Abstract: A signal transceiver apparatus includes at least one plug-in card and a backplane. The plug-in card includes two waveguide boards, a multi-layer circuit board disposed between the two waveguide boards, and an antenna array and a first waveguide interface that are mounted on each of the two waveguide boards. A waveguide slot is provided on one side, facing the multi-layer circuit board, of each of the two waveguide boards. A metal layer corresponding to the waveguide slot is disposed on each of two sides of the multi-layer circuit board, wherein the metal layers and the waveguide slots cooperate to form two waveguide channels that are respectively located on two sides of the multi-layer circuit board and that each are connected to the antenna array and the first waveguide interface.

Abstract: A signal transceiver apparatus, including at least one plug-in card and a backplane. The plug-in card includes two waveguide boards, a multi-layer circuit board disposed between the two waveguide boards, and an antenna array and a first waveguide interface that are mounted on each of the two waveguide boards. A waveguide slot is provided on one side, facing the multi-layer circuit board, of each of the two waveguide boards. A metal layer corresponding to the waveguide slot is disposed on each of two sides of the multi-layer circuit board.

Abstract: A radio frequency signal transceiver includes: a transmission circuit configured to perform power amplification on an input first analog signal, wirelessly transmit the first analog signal after power amplification, and output the first analog signal after power amplification to a pre-distortion circuit; the pre-distortion circuit configured to convert the first analog signal after power amplification into a second analog signal and output the second analog signal, where the second analog signal is used to feedback distortion of the first analog signal to compensate the first analog signal in advance according to the distortion; and a receiving circuit configured to wirelessly receive a third analog signal, and process and output the third analog signal. The radio frequency signal transceiver can improve efficiency in receiving and transmitting a radio frequency signal, reduce a cost of a base station system, and reduce a difficulty in implementing the base station system.

Abstract: A radio frequency signal transceiver includes: a transmission circuit configured to perform power amplification on an input first analog signal, wirelessly transmit the first analog signal after power amplification, and output the first analog signal after power amplification to a pre-distortion circuit; the pre-distortion circuit configured to convert the first analog signal after power amplification into a second analog signal and output the second analog signal, where the second analog signal is used to feedback distortion of the first analog signal to compensate the first analog signal in advance according to the distortion; and a receiving circuit configured to wirelessly receive a third analog signal, and process and output the third analog signal. The radio frequency signal transceiver can improve efficiency in receiving and transmitting a radio frequency signal, reduce a cost of a base station system, and reduce a difficulty in implementing the base station system.

Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.

Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.