Patents by Inventor Hae Gu Lee
Hae Gu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11996574Abstract: A battery sub-packing unit includes at least one battery cell; and a case accommodating the at least one battery cell, wherein the case comprises an end panel on which an electrode tab of the at least one battery cell is fastened to extend into an external space, and having a lower end portion in which a sub-vent hole is formed for communication between the external space and an internal space in which the at least one battery cell is disposed.Type: GrantFiled: November 30, 2021Date of Patent: May 28, 2024Assignee: SK ON CO., LTD.Inventors: Hae Ryong Jeon, Yang Kyu Choi, Tae Il Kim, Kang Gu Lee
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Publication number: 20240170266Abstract: The present invention provides a component for a semiconductor device fabrication apparatus, a semiconductor device fabrication apparatus including the same, and a method of fabricating a semiconductor device, wherein the component includes single-crystal silicon, wherein, on at least one surface thereof, a water contact angle is 45° to 74° and a diiodomethane contact angle is 41° to 57°.Type: ApplicationFiled: November 17, 2023Publication date: May 23, 2024Inventors: Hyun Soo LEE, Hae Mi KANG, Do Hyun CHOI, Il Gu YONG, Jong Kyu LEE, Ho Geun HAN, Ju Young SONG
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Publication number: 20240136674Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.Type: ApplicationFiled: January 19, 2022Publication date: April 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
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Publication number: 20240128517Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.Type: ApplicationFiled: January 19, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
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Patent number: 11936022Abstract: A battery module includes at least one cell group, and a heat dissipating member coupled to one side of the at least one cell group to externally dissipate heat generated in the at least one cell group, wherein the at least one cell group includes at least one battery cell stack, a flame retardant cover coupled to the battery cell stack to encase both side surfaces and an upper portion of the battery cell stack, and a flame retardant member disposed between an upper surface of the battery cell stack and the flame retardant cover and formed of a porous material.Type: GrantFiled: August 12, 2021Date of Patent: March 19, 2024Assignee: SK ON CO., LTD.Inventors: Hae Ryong Jeon, Ho Yeon Kim, Kang Gu Lee, Seo Roh Rhee
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Patent number: 11004754Abstract: A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.Type: GrantFiled: November 14, 2019Date of Patent: May 11, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin-Yeol Yang, Hyung-Su Son, Hae-Gu Lee, Dong-Su Han
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Patent number: 10950480Abstract: An adhesive tape sticking apparatus includes a chamber includes a lower chamber and an upper chamber. The lower chamber includes a first inner space and the upper chamber includes a second inner space. An adhesive tape sheet is positioned between the upper chamber and the lower chamber. A substrate support is movable upward and downward within the lower chamber and is configured to support a substrate. A differential pressure generator is configured to generate a differential pressure between the first inner space and the second inner space. A tape support plate positioned between a first sidewall of the lower chamber and a circumferential edge of the substrate. The tape support plate is configured to contact at least a portion of the adhesive tape sheet when the adhesive tape sheet bends downward toward the first inner space when the differential pressure is generated between the first and second inner spaces.Type: GrantFiled: February 27, 2017Date of Patent: March 16, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-Min Kim, Joo-Hyung Lee, Hae-Gu Lee
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Publication number: 20200083124Abstract: A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.Type: ApplicationFiled: November 14, 2019Publication date: March 12, 2020Inventors: Jin-Yeol YANG, Hyung-Su SON, Hae-Gu LEE, Dong-Su HAN
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Patent number: 10504804Abstract: A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.Type: GrantFiled: July 19, 2018Date of Patent: December 10, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin-Yeol Yang, Hyung-Su Son, Hae-Gu Lee, Dong-Su Han
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Publication number: 20190131193Abstract: A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.Type: ApplicationFiled: July 19, 2018Publication date: May 2, 2019Inventors: Jin-Yeol YANG, Hyung-Su SON, Hae-Gu LEE, Dong-Su HAN
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Publication number: 20180019152Abstract: An adhesive tape sticking apparatus includes a chamber includes a lower chamber and an upper chamber. The lower chamber includes a first inner space and the upper chamber includes a second inner space. An adhesive tape sheet is positioned between the upper chamber and the lower chamber. A substrate support is movable upward and downward within the lower chamber and is configured to support a substrate. A differential pressure generator is configured to generate a differential pressure between the first inner space and the second inner space. A tape support plate positioned between a first sidewall of the lower chamber and a circumferential edge of the substrate. The tape support plate is configured to contact at least a portion of the adhesive tape sheet when the adhesive tape sheet bends downward toward the first inner space when the differential pressure is generated between the first and second inner spaces.Type: ApplicationFiled: February 27, 2017Publication date: January 18, 2018Inventors: YOUNG-MIN KIM, JOO-HYUNG LEE, HAE-GU LEE
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Patent number: 9665122Abstract: A semiconductor package includes a printed circuit board (PCB), a chip bonded to the PCB, a mold protecting the chip and exposing a backside surface of the chip, via openings extending in the mold to expose first contacts bonded to the PCB, and at least one first marking inscribed in a marking region of the mold between the backside surface of the chip and the vias. The mold has an exposed molded underfill (eMUF) structure covering the sides of the chip while exposing the backside surface of the chip. A PoP package includes a top package stacked on and electrically connected to the semiconductor package.Type: GrantFiled: September 4, 2015Date of Patent: May 30, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Heung Kyu Kwon, Hae Gu Lee, Byeong Yeon Cho
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Publication number: 20160099205Abstract: A semiconductor package includes a printed circuit board (PCB), a chip bonded to the PCB, a mold protecting the chip and exposing a backside surface of the chip, via openings extending in the mold to expose first contacts bonded to the PCB, and at least one first marking inscribed in a marking region of the mold between the backside surface of the chip and the vias. The mold has an exposed molded underfill (eMUF) structure covering the sides of the chip while exposing the backside surface of the chip. A PoP package includes a top package stacked on and electrically connected to the semiconductor package.Type: ApplicationFiled: September 4, 2015Publication date: April 7, 2016Inventors: HEUNG KYU KWON, HAE GU LEE, BYEONG YEON CHO
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Publication number: 20160005654Abstract: Provided are a system and method for manufacturing a semiconductor package. The system includes: a laser marker configured to irradiate a first laser beam on a strip to make a mark on the strip; and a laser saw configured to irradiate a second laser beam on the strip to cut the strip into individual semiconductor packages.Type: ApplicationFiled: March 3, 2015Publication date: January 7, 2016Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yoon-Seok SONG, Jun-Young KO, Hae-Gu LEE
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Publication number: 20120141488Abstract: Disclosed are novel GPCR (G Protein Coupled Receptor) proteins and genes encoding the same. Also provided is the use of the proteins and the genes. Particularly, contemplated are a novel GPCR (G Protein Coupled Receptor) polypeptide, a polynucleotide coding for the same, a recombinant vector carrying the polynucleotide or a fragment thereof, host cells transformed with the vector, a transgenic animal infected with the vector. Also, a composition for detecting a cancer marker, comprising an agent capable of measuring the expression level of mRNA or protein of the GPCR polynucleotide, a kit for the diagnosis of cancer, comprising the composition, and a method for detecting the GPCR polypeptide and a gene encoding the polypeptide are provided.Type: ApplicationFiled: September 7, 2009Publication date: June 7, 2012Applicant: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECHInventors: Kyung Sook Chung, Mi Sun Won, Ji Won Ahn, Jeong Hae Choi, Hyang Sook Yoo, Young Il Yeom, Eun Young Song, Hae Gu Lee, Jae Hun Cheong, Chang Mo Kang