Abstract: A liquid cooled light pipe is disclosed which allows effective pyrometric temperature measurements using a remote detector. Temperature of the light pipe assembly is controlled and maintained at an approximately constant value in order to establish good long-term temperature measurement accuracy. The temperature-controlled light pipe assembly of this invention can be used for multi-point temperature measurements of a heated body with good spatial resolution for real-time multi-zone temperature control applications.

Abstract: A method for calibrating at least one temperature sensor. A wafer (30) having calibration structures of a material having a melting point in the range of 150.degree. to 1150.degree. C. is provided. The temperature sensor is operable to detect a temperature dependent characteristic of the wafer and output a signal corresponding to the temperature depending characteristic. The power input is selectively varied and the wafer temperature is ramped for a calibration run. A wafer characteristic, such as wafer reflectance, radiance, or emissivity, is monitored. A first step change in the wafer characteristic corresponding to a wafer temperature equal to the melting point of the calibration structures is detected and a set of calibration parameters for each temperature sensor being calibrated is calculated.

Abstract: A device and method for calibrating at least one temperature sensor is disclosed herein. A wafer (30) is provided having a first plurality of calibration islands (36) of a material having a melting point in the range 150.degree.-1150.degree. C. The effective reflectivity of the wafer is measured in operation using the temperature sensor or via a separate light source. A first step change in an output signal of the temperature sensor corresponding to a wafer temperature equal to the melting point of the first calibration islands is detected. Finally, the temperature sensor calibration parameters are calculated.

Abstract: A coupling device (10) provides sealing members (24), (26), preferably Indium wire O-rings (72), (74), suitable for sealing engagement with an insulating member (28) under cryogenic, high-pressure conditions. Coupling device (10) is designed to couple a first metal pipe attached to a first adapter (12), and a second metal pipe attached to a second adapter (14), so that fluid may be conveyed via bore (36), chamber (84), and bore (48) under such cryogenic high-pressure conditions. According to the invention, the coupling device (10) provides effective sealing under these extreme conditions while also providing thermal and electrical insulation due to the advantageous construction featuring insulating member (28), first collar member (20) and second collar member (22).