Patents by Inventor Gyung Hwan OH
Gyung Hwan OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11912120Abstract: A battery mounting structure for a vehicle is provided to include a case having a first internal member that is disposed to be spaced parallel to an upper side of a lower panel of the case and a second internal member that is disposed perpendicular to the first internal member, and configured to accommodate a plurality of battery modules therein using the first internal member and the second internal member. An outer side member is provided in a shape protruding toward the outside on an outer side of the case. The battery modules are disposed in a stacking direction of battery cells that is parallel to a longitudinal direction of the first internal member.Type: GrantFiled: September 22, 2020Date of Patent: February 27, 2024Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Yong Hwan Choi, Yu Ri Oh, Tae Hyuck Kim, Gyung Hoon Shin, Hae Kyu Lim, Ji Woong Jung
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Patent number: 11781981Abstract: According to an embodiment of a specimen inspection apparatus, the specimen inspection apparatus may comprise: a radiation unit; a reflection unit; a focus adjusting unit; a reception unit; and a control unit. The specimen inspection apparatus may comprise: a radiation unit for emitting a terahertz wave; a reflection unit for changing the path of a terahertz wave emitted from the radiation unit; a focus adjusting unit for forming an irradiation region on a specimen according to the path of the terahertz wave; a reception unit for receiving individual terahertz waves obtained by reflection, by the specimen, of the terahertz wave irradiated onto the first region; and a control unit for controlling the distance between at least two elements among the plurality of elements, and detecting whether the specimen is defective, according to the reflectivity difference between the terahertz waves.Type: GrantFiled: October 1, 2019Date of Patent: October 10, 2023Assignee: ACTRO CO., LTD.Inventors: Hak Sung Kim, Gyung Hwan Oh, Dong Woon Park
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Patent number: 11486822Abstract: According to one embodiment of the present invention, A sample inspection device may provided, a total inspection module scanning a first area comprising a plurality of samples; a precision inspection module performing inspection on a sample determined as a suspected defective sample by the total inspection module in the first area; and a controller processing each data obtained from the total inspection module and the precision inspection module, and detecting a defective sample in the first area, wherein the precision inspection module may include an emitter emitting terahertz wave to the first area, a guide wire guiding an irradiation direction of the terahertz wave, and a vibration unit vibrating the guide wire.Type: GrantFiled: July 24, 2019Date of Patent: November 1, 2022Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)Inventors: Hak Sung Kim, Gyung Hwan Oh, Dong Woon Park
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Publication number: 20220316860Abstract: A thickness measuring device of the present invention includes a supporter which supports a specimen, an emission unit which emits an electromagnetic wave in a direction toward the specimen, a chamber which surrounds the specimen, a receiving unit which receives an electromagnetic wave output in a direction in which the chamber is positioned, and a control unit which receives a signal from the receiving unit and calculates a thickness of the specimen. At least a part of the chamber transmits a part of the electromagnetic wave and reflects the remaining part of the electromagnetic wave. The receiving unit receives a first electromagnetic wave having a first peak and a second electromagnetic wave having a second peak. The first peak occurs at a first time point, the second peak occurs at a second time point, and a difference between the first time point and the second time point is a first period or more.Type: ApplicationFiled: April 21, 2020Publication date: October 6, 2022Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)Inventors: Hak Sung KIM, Gyung Hwan OH, Dong Woon PARK, Heon Su KIM
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Publication number: 20220268568Abstract: According to an aspect of the invention, a thickness measuring device comprising: an emission unit emitting an electromagnetic wave toward a specimen, a reception unit receiving an electromagnetic wave output from a direction in which the specimen is positioned; and a control unit calculating a thickness of the specimen by receiving a signal from the reception unit, wherein when the specimen has a first thickness, the reception unit receives a first electromagnetic wave, and when the specimen has a second thickness, the reception unit receives a second electromagnetic wave, wherein the first electromagnetic wave has a first peak value at a first time point, and the second electromagnetic wave has a second peak value at a second time point, and wherein when the first thickness is greater than the second thickness, the first peak value is smaller than the second peak value, may be provided.Type: ApplicationFiled: July 20, 2020Publication date: August 25, 2022Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITYInventors: Hak Sung KIM, Dong Woon PARK, Gyung Hwan OH, Heon Su KIM
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Patent number: 11346659Abstract: A method for measuring the thickness of a specimen, according to an embodiment, can measure the thickness of a specimen having multiple layers in a contactless and non-destructive manner. In addition, when the refractive indexes of materials forming the respective layers are already known, the thicknesses of the respective layers can be integrally measured through differences in reflection times of terahertz waves with respect to the respective layers of the specimen, thereby measuring the thickness of the specimen, such that the time taken for measuring the thickness of the specimen can be reduced.Type: GrantFiled: March 1, 2021Date of Patent: May 31, 2022Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITYInventors: Hak Sung Kim, Gyung Hwan Oh, Dong Woon Park
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Publication number: 20210389238Abstract: According to an embodiment of a specimen inspection apparatus, the specimen inspection apparatus may comprise: a radiation unit; a reflection unit; a focus adjusting unit; a reception unit; and a control unit. The specimen inspection apparatus may comprise: a radiation unit for emitting a terahertz wave; a reflection unit for changing the path of a terahertz wave emitted from the radiation unit; a focus adjusting unit for forming an irradiation region on a specimen according to the path of the terahertz wave; a reception unit for receiving individual terahertz waves obtained by reflection, by the specimen, of the terahertz wave irradiated onto the first region; and a control unit for controlling the distance between at least two elements among the plurality of elements, and detecting whether the specimen is defective, according to the reflectivity difference between the terahertz waves.Type: ApplicationFiled: October 1, 2019Publication date: December 16, 2021Applicant: Industry-University Cooperation Foundation Hanyang UniversityInventors: Hak Sung KIM, Gyung Hwan OH, Dong Woon PARK
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Patent number: 11150080Abstract: A thickness measuring device is provided. The thickness measuring device may include a terahertz wave signal processing unit configured to receive a terahertz wave according to at least one mode of a reflection mode and a transmission mode, a refractive index information acquisition unit configured to acquire refractive index information of the thickness measurement sample in consideration of second-time difference information between a first reflected terahertz wave and a second reflected terahertz wave, and a thickness information acquisition unit configured to acquire thickness information of the thickness measurement sample in consideration of the refractive index information.Type: GrantFiled: March 30, 2018Date of Patent: October 19, 2021Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)Inventors: Hak-Sung Kim, Gyung Hwan Oh, Deok Joong Kim, Dong Woon Park
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Publication number: 20210310943Abstract: According to one embodiment of the present invention, A sample inspection device may provided, a total inspection module scanning a first area comprising a plurality of samples; a precision inspection module performing inspection on a sample determined as a suspected defective sample by the total inspection module in the first area; and a controller processing each data obtained from the total inspection module and the precision inspection module, and detecting a defective sample in the first area, wherein the precision inspection module may include an emitter emitting terahertz wave to the first area, a guide wire guiding an irradiation direction of the terahertz wave, and a vibration unit vibrating the guide wire.Type: ApplicationFiled: July 24, 2019Publication date: October 7, 2021Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITYInventors: Hak Sung KIM, Gyung Hwan OH, Dong Woon PARK
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Publication number: 20210180946Abstract: A method for measuring the thickness of a specimen, according to an embodiment, can measure the thickness of a specimen having multiple layers in a contactless and non-destructive manner. In addition, when the refractive indexes of materials forming the respective layers are already known, the thicknesses of the respective layers can be integrally measured through differences in reflection times of terahertz waves with respect to the respective layers of the specimen, thereby measuring the thickness of the specimen, such that the time taken for measuring the thickness of the specimen can be reduced.Type: ApplicationFiled: March 1, 2021Publication date: June 17, 2021Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITYInventors: Hak Sung KIM, Gyung Hwan OH, Dong Woon PARK
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Publication number: 20200116473Abstract: A thickness measuring device is provided. The thickness measuring device may include a terahertz wave signal processing unit configured to receive a terahertz wave according to at least one mode of a reflection mode and a transmission mode, a refractive index information acquisition unit configured to acquire refractive index information of the thickness measurement sample in consideration of second-time difference information between a first reflected terahertz wave and a second reflected terahertz wave, and a thickness information acquisition unit configured to acquire thickness information of the thickness measurement sample in consideration of the refractive index information.Type: ApplicationFiled: March 30, 2018Publication date: April 16, 2020Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)Inventors: Hak-Sung KIM, Gyung Hwan OH, Deok Joong KIM, Dong Woon PARK
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Publication number: 20200061704Abstract: Provided is a method for manufacturing photonic sintering particles. According to an embodiment, the method includes: preparing nano particles; and forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles.Type: ApplicationFiled: October 18, 2019Publication date: February 27, 2020Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)Inventors: Hak-Sung KIM, Hyun-Jun HWANG, Gyung Hwan OH, Deok Joong KIM