Abstract: The structure described herein incorporates an interconnect positioned between two spaced electrical contacts. The interconnect comprises a lead (Pb)-free solder alloy consisting essentially of nickel (Ni), tin (Sn), silver (Ag), and copper (Cu). The nickel (Ni) content is sufficient to produce a smooth interfacial IMC layer in an under bump metallurgy (UBM) when disposed between the two contacts. An embodiment of the structure described herein is a device comprising a substrate, an under bump metallurgy (UBM) disposed on the substrate, a bulk solder body disposed on the under bump metallurgy (UBM), and a wafer device connected to the under bump metallurgy (UBM) through the bulk solder body. The bulk solder body comprises of nickel (Ni), tin (Sn), silver (Ag), and copper (Cu). The nickel (Ni) is in a range of 0.01 to 0.20 percent by weight (wt %).

Abstract: A sectioned, roller type extensible and retractable enclosure for open bed vehicles employs a spring mechanism through which the slats of the cover are maintained in tension (in the direction of the length of the cover and away from the roll) during rotation of the stowage roller. As a result of this tension, the slats of the cover are effectively prevented from drooping as they are unwound from the roll and enter the guide channels, so that the unwanted bunching of the slats does not occur.