Abstract: An array substrate of a display device includes a pixel electrode layer on a substrate, which includes active pixel electrodes in an active display region; outermost active pixel electrodes include a first active pixel electrode including a first pixel electrode edge and a second pixel electrode edge; in a first direction, the first pixel electrode edge is between the second pixel electrode edge and a frame region. One of the array substrate and an opposite substrate of the display device includes a common electrode layer including a first extended common electrode which includes a first extended portion extending beyond the first active pixel electrode; a first extended portion edge of the first extended portion and a first substrate edge of the substrate respectively extend in a second direction; in the first direction, the first extended portion edge is located between the first substrate edge and the first pixel electrode edge.

Abstract: An array substrate of a display device includes a pixel electrode layer on a substrate, which includes active pixel electrodes in an active display region; outermost active pixel electrodes include a first active pixel electrode including a first pixel electrode edge and a second pixel electrode edge; in a first direction, the first pixel electrode edge is between the second pixel electrode edge and a frame region. One of the array substrate and an opposite substrate of the display device includes a common electrode layer including a first extended common electrode which includes a first extended portion extending beyond the first active pixel electrode; a first extended portion edge of the first extended portion and a first substrate edge of the substrate respectively extend in a second direction; in the first direction, the first extended portion edge is located between the first substrate edge and the first pixel electrode edge.

Abstract: The present disclosure provides an array substrate and a fabrication method thereof, a display panel and a display module. The array substrate has a display region and a bonding region for bonding with a circuit board, and including: a data line and a gate line in the display region; and a bump unit in the bonding region. The bump unit includes: a gate line bump layer, which is in a same layer and made of a same material as the gate line, is connected to the data line, and includes a main body portion and a plurality of hollowed-out portions in the main body portion; and a data line bump layer, which is in a same layer and made of a same material as the data line, and covers the main body portion and the plurality of hollowed-out portions of the gate line bump layer.

Abstract: An array substrate has a display area and a bezel area located on at least one side of the display area. The bezel area includes a bonding region. The array substrate includes a substrate, a plurality of signal lines, a plurality of conductive bumps, and an insulating layer. The signal lines are disposed on the substrate. The conductive blocks are disposed on a portion of the substrate located in the bonding region, and a conductive bump is connected to at least one signal line. The insulating layer covers the plurality of signal lines and is located between every two adjacent conductive bumps. The conductive bump includes a conductive metal layer. A distance from a surface of the conductive metal layer away from the substrate to the substrate is less than or equal to a distance from a surface of the insulating layer away from the substrate to the substrate.

Abstract: Embodiments of the present disclosure provide a thin film transistor assembly, an array substrate and a display panel. The thin film transistor assembly includes a first thin film transistor and a second thin film transistor disposed on a substrate. The first thin film transistor includes a first source electrode, a first drain electrode, and a first active layer. The second thin film transistor includes a second source electrode. The first source electrode is disposed on a side of the first active layer facing towards the substrate. The first drain electrode is disposed on a side of the first active layer facing away from the substrate. An orthogonal projection of the first source electrode on the substrate overlaps an orthogonal projection of the second source electrode on the substrate.

Abstract: Embodiments of the present disclosure provide a thin film transistor assembly, an array substrate and a display panel. The thin film transistor assembly includes a first thin film transistor and a second thin film transistor disposed on a substrate. The first thin film transistor includes a first source electrode, a first drain electrode, and a first active layer. The second thin film transistor includes a second source electrode. The first source electrode is disposed on a side of the first active layer facing towards the substrate. The first drain electrode is disposed on a side of the first active layer facing away from the substrate. An orthogonal projection of the first source electrode on the substrate overlaps an orthogonal projection of the second source electrode on the substrate.

Abstract: The present disclosure provides an array substrate and a fabrication method thereof, a display panel and a display module. The array substrate has a display region and a bonding region for bonding with a circuit board, and including: a data line and a gate line in the display region; and a bump unit in the bonding region. The bump unit includes: a gate line bump layer, which is in a same layer and made of a same material as the gate line, is connected to the data line, and includes a main body portion and a plurality of hollowed-out portions in the main body portion; and a data line bump layer, which is in a same layer and made of a same material as the data line, and covers the main body portion and the plurality of hollowed-out portions of the gate line bump layer.