Abstract: A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.

Abstract: A SAS panel mount cable assembly for providing access of target hard-drive resources to an initiator-host includes an initiator-side connector, two target-side connectors, and a wire-harness. Each of the two target-side connectors includes a power-link portion, a signal-link portion, an interface separating the power-link portion and the signal-link portion, and a plurality of LEDs for indicating activity and fault-detection. A plurality of power-wires electrically connects the wire-harness to the power-link portions of the two target-side connectors, and two signal-link cables connect the initiator-side connector to the signal-link portions of the two target-side connectors.

Abstract: A cover for memory sockets of a computer memory module includes a face panel spaced away from the memory sockets. The cover is held in place via latches associated with the memory sockets. Tabs are spaced along opposite sides of the cover to define openings for the memory sockets. Members span between opposite pairs of tabs to define air passageways underneath the cover. Each member resides between an adjacent pair of memory sockets.

Abstract: A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.

Abstract: A SAS panel mount cable assembly for providing access of target hard-drive resources to an initiator-host includes an initiator-side connector, two target-side connectors, and a wire-harness. Each of the two target-side connectors includes a power-link portion, a signal-link portion, an interface separating the power-link portion and the signal-link portion, and a plurality of LEDs for indicating activity and fault-detection. A plurality of power-wires electrically connects the wire-harness to the power-link portions of the two target-side connectors, and two signal-link cables connect the initiator-side connector to the signal-link portions of the two target-side connectors.

Abstract: A cover for memory sockets of a computer memory module includes a face panel spaced away from the memory sockets. The cover is held in place via latches associated with the memory sockets. Tabs are spaced along opposite sides of the cover to define openings for the memory sockets. Members span between opposite pairs of tabs to define air passageways underneath the cover. Each member resides between an adjacent pair of memory sockets.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: A method for isolating a pin of a ball grid array (BGA) device mounted on a printed circuit board, and routing the signal carried by the isolated pin to an alternate location. The BGA device pin is isolated by removing the solder ball to expose the device pad. A rework or engineering wire is then soldered to the BGA device pad using a high temperature solder. The rework wire is then routed between the other solder pads to the edge of the BGA device package. The BGA device is then reflowed at a temperature lower than the reflow temperature of the high temperature solder. The rework wire is used to route the signal carried by the isolated BGA pin to an alternate location. The present invention provides for higher process yields than conventional rework processes.