Patents by Inventor Haig KAMBOURIAN

Haig KAMBOURIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10679116
    Abstract: The invention relates to an antenna for a contactless smart card, arranged on an insert intended to be integrated in said smart card having a certain relative vertical or horizontal positioning tolerance T between the insert and the body of the card, said smart card being provided with an embossing area comprising lines of characters embossed in relief, at least one antenna coil being situated opposite the embossing area, wherein said coil comprises at least one pair of paths situated in the embossing area and connected in parallel, said paths being configured in such a way that at least one of same remains at least partially situated outside of the embossed character area whatever the relative position of the insert and the antenna of same allowed by the tolerance T.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: June 9, 2020
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin Mear, Haig Kambourian, Deborah Teboul
  • Patent number: 10198686
    Abstract: An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: February 5, 2019
    Assignee: SMART PACKAGING SOLUTIONS
    Inventors: Cécile Carrier, Haig Kambourian, Benjamin Mear
  • Publication number: 20180046893
    Abstract: The invention relates to an antenna for a contactless smart card, arranged on an insert intended to be integrated in said smart card having a certain relative vertical or horizontal positioning tolerance T between the insert and the body of the card, said smart card being provided with an embossing area comprising lines of characters embossed in relief, at least one antenna coil being situated opposite the embossing area, wherein said coil comprises at least one pair of paths situated in the embossing area and connected in parallel, said paths being configured in such a way that at least one of same remains at least partially situated outside of the embossed character area whatever the relative position of the insert and the antenna of same allowed by the tolerance T.
    Type: Application
    Filed: March 4, 2016
    Publication date: February 15, 2018
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Benjamin MEAR, Haig KAMBOURIAN, Deborah TEBOUL
  • Publication number: 20180018551
    Abstract: An insert for a chip card includes a body provided with a cavity in which is inserted an electronic module provided with a microelectronic chip connected to an inductive or capacitive coupling. The body has a stack of layers at least a first layer of which comprises a first booster antenna and a second layer of which comprises a second booster antenna, the various booster antennas being coupled together inductively and/or capacitively, and at least one of the booster antennas being coupled inductively and/or capacitively with the coupling of the module. The body furthermore comprises at least one metal plate disposed between two layers of ferrite, the first and second booster antennae and the metallic plate being arranged in such a way that at least one of the two booster antennas and the electronic module remain coupled together inductively and/or capacitively, despite the presence of the metal plate.
    Type: Application
    Filed: February 3, 2016
    Publication date: January 18, 2018
    Applicant: SMART PACKAGING SOLUTIONS
    Inventors: Cécile CARRIER, Haig KAMBOURIAN, Benjamin MEAR