Abstract: A metal oxide varistor (MOV) includes an MOV body, a first electrode, a second electrode, and a thermal cut-off insulation shell. The MOV body is a crystalline microstructure with zinc oxide mixed with one or more other metal oxides. The first electrode is adjacent one side of the MOV body and is connected to a first radial lead. The second electrode is adjacent a second side of the MOV body and is connected to a second radial lead having a curved portion. The thermal cut-off insulation shell is adjacent the second electrode and has a protrusion, with the curved portion of the second radial lead being adjacent the protrusion.

Abstract: Provided herein are protection devices having a tubular ceramic part and a tubular metal oxide varistor (MOV) electrically coupled in series or parallel. In some embodiments, the tubular ceramic part is connected between a first electrode and a second electrode, and the tubular MOV is connected between the second electrode and a third electrode. In some embodiments, the tubular ceramic part and the tubular MOV have a same or similar shape and/or outer circumference. The protection device further includes an enclosure surrounding the tubular ceramic part and the tubular MOV, wherein the first electrode, the second electrode, and the third electrode each have leads extending outside the enclosure. In some embodiments, the tubular MOV includes a central cavity aligned with a central cavity of the tubular ceramic part, wherein the central cavity of the tubular MOV MOV and the central cavity of the tubular ceramic part contain an inert gas.

Abstract: Provided herein are protection devices having a tubular ceramic part and a tubular metal oxide varistor (MOV) electrically coupled in series or parallel. In some embodiments, the tubular ceramic part is connected between a first electrode and a second electrode, and the tubular MOV is connected between the second electrode and a third electrode. In some embodiments, the tubular ceramic part and the tubular MOV have a same or similar shape and/or outer circumference. The protection device further includes an enclosure surrounding the tubular ceramic part and the tubular MOV, wherein the first electrode, the second electrode, and the third electrode each have leads extending outside the enclosure. In some embodiments, the tubular MOV includes a central cavity aligned with a central cavity of the tubular ceramic part, wherein the central cavity of the tubular MOV MOV and the central cavity of the tubular ceramic part contain an inert gas.

Abstract: A circuit protection device includes: a housing (102) defining a cavity (130); a metal oxide varistor (110) disposed within the cavity; a movable electrode (122) attached to a first side of the metal oxide varistor by a solder connection (140); an arc shield (114) disposed within the housing on the first side of the metal oxide varistor and adjacent to the movable electrode; and a spring (120) attached to the arc shield, wherein the arc shield is mechanically biased against the movable electrode along a surface direction parallel to the first side when the spring is in a compressed state. The device is easy to assemble in lower cost and provides fast response to overheating caused by a fault condition.

Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals.

Abstract: A circuit protection device includes a metal oxide varistor (MOV), a spring terminal and a thermal disconnect coupling the spring terminal to the MOV. A gas discharge tube (GDT) is coupled to the MOV. The spring terminal is biased such that upon occurrence of an overvoltage condition, heat generated by the MOV melts the thermal disconnect and allows the spring terminal to be displaced away from the MOV, thereby creating an opening circuit.

Abstract: A circuit protection device includes a metal oxide varistor (MOV), a spring terminal and a thermal disconnect coupling the spring terminal to the MOV. A gas discharge tube (GDT) is coupled to the MOV. The spring terminal is biased such that upon occurrence of an overvoltage condition, heat generated by the MOV melts the thermal disconnect and allows the spring terminal to be displaced away from the MOV, thereby creating an opening circuit.

Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.

Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals, thereby creating an opening circuit.

Abstract: A circuit protection device includes a metal oxide varistor (MOV), a spring terminal and a thermal disconnect coupling the spring terminal to the MOV. A gas discharge tube (GDT) is coupled to the MOV. The spring terminal is biased such that upon occurrence of an overvoltage condition, heat generated by the MOV melts the thermal disconnect and allows the spring terminal to be displaced away from the MOV, thereby creating an opening circuit.

Abstract: Exemplary embodiments of the present invention are directed to a circuit protection device, A circuit protection device may comprise a housing defining a cavity and a metal oxide varistor (MOV) disposed within the cavity. The circuit protection device may further comprise a first terminal electrically attached at a first end to the MOV by solder and extending outside of the housing at a second end. An arc shield is disposed within the housing between the first end of the first terminal and at least partially over the solder. The circuit protection device may further comprise a spring configured to bias the arc shield against a micro switch having an indicator portion disposed at least partially outside of the housing.

Abstract: A circuit protection device including a housing, a metal oxide varistor disposed within said housing, a terminal having a contact lead at a first end electrically attached to said metal oxide varistor by solder and having a second end extending outside of said housing, an arc shield disposed within said housing between said contact lead and said metal oxide varistor, a micro switch housed in a pocket portion of the housing, said micro switch having a trigger portion and an indicator portion disposed at least partially outside of said housing, said arc shield positioned against said trigger portion, and a spring configured to bias said arc shield away from said pocket portion and to move said arc shield away from said trigger portion when said solder is melted to provide a barrier between said metal oxide varistor and said contact lead, whereby the indicator portion is retracted into the housing.

Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.

Abstract: Exemplary embodiments of the present invention are directed to a circuit protection device. A circuit protection device may comprise a housing defining a cavity and a metal oxide varistor (MOV) disposed within the cavity. The circuit protection device may further comprise a first terminal electrically attached at a first end to the MOV by solder and extending outside of the housing at a second end. An arc shield is disposed within the housing between the first end of the first terminal and at least partially over the solder. The circuit protection device may further comprise a spring configured to bias the arc shield against a micro switch having an indicator portion disposed at least partially outside of the housing.