Patents by Inventor Haijing Lu

Haijing Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154097
    Abstract: An anode electrode includes a current collector and a first anode layer arranged on the current collector and comprising first anode active material. A first pre-lithiation layer is arranged on the first anode layer. A second anode layer arranged on the first pre-lithiation layer and comprising second anode active material.
    Type: Application
    Filed: March 30, 2023
    Publication date: May 9, 2024
    Inventors: Qili Su, Zhe Li, Yong Lu, Haijing Liu
  • Publication number: 20240154126
    Abstract: A bipolar battery cell includes a bipolar electrode including a bipolar current collector and a cathode electrode arranged on one side of the bipolar current collector. The cathode electrode includes cathode active material for exchanging lithium ions, a first solid electrolyte, and first polytetrafluoroethylene (PTFE) fibrils. An anode electrode is arranged on an opposite side of the bipolar current collector, wherein the anode electrode includes anode active material for exchanging lithium ions, a second solid electrolyte, and second PTFE fibrils.
    Type: Application
    Filed: July 31, 2023
    Publication date: May 9, 2024
    Inventors: Yong LU, Zhe Li, Qili Su, Haijing Liu
  • Publication number: 20240154104
    Abstract: A battery cell includes an anode electrode comprising a first current collector. Anode active material is arranged on a first surface of the first current collector and is configured to exchange lithium ions. The anode active material comprises silicon. Empty spaces are formed in the anode active material in a predetermined pattern. A solid electrolyte layer is arranged adjacent to the anode electrode. A cathode electrode comprises a second current collector and cathode active material configured to exchange lithium ions and arranged adjacent to the solid electrolyte layer.
    Type: Application
    Filed: August 1, 2023
    Publication date: May 9, 2024
    Inventors: Zhe LI, Xingcheng XIAO, Qili SU, Yong LU, Haijing LIU
  • Publication number: 20240113300
    Abstract: The present disclosure provides a modified binder for use in an electrochemical cell that cycles lithium ions. The modified binder includes one or more agglomerates of polytetrafluoroethylene nanoparticles, where each of the polytetrafluoroethylene nanoparticles includes a polytetrafluoroethylene core and a polymeric shell that is disposed on exposed surfaces of the core. The polymeric shell can include a polymer selected from the group consisting of: polyethylene oxide, polyglycidyl methacrylate, polyvinylidene difluoride, fluoride-hexafluoropropylene, polypropylene oxide, polyacrylonitrile, polymethacrylonitrile, polymethyl methacrylate, derivatives and co-polymers, and combinations thereof, and in certain instances, also a humidity tolerant lithium salt.
    Type: Application
    Filed: November 28, 2022
    Publication date: April 4, 2024
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Yong LU, Meiyuan WU, Dewen KONG, Haijing LIU
  • Patent number: 11942620
    Abstract: The present disclosure relates to a solid-state electrochemical cell having a uniformly distributed solid-state electrolyte and methods of fabrication relating thereto. The method may include forming a plurality of apertures within the one or more solid-state electrodes; impregnating the one or more solid-state electrodes with a solid-state electrolyte precursor solution so as to fill the plurality of apertures and any other void or pores within the one or more electrodes with the solid-state electrolyte precursor solution; and heating the one or more electrodes so as to solidify the solid-state electrolyte precursor solution and to form the distributed solid-state electrolyte.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 26, 2024
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Yong Lu, Zhe Li, Xiaochao Que, Haijing Liu, Meiyuan Wu
  • Publication number: 20240079638
    Abstract: A battery cell includes a continuous anode electrode comprising an anode current collector. A plurality of individual cathode electrodes include a cathode current collector, cathode active material arranged on opposite sides of the cathode current collector, and a first sulfide electrolyte layer arranged on the cathode active material. The continuous anode electrode is arranged in a zig-zag pattern and the plurality of individual cathode electrodes are arranged between adjacent alternating portions of the continuous anode electrode.
    Type: Application
    Filed: October 7, 2022
    Publication date: March 7, 2024
    Inventors: Qili SU, Zhe Li, Yong Lu, Haijing Liu
  • Publication number: 20240079699
    Abstract: A bipolar battery includes N battery cores each comprising a cathode electrode, an anode electrode, and a separator, where N is an integer greater than one. N?1 bipolar plates include a first layer made of a first material, a second layer made of a second material, a center portion, and first and second sides extending transversely relative to the center portion. A battery enclosure including a cover and a lower portion including sides defining a cavity. The N?1 bipolar plates are arranged in the cavity between adjacent ones of the N battery cores and the N battery cores are connected in series by the N?1 bipolar plates. The first and second sides of the N?1 bipolar plates are one of inserted into ā€œLā€-shaped slots in the sides of the lower portion, and molded into the sides of the lower portion.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 7, 2024
    Inventors: Zhe LI, Meiyuan WU, Qili SU, Yong LU, Haijing LIU
  • Publication number: 20240079594
    Abstract: In various aspects, the present disclosure provides solvent-free methods of making a solid-state electrode active layer for a solid-state electrode in an electrochemical cell that cycles lithium ions, by using a plurality of solid polymeric binder particles capable of fibrillation with porous fibrillation particles with a first shear force to at least partially fibrillate the solid polymeric binder particles to form a polymeric binder mixture. The disclosure also contemplates a current collector and a porous active layer disposed thereon. The porous active layer includes a fibrous polymeric network having a plurality of solid particles distributed therein. The solid particles may include electroactive material particles, solid-state electrolyte particles, and porous fibrillation particles.
    Type: Application
    Filed: November 4, 2022
    Publication date: March 7, 2024
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Qili SU, Zhe LI, Yong LU, Haijing LIU
  • Publication number: 20240079544
    Abstract: A method for fabricating a dual-layer capacitive cabode electrode includes fabricating a first film including capacitive active material; fabricating a second film including cathode active material; hot jointing the first film and the second film to create a cabode film; and laminating the cabode film onto opposite sides of a current collector using conductive adhesive.
    Type: Application
    Filed: October 7, 2022
    Publication date: March 7, 2024
    Inventors: Dewen KONG, Meiyuan WU, Yong LU, Haijing LIU, Mark W. VERBRUGGE
  • Patent number: 8462516
    Abstract: An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: June 11, 2013
    Assignees: Agency for Science Technology and Research, Nanyang Technological University
    Inventors: Chee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lok
  • Publication number: 20100246150
    Abstract: An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
    Type: Application
    Filed: October 21, 2008
    Publication date: September 30, 2010
    Applicants: Agency for Science Tecnology and Research, Nanyang Tecnological University
    Inventors: Chee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lock
  • Publication number: 20030216025
    Abstract: A process is used to produce copper bumps on a semiconductor chip or a wafer containing several microchips. The chip or wafer has a layer incorporating a plurality semiconductor devices and a passivation layer having openings. Conductive pads within the openings and are in contact with the semiconductor devices. In the process, a conductive adhesive material is deposited onto the conductive pads to form adhesion layers. A conductive metal is deposited onto the adhesion layers to form barrier layers and the passivation layer is subjected to an acid dip solution to remove particles of the conductive adhesive material which can be attached to the passivation layer. Copper is then deposited onto the barrier layers to form the copper bump. Each one of the deposition steps are performed electrolessly. Furthermore, plating solutions and a wafer and a microchip produced by the above process and are provided.
    Type: Application
    Filed: May 16, 2003
    Publication date: November 20, 2003
    Inventors: Haijing Lu, Hao Gong, Stephen Choo Khuen Wong