Abstract: An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture.

Abstract: A semiconductor device such as a photodetector has a substrate having an active region layer containing an active region of the device. A dielectric layer is disposed on the active region layer, and a metal active region contact is disposed in the dielectric layer above the active region and electrically contacting the active region. A metal electrostatic discharge (ESD)protection structure is disposed in the dielectric layer around the active region contact, wherein the ESD protection structure electrically contacts the active region layer of the substrate to provide an ESD discharge path for charge on the surface of the dielectric layer.

Abstract: A semiconductor device such as a photodetector has a substrate having an active region layer containing an active region of the device. A dielectric layer is disposed on the active region layer, and a metal active region contact is disposed in the dielectric layer above the active region and electrically contacting the active region. A metal electrostatic discharge (ESD) protection structure is disposed in the dielectric layer around the active region contact, wherein the ESD protection structure electrically contacts the active region layer of the substrate to provide an ESD discharge path for charge on the surface of the dielectric layer.

Abstract: A method of calibrating an interferometer system and a multilayer thin film used for calibrating the interferometer system. The method including measuring the step height of a gold step with the interferometer system, the multilayer thin film comprising a gold layer that defines the gold step. The multilayer thin film having an optical flat, a first layer on the surface of the optical flat, a second layer on the first layer, a test layer on a part of the second layer, and a gold layer on the test layer and on a part of the second layer uncovered by the test layer. The test layer having a test layer step, and the gold layer having a gold step over the test layer step. Also, a reference standard and a method of making the reference standard for a thin film sample with one or more component thin film layers, the reference standard having a gold layer over the surface of the thin film sample.

Abstract: An improved method and solder composition for kinetically controlled part bonding. The method involves applying at least a first chemical element layer of an intermetallic compound to a first part and applying at least a second chemical element layer of the intermetallic compound to a second part. The first and second parts are placed together so that the chemical element layers contact each other. The parts are heated from a storage temperature to a bonding temperature which is slightly above a first melting temperature that melts the chemical element layer of one of the first and second parts into a liquid mixture. The composition of liquid mixture varies with time during heating due to the formation of the intermetallic compound therein by progressive incorporation of the other one of the first and second chemical element layers into the mixture.

Abstract: An optical package includes a dual fiber termination having a first optical fiber end portion and a second optical fiber end portion. A collimating lens, spaced from the dual fiber termination, is configured for collimating and transmitting an optical signal emitted from the first optical fiber end portion and for converging a reflected optical signal onto the second optical fiber end portion. A mirror spaced from the collimating lens and having a reflective layer is configured and oriented for reflecting at least a portion of the emitted optical signal from the collimating lens back toward the collimating along a propagation path. A compensation lens is disposed between the collimating lens and the reflective layer of the mirror for correcting optical misalignment between the dual fiber termination and the collimating lens.

Abstract: An optical isolator which is suitable for array assembly and may be produced by lithographically-defined means comprises a sandwich of layers. These layers include a substrate having two waveguides for transmission of a signal having two parts, each part being comprised of two rays; a walk-off plate for spatially displacing or recombining the rays of both parts; a half-wave plate of birefringent material for reciprocal rotation of the polarization of the rays of only one part of the signal; a non-reciprocal rotator for rotating the polarization of the rays of both parts of the signal at a predetermined angle; a lens for collimating the rays transmitted through the walk-off plate, the half-wave plate, and the rotator, and for focusing the rays opposite the rotator at a common region along an end surface; and an end surface for interconnection of the rays of the two parts of the signal.

Abstract: A stable, reliable ohmic contact, and improved semiconductor articles and opto-electronic circuits incorporating same, are disclosed. According to an illustrative embodiment of the invention, an ohmic contact having a plurality of thermodynamically-stable layers and layer interfaces is formed by providing a structure comprising multiple, appropriately-thick and specifically-organized layers of suitably-selected material, and exposing the structure to heat to cause reaction to take place between the various layers. Due to the thermodynamic stability of the resulting reacted layers and the interfaces between such layers, there is substantially no tendency for further reaction to occur within the ohmic contact.

Abstract: Compliant standoffs are disposed on a support surface of a semiconductor or hybrid semiconductor device. The standoffs extend further from the support surface than other active or passive structures associated with the (hybrid) semiconductor device, and are spaced at least a minimum distance from such associated structures. Each compliant standoff provides a surface at which auxiliary devices, such as optical subassemblies, lightwave circuits and the like, can be attached. Since the compliant standoffs extend further from the support surface than other associated structures, such other associated structures are protected from potentially damaging contact with the auxiliary device(s) being attached to the compliant standoffs.

Abstract: In an optical material formed of strips of laminated methods, through channels or "trenches" are produced in at least one of the lamination materials in a manner that the material will then consist of "stiff islands" interspersed with flexible regions created by the properly created through channels. The trenching alows a strip to become piece-wise alignable, and also makes it flexible enough to bond it in alignment in a laminate, yet continuous enough to be handled as one sheet for initial placement. "Chain-like" capability can be provided by making the sheet into a form resembling a jig-saw puzzle where the chances of the individual pieces slipping apart is reduced using narrow, slanted trenches. Alternatively, "springy" flexibility can be provided by forming relatively long, thin, bent strips of material that support the islands of continuous sheet. The islands are thus allowed to move two dimensionally relative to each other.

Abstract: A self-orienting optical component advantageous for assembling sub-optical assemblies in which the components must be precisely aligned comprises a component having a magnetic film deposited on a portion of its outer surface so that a magnetic field applied adjacent the optical component will induce the optical component to move to a pre-determined orientation. Advantageously, the optical component also has further layers deposited on portions of its outer surface for aiding in adhesion, soldering, or light transmission. An improved method of assembling an optical subassembly comprises depositing a film of magnetic material over a portion of the outer surface of the optical component and applying a magnetic field to the optical component to induce it to move to a pre-determined orientation to aid in positioning it on a submount.

Abstract: A method and apparatus for preventing overspray onto bonding pads of a laser bar during facet coating includes manufacturing inserts with gaskets that are aligned with the laser bar such that the gaskets mask off the bonding pads during the facet coating process so that no overspray onto the bonding pads occurs. The gaskets are preferably made of gold with a thin titanium coating to prevent thermal compression bonding with the bonding pads. The inserts with gaskets are preferably manufactured using standard wafer processing techniques. The gaskets are preferably formed using the compliant layer metalization process described in U.S. Pat. No. 5,559,817.

Abstract: An improved method and composition for achieving a kinetically-controlled solder bond is disclosed having particular application to the fabrication of hybrid integrated circuits and optical subassemblies. The method involves the use of a solder layer, a quenching layer, and a control layer disposed between the solder layer and quenching layer, in which the control layer is advantageously comprised of a thin film of platinum. Additionally, a barrier layer, also preferably comprised of a thin film of platinum, is disposed between the solder layer and the parts to be bonded to prevent the oxidation of solder materials during the soldering process or later storage of the soldered parts.

Abstract: Disclosed is an optical and/or microelectronics hermetic package which includes a member for absorbing hydrogen from the internal package ambient. The member includes a first layer which forms a hydride and, formed thereover, a second layer which forms solvated hydrogen upon exposure to molecular hydrogen in the package. The second layer acts as a one way valve for transporting hydrogen to the first layer which locks up the hydrogen.

Abstract: The specification describes a test procedure for evaluating the susceptibility of electronic and photonic device packages to degradation effects caused by ambient hydrogen in the device package during the service life of the packaged device. The test procedure uses a hydrogen soak in which the subassembly parts are immersed in high concentrations of hydrogen gas at moderately elevated temperatures. The hydrogen gas is preferably diluted with an inert gas such as nitrogen or argon for safety in handling and processing. The test procedure can be used to screen components once their susceptibility to hydrogen attack has been established.