Abstract: The I/O bracket retainer is a unitary structure that provides excellent EMI shielding without the requirement of an additional gasket layer. EMI leakage is minimized by providing an I/O bracket retainer surface. typically stainless steel, that conforms to the surface of the I/O bracket retainer and I/O panel, thus minimizing seams formed due to small differences in the planarities of the I/O bracket retainer and I/O panel. EMI leakage is further reduced by providing firm contact between the surfaces of the I/O bracket retainer and I/O panel to minimize seam formation between these parts. Firm contact is provided in part by a first positioning tab and spring finger which extend from a sidewall of the structure to the front panel of the I/O bracket retainer. The front panel of the I/O bracket retainer is designed for receiving and securing an I/O panel. The I/O panel is positioned between the first spring member and positioning tab of the I/O bracket which helps provide firm contact to the I/O panel.

Abstract: The I/O bracket retainer of the present invention is a unitary structure that provides excellent EMI shielding without the requirement of an additional gasket layer. EMI leakage is minimized by providing an I/O bracket retainer surface, typically stainless steel, that conforms to the surface of the I/O bracket retainer and I/O panel, thus minimizing seams formed due to small differences in the planarities of the I/O bracket retainer and I/O panel. EMI leakage is further reduced by providing firm contact between the surfaces of the I/O bracket retainer and I/O panel to minimize seam formation between these parts. Firm contact is provided in part by a first positioning tab and spring finger which extend from a sidewall of the structure to the front panel of the I/O bracket retainer. The front panel of the I/O bracket retainer is designed for receiving and securing an I/O panel.

Abstract: A processor retention assembly for housing multiple processor modules is herein disclosed. The processor retention assembly has a pair of lock levers, positioned on opposite sides of the processor module, that securely fastens each processor module to a connector on a circuit board and to the processor retention assembly. The lock levers ensure that the processor module is securely fastened to the connector and to the processor retention assembly so that the processor module and the circuit board are not damaged during mechanical shock and vibration. In addition, the lock levers eliminate the need for the processor module to contain any type of lock mechanism thereby allowing the processor retention assembly to house various types of devices, including those with lock mechanisms.

Abstract: A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.