Patents by Inventor Gyeong Ju SONG
Gyeong Ju SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11837404Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.Type: GrantFiled: January 18, 2023Date of Patent: December 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
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Publication number: 20230282422Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: ApplicationFiled: May 11, 2023Publication date: September 7, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Patent number: 11749460Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: GrantFiled: May 28, 2021Date of Patent: September 5, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Patent number: 11721481Abstract: An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A?B?0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.Type: GrantFiled: June 9, 2021Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
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Patent number: 11688561Abstract: An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames respectively including a pair of connected portions connected to the pair of external electrodes, respectively, and a pair of mounted portions bent at and extending from one ends of the pair of connected portions, respectively, wherein corners of end portions of the pair of mounted portions facing each other have a curved surface.Type: GrantFiled: May 20, 2021Date of Patent: June 27, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Heon Lee, Beom Joon Cho, Gyeong Ju Song
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Publication number: 20230178304Abstract: An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, a frame terminal disposed on the external electrode, and a conductive bonding portion disposed between the external electrode and the frame terminal. The frame terminal has a groove portion extending along an outer periphery of an area in contact with the conductive bonding portion.Type: ApplicationFiled: October 28, 2022Publication date: June 8, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beomjoon Cho, Younghun Lee, Jihong Jo, Seungmin Ahn
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Publication number: 20230178299Abstract: An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, and a frame terminal having a supporting portion disposed on the external electrode, and a mounting portion disposed at one end of the supporting portion. The supporting portion has a concave portion spaced apart from the mounting portion and having a distance to the mounting portion less than a distance from the capacitor boy to the mounting portion.Type: ApplicationFiled: November 3, 2022Publication date: June 8, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Younghun Lee, Beomjoon Cho, Gyeong Ju Song, Won Young Jang, Jihong Jo
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Publication number: 20230154677Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.Type: ApplicationFiled: January 18, 2023Publication date: May 18, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
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Patent number: 11587729Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.Type: GrantFiled: September 8, 2021Date of Patent: February 21, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
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Patent number: 11393624Abstract: A board having an electronic component mounted thereon includes a capacitor body; a pair of external electrodes disposed on both ends of the capacitor body, respectively; a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions each having a protrusion on a lower side thereof, respectively; a board; and a pair of electrode pads disposed on an upper surface of the board and connected to the pair of metal frames, respectively, and each having a groove portion corresponding to the protrusion on an upper surface thereof.Type: GrantFiled: May 3, 2021Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beom Joon Cho, Sang Yeop Kim
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Publication number: 20220181078Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.Type: ApplicationFiled: September 8, 2021Publication date: June 9, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
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Publication number: 20220130614Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: ApplicationFiled: May 28, 2021Publication date: April 28, 2022Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Publication number: 20220122772Abstract: An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A?B?0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.Type: ApplicationFiled: June 9, 2021Publication date: April 21, 2022Inventors: Sang Yeop KIM, Beom Joon CHO, Gyeong Ju SONG
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Publication number: 20220093328Abstract: A board having an electronic component mounted thereon includes a capacitor body; a pair of external electrodes disposed on both ends of the capacitor body, respectively; a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions each having a protrusion on a lower side thereof, respectively; a board; and a pair of electrode pads disposed on an upper surface of the board and connected to the pair of metal frames, respectively, and each having a groove portion corresponding to the protrusion on an upper surface thereof.Type: ApplicationFiled: May 3, 2021Publication date: March 24, 2022Inventors: Gyeong Ju SONG, Beom Joon CHO, Sang Yeop KIM
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Publication number: 20220093338Abstract: An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames respectively including a pair of connected portions connected to the pair of external electrodes, respectively, and a pair of mounted portions bent at and extending from one ends of the pair of connected portions, respectively, wherein corners of end portions of the pair of mounted portions facing each other have a curved surface.Type: ApplicationFiled: May 20, 2021Publication date: March 24, 2022Inventors: Young Heon Lee, Beom Joon Cho, Gyeong Ju Song