Patents by Inventor Ha Young AHN
Ha Young AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230268266Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer, and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. At least a portion of a first wall of a first trench of the first insulating layer and at least a portion of a second wall of a second trench of the second insulating layer overlap each other vertically.Type: ApplicationFiled: March 20, 2023Publication date: August 24, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Patent number: 11626364Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: GrantFiled: December 7, 2020Date of Patent: April 11, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Publication number: 20210118791Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: ApplicationFiled: December 7, 2020Publication date: April 22, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Patent number: 10861784Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: GrantFiled: May 27, 2020Date of Patent: December 8, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Publication number: 20200294904Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: ApplicationFiled: May 27, 2020Publication date: September 17, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho KIM, Ji Hoon KIM, Ha Young AHN, Shang Hoon SEO, Seung Yeop KOOK, Sung Won JEONG
-
Patent number: 10679933Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: GrantFiled: October 10, 2019Date of Patent: June 9, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Publication number: 20200043842Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: ApplicationFiled: October 10, 2019Publication date: February 6, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho KIM, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Patent number: 10446481Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: GrantFiled: July 18, 2018Date of Patent: October 15, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Publication number: 20180342452Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: ApplicationFiled: July 18, 2018Publication date: November 29, 2018Inventors: Sun Ho KIM, Ji Hoon KIM, Ha Young AHN, Shang Hoon SEO, Seung Yeop KOOK, Sung Won JEONG
-
Patent number: 10128179Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: GrantFiled: October 27, 2016Date of Patent: November 13, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook, Sung Won Jeong
-
Patent number: 10115648Abstract: A fan-out semiconductor package and an electronic device including the same are provided. The fan-out semiconductor package includes a semiconductor chip; an interconnection member electrically connected to the semiconductor chip and having a connection terminal pad; and a passivation layer disposed at one side of the interconnection member and having an opening part opening a portion of the connection terminal pad. Distances from a center of the connection terminal pad to at least two points of an edge thereof are different from each other.Type: GrantFiled: November 3, 2016Date of Patent: October 30, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Shang Hoon Seo, Seung Yeop Kook, Ha Young Ahn, Sung Won Jeong, Young Gwan Ko
-
Patent number: 9929117Abstract: An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.Type: GrantFiled: August 7, 2017Date of Patent: March 27, 2018Assignee: SAMSUNG ELECTRO-MACHANICS CO., LTD.Inventors: Ji Hyun Lee, Sung Won Jeong, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook
-
Patent number: 9859243Abstract: An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.Type: GrantFiled: June 15, 2016Date of Patent: January 2, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji Hyun Lee, Sung Won Jeong, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook
-
Publication number: 20170358548Abstract: An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.Type: ApplicationFiled: August 7, 2017Publication date: December 14, 2017Inventors: Ji Hyun LEE, Sung Won JEONG, Ha Young AHN, Shang Hoon SEO, Seung Yeop KOOK
-
Patent number: 9831203Abstract: An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.Type: GrantFiled: June 15, 2016Date of Patent: November 28, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji Hyun Lee, Sung Won Jeong, Ha Young Ahn, Shang Hoon Seo, Seung Yeop Kook
-
Publication number: 20170148699Abstract: A fan-out semiconductor package and an electronic device including the same are provided. The fan-out semiconductor package includes a semiconductor chip; an interconnection member electrically connected to the semiconductor chip and having a connection terminal pad; and a passivation layer disposed at one side of the interconnection member and having an opening part opening a portion of the connection terminal pad. Distances from a center of the connection terminal pad to at least two points of an edge thereof are different from each other.Type: ApplicationFiled: November 3, 2016Publication date: May 25, 2017Inventors: Shang Hoon SEO, Seung Yeop KOOK, Ha Young AHN, Sung Won JEONG, Young Gwan KO
-
Publication number: 20170141063Abstract: An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in the openings of the passivation layer and connected to the terminal connection pads. At least one of the openings of the passivation layer has a plurality of protrusion parts.Type: ApplicationFiled: June 15, 2016Publication date: May 18, 2017Inventors: Ji Hyun LEE, Sung Won JEONG, Ha Young AHN, Shang Hoon SEO, Seung Yeop KOOK
-
Publication number: 20170133309Abstract: A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer and a first via connecting the first and second pads to each other; a semiconductor chip disposed on the interconnection member; and an encapsulant encapsulating at least portions of the semiconductor chip. A center line of the first via is out of alignment with at least one of a center line of the first pad and a center line of the second pad.Type: ApplicationFiled: October 27, 2016Publication date: May 11, 2017Inventors: Sun Ho KIM, Ji Hoon KIM, Ha Young AHN, Shang Hoon SEO, Seung Yeop KOOK, Sung Won JEONG