Patents by Inventor Ha Il SONG

Ha Il SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11394099
    Abstract: According to one aspect of the invention, there is provided a connector for connecting a waveguide and a board, comprising: a first opening part formed in a direction perpendicular to one side of a board and coupled to the one side of the board; a second opening part formed in a direction parallel to a longitudinal direction of a waveguide for signal transmission, wherein the waveguide is capable of being coupled to the second opening part; and a signal guide part connecting the first and second opening parts and including a hollowness surrounded by a conductive layer therein.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 19, 2022
    Assignee: Korea Advanced Institute Of Science And Technology
    Inventors: Hyeon Min Bae, Ha Il Song
  • Patent number: 11394098
    Abstract: According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a first dielectric part comprising a dielectric; a conductor part covering a part of the first dielectric part; and a second dielectric part surrounding the first dielectric part and the conductor part.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 19, 2022
    Assignee: Korea Advanced Institute Of Science And Technology
    Inventors: Hyeon Min Bae, Ha Il Song
  • Patent number: 11289788
    Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: March 29, 2022
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Huxian Jin
  • Publication number: 20210013575
    Abstract: According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a first dielectric part comprising a dielectric; a conductor part covering a part of the first dielectric part; and a second dielectric part surrounding the first dielectric part and the conductor part.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: Korea Advanced Institute Of Science And Technology
    Inventors: Hyeon Min BAE, Ha Il SONG
  • Publication number: 20210013577
    Abstract: According to one aspect of the invention, there is provided a connector for connecting a waveguide and a board, comprising: a first opening part formed in a direction perpendicular to one side of a board and coupled to the one side of the board; a second opening part formed in a direction parallel to a longitudinal direction of a waveguide for signal transmission, wherein the waveguide is capable of being coupled to the second opening part; and a signal guide part connecting the first and second opening parts and including a hollowness surrounded by a conductive layer therein.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: Korea Advanced Institute Of Science And Technology
    Inventors: Hyeon Min BAE, Ha Il SONG
  • Patent number: 10777865
    Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band is transmitted through the dielectric part, and a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 15, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Joon Yeong Lee, Tae Hoon Yoon, Hyo Sup Won
  • Patent number: 10777868
    Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part comprising two or more dielectrics having different permittivity; and a conductor part surrounding at least a part of the dielectric part.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 15, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Joon Yeong Lee, Tae Hoon Yoon, Hyo Sup Won
  • Patent number: 10770774
    Abstract: The present invention relates to a microstrip-waveguide transition for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a microstrip-waveguide transition for transmission of electromagnetic wave signals, comprising: a feeding part for providing an electromagnetic wave signal to be transmitted through the waveguide; and a ground part formed at a predetermined interval from the feeding part, wherein the microstrip and the waveguide are coupled alongside each other along a length direction of the waveguide, and wherein a distance between the feeding part and the ground part in a direction perpendicular to the length direction of the waveguide is greater as it is closer to the waveguide.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 8, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Joon Yeong Lee, Tae Hoon Yoon, Hyo Sup Won
  • Patent number: 10686241
    Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: June 16, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha Il Song, Huxian Jin
  • Publication number: 20190103647
    Abstract: The present invention relates to a microstrip-waveguide transition for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a microstrip-waveguide transition for transmission of electromagnetic wave signals, comprising: a feeding part for providing an electromagnetic wave signal to be transmitted through the waveguide; and a ground part formed at a predetermined interval from the feeding part, wherein the microstrip and the waveguide are coupled alongside each other along a length direction of the waveguide, and wherein a distance between the feeding part and the ground part in a direction perpendicular to the length direction of the waveguide is greater as it is closer to the waveguide.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 4, 2019
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min BAE, Ha Il SONG, Joon Yeong LEE, Tae Hoon YOON, Hyo Sup WON
  • Publication number: 20190067776
    Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band being a relatively higher frequency band is transmitted through the dielectric part, and a signal of a second frequency band being a relatively lower frequency band is transmitted through the conductor part.
    Type: Application
    Filed: September 28, 2018
    Publication date: February 28, 2019
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min BAE, Ha Il SONG, Joon Yeong LEE, Tae Hoon YOON, Hyo Sup WON
  • Publication number: 20190067775
    Abstract: The present invention relates to a waveguide for transmission of electromagnetic wave signals. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part comprising two or more dielectrics having different permittivity; and a conductor part surrounding at least a part of the dielectric part.
    Type: Application
    Filed: September 28, 2018
    Publication date: February 28, 2019
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min BAE, Ha Il SONG, Joon Yeong LEE, Tae Hoon YOON, Hyo Sup WON
  • Publication number: 20180131084
    Abstract: Disclosed is a printed circuit board (PCB) structure, in which an electromagnetic signal transmitting antenna and/or an electromagnetic signal receiving antenna, and an electromagnetic signal transferring tunnel (EM-tunnel) are embedded, the PCB structure including a PCB, an EM-tunnel that includes a dielectric core and a metal clad that surrounds the dielectric core and that is embedded in the PCB to be parallel to the PCB, and at least one transmitting antenna and/or at least one receiving antenna that are embedded in the PCB, wherein the transmitting antenna and/or the receiving antenna are arranged at an input port and an output port of the EM-tunnel embedded in the PCB to transmit and receive electromagnetic signals to and from the interior of the EM-tunnel.
    Type: Application
    Filed: December 8, 2016
    Publication date: May 10, 2018
    Inventors: Hyo-Hoon PARK, Hyeon Min BAE, Ha Il SONG, Dae-Seong LEE, Harin LEE
  • Patent number: 9093732
    Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: July 28, 2015
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Hyeon Min Bae, Ha Il Song, Huxian Jin
  • Publication number: 20140184351
    Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
    Type: Application
    Filed: December 11, 2013
    Publication date: July 3, 2014
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Hyeon Min BAE, Ha Il SONG, Huxian JIN