Abstract: Embodiments of the present disclosure relate to multi device pairing and sharing via non-touch gestures. In an embodiment, a method comprises detecting, by a parent device, an initiating non-touch gesture performed by a user towards the parent device. The method also comprises initiating an action based on the detecting. The method further comprises triggering, by the parent device, a gesture recognition mode on one or more secondary devices based on the detecting. And the method further comprises completing the action upon a positive gesture recognition by the one or more secondary devices.

Abstract: Methods and systems for indexing patent related prior art citations are disclosed. Electronic documents can be obtained from one or more patent information systems. An OCR process can be performed on some of the electronic documents. Citations within the documents can be identified and compared to a trusted records list. The citations can be associated with one or more predetermined categories. For example, citations can be categorized into groups such as when a reference is cited (e.g., with original filing, pre and post allowance), who provided the reference (e.g., cited by the applicant, or the examiner), and how the reference is characterized (e.g., statutory basis, combination of references). The citations and corresponding categories can be output to a user or made available for subsequent processing.

Abstract: Methods and systems for indexing patent related prior art citations are disclosed. Electronic documents can be obtained from one or more patent information systems. An OCR process can be performed on some of the electronic documents. Citations within the documents can be identified and compared to a trusted records list. The citations can be associated with one or more predetermined categories. For example, citations can be categorized into groups such as when a reference is cited (e.g., with original filing, pre and post allowance), who provided the reference (e.g., cited by the applicant, or the examiner), and how the reference is characterized (e.g., statutory basis, combination of references). The citations and corresponding categories can be output to a user or made available for subsequent processing.

Abstract: A method of directing a recipient of video content items employing a mobile device to at least one video content item of interest to the recipient comprises: storing a plurality of predetermined pattern identifiers and corresponding pattern data, the pattern identifiers and pattern data generated by reference to data predictive of recipient interest; detecting a predetermined pattern in at least one video content item by reference to the stored pattern data; and in response to the detection, transmitting an indication of the at least one video content item and the pattern identifier corresponding to the stored pattern data used to detect the predetermined pattern in the video content item to a plurality of mobile devices including the mobile device employed by the recipient, the indication directing the recipient to the video content item that is associated with the detected predetermined pattern that is of interest to the recipient.

Abstract: A method of directing a recipient of video content items employing a mobile device to at least one video content item of interest to the recipient comprises: storing a plurality of predetermined pattern identifiers and corresponding pattern data, the pattern identifiers and pattern data generated by reference to data predictive of recipient interest; detecting a predetermined pattern in at least one video content item by reference to the stored pattern data; and in response to the detection, transmitting an indication of the at least one video content item and the pattern identifier corresponding to the stored pattern data used to detect the predetermined pattern in the video content item to a plurality of mobile devices including the mobile device employed by the recipient, the indication directing the recipient to the video content item that is associated with the detected predetermined pattern that is of interest to the recipient.

Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.

Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.

Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.

Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.

Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.