glass is greater than 200,000 poise. The minimum value of the temperature corresponding to a liquidus temperature reduction of 100,000 poise in the electronic glass is 22° C. The electronic glass has a strain point temperature of 670-739° C., a Young's modulus of 70-83 GPa, and a density of 2.38-2.45 g/cm3, the liquidus viscosity is ensured to be higher than 200,000 poise, the electronic glass is well suited to overflow downdraw forming, and a relatively low density value can be obtained.

Abstract: A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.

Abstract: An N-aromatic amide compounds with formula (I) is disclosed. The definitions of R1, R2, R3, R4, R5, R6, W1, W2 and W3 in the formula are the same as those in the description.

Abstract: The present invention relates to N-aromatic amide compounds with formula (I) and/or (II) and preparation methods therefor, pharmaceutical compositions and pharmaceutical formulations containing the compounds with formula (I) and/or (II), and use of the compounds with formula (I) and/or (II) in preparing a medicament for the treatment of diseases related to androgens. The definitions of R1, R2, R3, R4, R5, R6, W1, W2, W3, W4 and W5 in the formula are the same as those in the description. The compounds with the formula (I) and/or (II) are capable of binding to the androgen receptors and have activity for anti-androgen and degrading androgen receptor. The compounds can be used alone or as compositions for the treatment of various androgen-related diseases such as prostate cancer, prostate hyperplasia, breast cancer, bladder cancer, ovarian cancer and the like, and also for the treatment of acne, hirsutism, psilosis and other diseases.

Abstract: A step-type stacked chip packaging structure based on a resin spacer that includes: a plastic packaging material, a circuit board, a resin spacer, a first chip, a second chip and an electrical connection assembly. The resin spacer, the first chip, and the second chip are stacked on the circuit board respectively. The second chip is stacked on the first chip in a stepped manner. The circuit board, the first chip and the second chip are electrically connected together through the electrical connection assembly. The resin spacer uses a fiber glass fabric as its base material, a weight percent of the fiber glass fabric is 10-60 wt %, and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent.

Abstract: Provided is a sheet forming thickness control method of an overflow brick, including: S1: obtaining a free flow thickness distribution and a free flow speed distribution of an overflow of a glass on an overflow surface of the overflow brick through simulation; S2: calculating an equivalent drawing speed distribution of an overflow guide plate and a critical equivalent drawing speed of the overflow guide plate; S3: calculating an equivalent drawing thickness distribution and a forming thickness distribution of the overflow of the glass; S4: calculating an extreme thickness difference of a formed glass substrate; and S5: when the extreme thickness difference is greater than a preset threshold, changing current parameters and repeating steps S1 to S4; and when the extreme thickness difference is smaller than or equal to the preset threshold, processing the overflow brick and producing the glass substrate in accordance with the current parameters.

Abstract: The present invention relates to N-aromatic amide compounds with formula (I) and/or (II) and preparation methods therefor, pharmaceutical compositions and pharmaceutical formulations containing the compounds with formula (I) and/or (II), and use of the compounds with formula (I) and/or (II) in preparing a medicament for the treatment of diseases related to androgens. The definitions of R1, R2, R3, R4, R5, R6, W1, W2, W3, W4 and W5 in the formula are the same as those in the description. The compounds with the formula (I) and/or (II) are capable of binding to the androgen receptors and have activity for anti-androgen and degrading androgen receptor. The compounds can be used alone or as compositions for the treatment of various androgen-related diseases such as prostate cancer, prostate hyperplasia, breast cancer, bladder cancer, ovarian cancer and the like, and also for the treatment of acne, hirsutism, psilosis and other diseases.

Abstract: A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.

Abstract: A step-type stacked chip packaging structure based on a resin spacer that includes: a plastic packaging material, a circuit board, a resin spacer, a first chip, a second chip and an electrical connection assembly. The resin spacer, the first chip, and the second chip are stacked on the circuit board respectively. The second chip is stacked on the first chip in a stepped manner. The circuit board, the first chip and the second chip are electrically connected together through the electrical connection assembly. The resin spacer uses a fiber glass fabric as its base material, a weight percent of the fiber glass fabric is 10-60 wt %, and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent.

Abstract: An alkali-free glass for flat panel display consists of, by weight, 54-68% SiO2, 10.8-17.1% Al2O3, 7.6-12.5% B2O3, 0.2-1.8% MgO, 4.2-8% CaO, 0.6-7.1% SrO, 0.1-5% BaO, 0.2-1% ZnO, 0.01-1.54% ZrO2 and 0.1-1.3% SnO+SnO2. The boroaluminosilicate glass of the present invention does not contain As and Sb which contribute to serious environmental pollution. The quality of the glass is improved by the specific process which reduces the content of the gas inclusions in the glass.