Abstract: A physical synthesis system includes a path straightening module, an ideal critical point identification (ID) module, and a free-space ID module. The path straightening module identifies at least one meandering critical path of a circuit, and generates a reference curve based on dimensions of the critical path. The ideal critical point ID module identifies at least one critical point on the reference curve. The free-space ID module identifies at least one free-space to receive a gate with respect to at least one critical point. The physical synthesis system further includes a free-space selector module and a gate modification module. The free-space selector module determines a modified slack timing value based on relocating the gate to the at least one free-space. The gate modification module moves the gate to the at least one free-space when the modified slack timing value is greater than an initial slack timing value.

Abstract: A physical synthesis system includes a path straightening module, an ideal critical point identification (ID) module, and a free-space ID module. The path straightening module identifies at least one meandering critical path of a circuit, and generates a reference curve based on dimensions of the critical path. The ideal critical point ID module identifies at least one critical point on the reference curve. The free-space ID module identifies at least one free-space to receive a gate with respect to at least one critical point. The physical synthesis system further includes a free-space selector module and a gate modification module. The free-space selector module determines a modified slack timing value based on relocating the gate to the at least one free-space. The gate modification module moves the gate to the at least one free-space when the modified slack timing value is greater than an initial slack timing value.

Abstract: Three-dimensional structures are provided which improve manufacturing yield for certain structures in semiconductor devices. The three-dimensional structures take into account the interaction between an upper layer and a lower layer where the lower layer has a tendency to form a non-planar surface due to its design. Accordingly, structures built on a layer above the lower layer are formed on a more planar surface and thus are more likely to function properly. The changes to improve manufacturing yield are made at the design stage rather than at the fabrication stage.

Abstract: Three-dimensional structures are provided which improve manufacturing yield for certain structures in semiconductor devices. The three-dimensional structures take into account the interaction between an upper layer and a lower layer where the lower layer has a tendency to form a non-planar surface due to its design. Accordingly, design changes are performed to make structures more likely to function, either by forming a more planar surface on the lower layer or by compensating in the upper layer for the lack of planarity. The changes to improve manufacturing yield are made at the design stage rather than at the fabrication stage.

Abstract: In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.

Abstract: Embodiments herein present a method, service, computer program product, etc. or performing yield-aware IC routing for a design. The method performs an initial global routing which satisfies wiring congestion constraints. Next, the method performs wire spreading and wire widening on the global route, layer by layer, based on, for example, a quadratic congestion optimization. Following this, timing closure is performed on the global route using results of the wire spreading and wire widening. Post-routing wiring width and wire spreading adjustments are made using the critical area yield model. In addition, the method allows for the optimization of already-routed data.

Abstract: Three-dimensional structures are provided which improve manufacturing yield for certain structures in semiconductor devices. The three-dimensional structures take into account the interaction between an upper layer and a lower layer where the lower layer has a tendency to form a non-planar surface due to its design. Accordingly, design changes are performed to make structures more likely to function, either by forming a more planar surface on the lower layer or by compensating in the upper layer for the lack of planarity. The changes to improve manufacturing yield are made at the design stage rather than at the fabrication stage.

Abstract: A method (300) and system (500) for optimizing a circuit layout based on layout constraints (308) and objectives (312). The method includes solving a linear program so as to obtain a rational solution whose variables are either whole or half integer. The tight constraints and objectives involving variables whose solution are a half integer are reduced to a 2-SAT problem, which is analyzed to determine its satisfiability. If the 2-SAT problem is not satisfiable, one or more objectives are removed so as to make the 2-SAT problem satisfiable. Any half-integer results of the linear program are rounded according to the truth assignment that satisfies the 2-SAT problem. The rounded results are used to create the circuit layout.

Abstract: A method and a system for improving manufacturing productivity of an integrated circuit. The method including: (a) generating a set of physical design rules, (b) assigning a rule scoring equation to each physical design rule of the set of physical design rules; (c) checking a physical design of the integrated circuit for deviations from each design rule; (d) computing a score for each physical design rule, using the corresponding rule scoring equation assigned to each physical design rule, for which one or more deviations were found in step (c); and (e) computing a productivity score for the integrated circuit design based on the scores computed in step (d).

Abstract: A method, system and program product that implements area minimization of a circuit design while respecting the explicit and implicit design constraints, in the form of ground rules and user intent. A longest path algorithm is used to generate a scaling factor. The scaling factor is used to reduce the size of the circuit design to the minimum legal size. The scaling may be followed by application of minpert analysis to correct any errors introduced by the scaling. The resulting design is shrunk (or expanded) with all elements shrinking (or growing) together by the same factor, and with the relative relationships of elements maintained. In addition, the invention is operational in the presence of a positive cycle, can be run with scaling that freezes the sizes of any structure or ground rule, and can be applied to technology migration.

Abstract: The invention provides a method and structure for optimizing placement of redundant vias within an integrated circuit design. The invention first locates target vias by determining which vias do not have a redundant via. Then, the invention draws marker shapes on or adjacent to the target vias. The marker shapes are only drawn in a horizontal or vertical direction from each of the target vias. Next, the invention simultaneously expands all of the marker shapes in the first direction to a predetermined length or until the marker shapes reach the limits of a ground rule. During the expanding, different marker shapes will be expanded to different lengths. The invention determines which of the marker shapes were expanded sufficiently to form a valid redundant via to produce a first set of potential redundant vias and the invention eliminates marker shapes that could not be expanded sufficiently to form a valid redundant via.

Abstract: The invention provides a method and structure for optimizing placement of redundant vias within an integrated circuit design. The invention first locates target vias by determining which vias do not have a redundant via. Then, the invention draws marker shapes on or adjacent to the target vias. The marker shapes are only drawn in a horizontal or vertical direction from each of the target vias. Next, the invention simultaneously expands all of the marker shapes in the first direction to a predetermined length or until the marker shapes reach the limits of a ground rule. During the expanding, different marker shapes will be expanded to different lengths. The invention determines which of the marker shapes were expanded sufficiently to form a valid redundant via to produce a first set of potential redundant vias and the invention eliminates marker shapes that could not be expanded sufficiently to form a valid redundant via.

Abstract: The invention provides a method and structure for optimizing placement of redundant vias within an integrated circuit design. The invention first locates target vias by determining which vias do not have a redundant via. Then, the invention draws marker shapes on or adjacent to the target vias. The marker shapes are only drawn in a horizontal or vertical direction from each of the target vias. Next, the invention simultaneously expands all of the marker shapes in the first direction to a predetermined length or until the marker shapes reach the limits of a ground rule. During the expanding, different marker shapes will be expanded to different lengths. The invention determines which of the marker shapes were expanded sufficiently to form a valid redundant via to produce a first set of potential redundant vias and the invention eliminates marker shapes that could not be expanded sufficiently to form a valid redundant via.

Abstract: A method for automatically wiring (i.e., routing) an integrated circuit chip after completing the placement of cells on the chip is described. The method employs a maze routing such that the spacing between the routed wires is increased, while at the same time maintaining control over the total wiring length. The maze routing herein described is modified to improve chip yield, reduce wiring capacitance, limit power consumption and coupled signal noise, all of which are achieved by increasing wire-to-wire spacings.