Abstract: A cooling device comprises a first casing for direct mounting on a heat-generating component and a second casing mounted on the first casing. One casing includes an internal channel connected to a cold inlet and to a hot outlet allowing a heat-transfer fluid to flow in the internal channel. The other casing includes a storage containing a phase change material (PCM) changing from a solid state to a liquid state to transfer thermal energy from the heat-generating unit to the PCM, the PCM changing from the liquid state to the solid state to transfer thermal energy from the PCM to the heat-transfer fluid. The cooling device may be integrated in a cooling circuit of a cooling system including an external cooling unit, or in a closed loop cooling circuit of a cooling arrangement that transfers heat from the closed loop to an open loop.

Abstract: A heat exchanger assembly includes a heat exchanger panel disposed at an inclined orientation. A fan assembly is disposed vertically above the heat exchanger panel and includes a fan impeller connected to a fan mount. The fan impeller is sized and positioned such that part of the fan impeller rotates vertically above the upper end of the heat exchanger panel. A casing has a plurality of inner walls for guiding air from the heat exchanger panel toward the fan assembly. The inner walls include a sloped wall. A distance between an upper end of the sloped wall and a fan rotation axis is greater than a distance between a lower end of the sloped wall and the fan rotation axis. The sloped wall is adjacent to the upper end of the heat exchanger panel such that the part of the fan impeller rotates vertically above the sloped wall.

Abstract: A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

Abstract: An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

Abstract: A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.

Abstract: A cooling device comprises a first casing for direct mounting on a heat-generating component and a second casing mounted on the first casing. One casing includes an internal channel connected to a cold inlet and to a hot outlet allowing a heat-transfer fluid to flow in the internal channel. The other casing includes a storage containing a phase change material (PCM) changing from a solid state to a liquid state to transfer thermal energy from the heat-generating unit to the PCM, the PCM changing from the liquid state to the solid state to transfer thermal energy from the PCM to the heat-transfer fluid. The cooling device may be integrated in a cooling circuit of a cooling system including an external cooling unit, or in a closed loop cooling circuit of a cooling arrangement that transfers heat from the closed loop to an open loop.

Abstract: A thermal transfer device has a body and a fluid conduit defined in the body. The body has a thermal transfer surface configured to be placed in contact with a target component. The fluid conduit is configured for conveying fluid through the body and is thermally coupled to the thermal transfer surface.

Abstract: A heat exchanger assembly includes a heat exchanger panel disposed at an inclined orientation. A fan assembly is disposed vertically above the heat exchanger panel and includes a fan impeller connected to a fan mount. The fan impeller is sized and positioned such that part of the fan impeller rotates vertically above the upper end of the heat exchanger panel. A casing has a plurality of inner walls for guiding air from the heat exchanger panel toward the fan assembly. The inner walls include a sloped wall. A distance between an upper end of the sloped wall and a fan rotation axis is greater than a distance between a lower end of the sloped wall and the fan rotation axis. The sloped wall is adjacent to the upper end of the heat exchanger panel such that the part of the fan impeller rotates vertically above the sloped wall.

Abstract: A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

Abstract: A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

Abstract: A heat exchanger assembly includes: a frame; a heat exchanger panel mounted to the frame and configured to exchange heat with air flowing therethrough, the heat exchanger panel being disposed at an inclined orientation; a fan assembly disposed vertically above the heat exchanger panel; and a sound dampening device disposed within an interior space of the heat exchanger assembly such that air is pulled into the interior space through the heat exchanger panel and then flows through the sound dampening device before being discharged from the heat exchanger assembly via the fan assembly. The sound dampening device includes baffle members having sound absorbing material and spaced apart from one another for allowing air flow therebetween. Each baffle member extends at an angle relative to a plane extending through the upper and lower ends of the heat exchanger panel so as to direct air flow upwardly toward the fan assembly.

Abstract: A cooling arrangement for a server mountable in a server rack comprises a phase change device and a fluid cooling unit. The phase change device includes an evaporator mountable on a heat-generating unit of the server, a condenser disposed outside of the server, and conduits extending laterally from the server, between the evaporator and the condenser. The conduits carry a working fluid heated in the evaporator to the condenser. The working fluid is cooled in the condenser before returning to the evaporator. The fluid cooling unit is positioned along the server rack and receives a cooling fluid from an external cooling facility. A heat transfer module of the fluid cooling unit has an open channel for slidably receiving the condenser. The cooling fluid flows in a water jacket surrounding the open channel. Heat is transferred from the condenser to the cooling fluid flowing in the water jacket.

Abstract: A water block assembly includes first and second water block units having respective first and second fluid conduits. The second water block unit is stacked on the first water block unit. The second fluid conduit operates either in parallel with the first fluid conduit or fluidly independent therefrom, such that cooled fluid is fed to the first and second fluid conduits. The first water block unit includes a first base portion and a first cover portion disposed on and affixed to the first base portion. The first cover portion defines a first fluid inlet and a first fluid outlet of the first fluid conduit. The second water block unit includes a second base portion and a second cover portion disposed on and affixed to the second base portion. The second cover portion defines a second fluid inlet and a second fluid outlet of the second fluid conduit.

Abstract: A thermal transfer device has a body and a fluid conduit defined in the body. The body has a thermal transfer surface configured to be placed in contact with a target component. The fluid conduit is configured for conveying fluid through the body and is thermally coupled to the thermal transfer surface. The fluid conduit is configured so that: at a first junction, the fluid conduit branches into a first channel and a second channel which extend adjacent and generally parallel to one another along an initial portion of the fluid conduit; the first and second channels diverge away from one another at an end of the initial portion such that each of the first and second channels forms a serpentine path; and the first and second channels merge at a second junction. The serpentine paths formed by the first and second channels extend toward generally opposite directions.