Patents by Inventor Hag J. Jung

Hag J. Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip having notches formed in peripheral edges thereof
    Patent number: 5341027
    Abstract: A semiconductor device which includes a semiconductor integrated circuit chip provided with a plurality of chip bonding pads contiguous with the peripheral edge of the chip, and a plurality of leads directly bonded to respective ones of the chip bonding pads. The bonding pads are preferably formed within respective notches disposed in a marginal edge portion of the chip, with each of the notches having an open end formed in the peripheral edge of the chip. By locating the chip bonding pads contiguous with the peripheral edge of the chip, rather than a prescribed distance away from the peripheral edge of the chip, the bonding pads are directly accessible from the edge of the chip, thereby enabling the leads to be directly bonded to the bonding pads, and thus eliminating the need for bonding bumps or balls.
    Type: Grant
    Filed: October 2, 1992
    Date of Patent: August 23, 1994
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong Y. Park, Hag J. Jung