Abstract: A sensor for use at substrate level in a high numerical aperature lithographic apparatus, the sensor having a transparent plate that covers a sensing element and includes elements that improve coupling of radiation into the sensing element. The elements include Fresnel lenses, holographic optical elements, inverted Winston Cones, spherical lenses and surface roughening.

Abstract: A sensor for use at substrate level in a high numerical aperture lithographic apparatus, the sensor having a transparent plate that covers a sensing element and includes elements that improve coupling of radiation into the sensing element. The improved coupling elements include a flowing liquid medium disposed between the transparent plate and the sensing element.

Abstract: A method and apparatus are provided for measuring the apodization of projection optics for use in a lithographic apparatus, the projection optics having an object plane where, in use, a reticle is placed, a pupil plane, and an image plane where, in use, a wafer is placed. The method includes placing one or more Appropriate apertures in said object plane for creating a substantially uniform light distribution, illuminating the or each aperture and measuring the intensity distribution at a plane which is conjugate to the pupil plane in order to calculate the apodization of the projection optics.

Abstract: A sensor for use at substrate level in a high numerical aperature lithographic apparatus, the sensor having a transparent plate that covers a sensing element and includes elements that improve coupling of radiation into the sensing element. The elements include Fresnel lenses, holographic optical elements, inverted Winston Cones, spherical lenses and surface roughening.

Abstract: A lithographic apparatus is arranged to project a patterned radiation beam from a patterning device onto a substrate using a projection system.

Abstract: The invention provides a method for determining vibration-related information by projecting an aerial image at an image position in a projection plane, mapping an intensity of the aerial image into an image map, the image map arranged for comprising values of coordinates of sampling locations and of the intensity sampled at each sampling location, and measuring intensity of the aerial image received through a slot pattern. The method further includes determining from the image map a detection position of a slope portion of the image map, at the detection position of the slope portion, measuring of a temporal intensity of the aerial image and measuring of relative positions of the slot pattern and the image position, the relative positions of the slot being measured as position-related data of the slot pattern and determining from the temporal intensity of the aerial image vibration-related information for said aerial image.

Abstract: According to one embodiment, a method for determining information relating to vibration includes projecting an aerial image at an image position in a projection plane; mapping an intensity of the aerial image into an image map, the image map arranged for comprising values of coordinates of sampling locations and of the intensity sampled at each sampling location; and measuring intensity of the aerial image received through a slot pattern. Further, the method includes determining from the image map a detection position of a slope portion of the image map; at the detection position of the slope portion, measuring a temporal intensity of the aerial image and relative positions of the slot pattern and the image position, the relative positions of the slot being measured as position-related data of the slot pattern; and determining from the temporal intensity of the aerial image information relating to vibration for said aerial image.

Abstract: A method and apparatus are provided for measuring the apodization of projection optics for use in a lithographic apparatus, the projection optics having an object plane where, in use, a reticle is placed, a pupil plane, and an image plane where, in use, a wafer is placed. The method includes placing one or more Appropriate apertures in said object plane for creating a substantially uniform light distribution, illuminating the or each aperture and measuring the intensity distribution at a plane which is conjugate to the pupil plane in order to calculate the apodization of the projection optics.

Abstract: A method and apparatus are provided for measuring the apodization of projection optics for use in a lithographic apparatus, the projection optics having an object plane where, in use, a reticle is placed, a pupil plane, and an image plane where, in use, a wafer is placed. The method includes placing one or more Appropriate apertures in said object plane for creating a substantially uniform light distribution, illuminating the or each aperture and measuring the intensity distribution at a plane which is conjugate to the pupil plane in order to calculate the apodization of the projection optics.

Abstract: A method of determining aberration of a projection system of a lithographic includes projecting a reference test pattern, projecting a second test pattern, measuring relative displacements between items in the resulting images of said reference test pattern and said second test pattern, and using said measurements to determine information on the aberration of the projection system, wherein a filter is used when imaging the second test pattern to select particular radiation paths though the projection system, and wherein the measuring is performed for a plurality of images of the second test pattern obtained at planes displaced along the optical axis relative to each other.

Abstract: In one configuration of an arrangement according to an embodiment of the invention, a first grating patch on one module is aligned with a first grating patch on another module. In a different configuration of the arrangement, a second grating patch on the one module is aligned with a second grating patch on the other module. The two configurations do not exist at the same time.