Patents by Inventor Guoshen Hu

Guoshen Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stud bumping apparatus
    Patent number: 7303109
    Abstract: The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: December 4, 2007
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Ka Shing Kwan, Guoshen Hu, Tingyu He, Yie Mi, Yam Mo Wong
  • Stud bumping apparatus
    Publication number: 20050001018
    Abstract: The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.
    Type: Application
    Filed: July 1, 2003
    Publication date: January 6, 2005
    Inventors: Ka Kwan, Guoshen Hu, Tingyu He, Yie Mi, Yam Wong