Patents by Inventor Haiting Wang

Haiting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990535
    Abstract: Disclosed is a semiconductor structure including a lateral heterojunction bipolar transistor (HBT). The structure includes a substrate (e.g., a silicon substrate), an insulator layer on the substrate, and a semiconductor layer (e.g., a silicon germanium layer) on the insulator layer. The structure includes a lateral HBT with three terminals including a collector, an emitter, and a base, which is positioned laterally between the collector and the emitter and which can include a silicon germanium intrinsic base region for improved performance. Additionally, the collector and/or the emitter includes: a first region, which is epitaxially grown within a trench that extends through the semiconductor layer and the insulator layer to the substrate; and a second region, which is epitaxially grown on the first region. The connection(s) of the collector and/or the emitter to the substrate effectively form thermal exit path(s) and minimize self-heating. Also disclosed is a method for forming the structure.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 21, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Alexander M. Derrickson, Haiting Wang, Judson R. Holt, Vibhor Jain, Richard F. Taylor, III
  • Publication number: 20240153511
    Abstract: An audio encoding and decoding method and a related apparatus are provided. The audio encoding method includes: determining a channel combination scheme for a current frame; when the channel combination scheme for the current frame is different from a channel combination scheme for a previous frame, performing segmented time-domain downmix processing on left and right channel signals in the current frame based on the channel combination scheme for the current frame and the channel combination scheme for the previous frame, to obtain a primary channel signal and a secondary channel signal in the current frame; and encoding the obtained primary channel signal and secondary channel signal in the current frame.
    Type: Application
    Filed: December 19, 2023
    Publication date: May 9, 2024
    Inventors: Bin WANG, Haiting LI, Lei MIAO
  • Patent number: 11978463
    Abstract: A stereo signal encoding method includes: obtaining a residual signal encoding parameter of a current frame of a stereo signal based on downmixed signal energy and residual signal energy of each of M sub-bands of the current frame, where the residual signal encoding parameter indicates whether to encode residual signals of the M sub-bands; determining whether to encode the residual signals based on the residual signal encoding parameter; and encoding the residual signals when it is determined that the residual signals need to be encoded.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: May 7, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bin Wang, Zexin Liu, Haiting Li
  • Patent number: 11967637
    Abstract: A disclosed structure includes a fin-based bipolar junction transistor (BJT) with reduced base resistance. The BJT includes one or more semiconductor fins. Each semiconductor fin has opposing sidewalls, a first width, and a base recess, which extends across the first width through the opposing sidewalls. The BJT includes a base region positioned laterally between collector and emitter regions. The base region includes a base semiconductor layer (e.g., an intrinsic base layer), which fills the base recess and which has a second width greater than the first width such that the base semiconductor layer extends laterally beyond the opposing sidewalls. In a BJT with multiple semiconductor fins, the base recess on each semiconductor fin is filled with a discrete base semiconductor layer. The base region further includes an additional base semiconductor layer (e.g., an extrinsic base layer) covering the base semiconductor layer(s). Also disclosed is a method of forming the structure.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: April 23, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Ali Razavieh, Jagar Singh, Haiting Wang
  • Patent number: 11961526
    Abstract: A method and an apparatus for calculating a downmixed signal and a residual signal are provided. According to the method, if a first target frame (a current frame or a previous frame of the current frame) is a switching frame, a to-be-encoded downmixed signal and a to-be-encoded residual signal of the subband corresponding to the preset frequency band in the current frame is calculated based on a switch fade-in/fade-out factor of a second target frame, an initial downmixed signal and an initial residual signal of the preset frequency band.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: April 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Haiting Li, Bin Wang, Zexin Liu
  • Publication number: 20240105188
    Abstract: This application discloses a downmixed signal calculation method and apparatus. The method includes: when a current frame or a previous frame of the current frame of a stereo signal is not a switching frame and a residual signal in the current frame or the previous frame does not need to be encoded, obtaining a second downmixed signal in the current frame and a downmix compensation factor of the current frame, correcting the second downmixed signal in the current frame based on the downmix compensation factor of the current frame, to obtain the first downmixed signal in the current frame and determining the first downmixed signal in the current frame as a downmixed signal in the current frame in a preset frequency band.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Inventors: Haiting LI, Zexin LIU, Bin WANG
  • Patent number: 11935547
    Abstract: A non-transitory computer-readable medium is provided. The non-transitory computer-readable medium having computer instructions stored therein, which when executed by one or more processors, cause the one or more processors to perform operations. The operations comprise: determining a channel combination scheme for a current frame, where the determined channel combination scheme for the current frame is one of a plurality of channel combination schemes; and determining a coding mode of the current frame based on a channel combination scheme for a previous frame and the channel combination scheme for the current frame, where the coding mode of the current frame is one of a plurality of coding modes.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: March 19, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bin Wang, Haiting Li, Lei Miao
  • Patent number: 11908917
    Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to gate structures and methods of manufacture. The method includes: forming a first gate structure and a second gate structure with gate materials; etching the gate materials within the second gate structure to form a trench; and depositing a conductive material within the trench so that the second gate structure has a metal composition different than the first gate structure.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: February 20, 2024
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jiehui Shu, Sipeng Gu, Haiting Wang
  • Patent number: 11908898
    Abstract: Embodiments of the disclosure provide a lateral bipolar transistor with a base layer of varying horizontal thickness, and related methods to form the same. A lateral bipolar transistor may include an emitter/collector (E/C) layer on a semiconductor layer. A first base layer is on the semiconductor layer and horizontally adjacent the E/C layer. The first base layer has a lower portion having a first horizontal width from the E/C layer. The first base layer also has an upper portion on the lower portion, with a second horizontal width from the E/C layer greater than the first horizontal width. A second base layer is on the first base layer and adjacent a spacer. The upper portion of the first base layer separates a lower surface of the second base layer from the E/C layer.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: February 20, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Haiting Wang, Hong Yu, Zhenyu Hu, Alexander M. Derrickson
  • Patent number: 11908857
    Abstract: Structures for a semiconductor device that include dielectric isolation and methods of forming a structure for a semiconductor device that includes dielectric isolation. A semiconductor body includes a cavity, first and second gate structures extending over the semiconductor body, and a semiconductor layer including first and second sections on the semiconductor body. The first section of the semiconductor layer is laterally positioned between the cavity and the first gate structure, and the second section on the semiconductor layer is laterally positioned between the cavity and the second gate structure. An isolation structure is laterally positioned between the first and second sections of the semiconductor layer. The isolation structure includes a dielectric layer and a sidewall spacer having first and second sections. The dielectric layer includes a first portion in the cavity and a second portion between the first and second sections of the sidewall spacer.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: February 20, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yanping Shen, Haiting Wang, Sipeng Gu
  • Patent number: 11895426
    Abstract: Embodiments of the present disclosure provide a method and apparatus for capturing video, an electronic device and a computer-readable storage medium. The method includes: receiving a video capture trigger operation from a user via a video playing interface for an original video; superimposing a video capture window on the video playing interface, in response to the video capture trigger operation; receiving a video capture operation from the user via the video playing interface: and capture a user video in response to the video capture operation, and displaying the user video via the video capture window. According to the embodiments of the present disclosure, a user only needs to perform operations related to capturing a user video on the video playing interface, thereby implementing a function of combining video, and the operation process is simple and fast. The user video can represent the user's feelings, comments, or viewing reactions to the original video.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: February 6, 2024
    Assignee: BEIJING MICROLIVE VISION TECHNOLOGY CO., LTD
    Inventors: Haidong Chen, Yipeng Hao, Haiting Wang, Junjie Lin
  • Patent number: 11888050
    Abstract: Embodiments of the disclosure provide a lateral bipolar transistor structure with inner and outer spacers, and related methods. A lateral bipolar transistor structure may have an emitter/collector (E/C) layer over an insulator. The E/C layer has a first doping type. A first base layer is on the insulator and adjacent the E/C layer. The first base layer has a second doping type opposite the first doping type. A second base layer is on the first base layer and having the second doping type. A dopant concentration of the second base layer is greater than a dopant concentration of the first base layer. An inner spacer is on the E/C layer and adjacent the second base layer. An outer spacer is on the E/C layer and adjacent the inner spacer.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: January 30, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: John L. Lemon, Alexander M. Derrickson, Haiting Wang, Judson R. Holt
  • Publication number: 20240021713
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a lateral bipolar transistor and methods of manufacture. A structure includes: an intrinsic base comprising semiconductor material in a channel region of a semiconductor substrate; an extrinsic base vertically above the intrinsic base; a raised collector region on the semiconductor substrate and laterally connected to the intrinsic base; and a raised emitter region on the semiconductor substate and laterally connected to the intrinsic base.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Inventors: Haiting Wang, Alexander Derrickson, Jagar Singh, Vibhor Jain, Andreas Knorr, Alexander Martin, Judson R. Holt, Zhenyu Hu
  • Patent number: 11843034
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a lateral bipolar transistor and methods of manufacture. The structure includes a lateral bipolar junction transistor including an extrinsic base region and a bilayer dielectric spacer on sidewalls of the extrinsic base region, and a p-n junction positioned under the bilayer dielectric spacer between the extrinsic base region and at least an emitter region.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: December 12, 2023
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Man Gu, Haiting Wang, Jagar Singh
  • Publication number: 20230395715
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a multi-channel replacement metal gate device and methods of manufacture. The structure includes: a fully depleted semiconductor on insulator substrate; a plurality of fin structures over the fully depleted semiconductor on insulator substrate; and a metal gate structure spanning over the plurality of fin structures and the fully depleted semiconductor on insulator substrate.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 7, 2023
    Inventors: Haiting WANG, Hong YU, Zhenyu HU
  • Patent number: 11812670
    Abstract: An illustrative device disclosed herein includes at least one layer of insulating material, a conductive contact structure having a conductive line portion and a conductive via portion and a memory cell positioned in a first opening in the at least one layer of insulating material. In this illustrative example, the memory cell includes a bottom electrode, a memory state material positioned above the bottom electrode and an internal sidewall spacer positioned within the first opening and above at least a portion of the memory state material, wherein the internal sidewall spacer defines a spacer opening and wherein the conductive via portion is positioned within the spacer opening and above a portion of the memory state material.
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: November 7, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yanping Shen, Haiting Wang, Sipeng Gu
  • Patent number: 11810969
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a lateral bipolar transistor and methods of manufacture. A structure includes: an intrinsic base comprising semiconductor material in a channel region of a semiconductor substrate; an extrinsic base vertically above the intrinsic base; a raised collector region on the semiconductor substrate and laterally connected to the intrinsic base; and a raised emitter region on the semiconductor substate and laterally connected to the intrinsic base.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: November 7, 2023
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Haiting Wang, Alexander Derrickson, Jagar Singh, Vibhor Jain, Andreas Knorr, Alexander Martin, Judson R. Holt, Zhenyu Hu
  • Patent number: 11785860
    Abstract: One illustrative device disclosed herein includes a memory cell positioned in a first opening in at least one layer of insulating material. The memory cell comprises a bottom electrode, a memory state material positioned above the bottom electrode and an internal sidewall spacer positioned within the first opening, wherein the internal sidewall spacer defines a spacer opening. The device also comprises a top electrode positioned within the spacer opening.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: October 10, 2023
    Assignee: GLOBALFOUNDRIES U.S. Inc.
    Inventors: Sipeng Gu, Haiting Wang, Yanping Shen
  • Patent number: 11777313
    Abstract: The present invention discloses a unit commitment method considering security region of wind turbine generators with frequency response control, and the main steps are: 1) determining security region of wind turbine generators when provides frequency response; 2) based on the security region of the wind turbine generators when provides frequency response, establishing a unit commitment model considering security region of wind turbine generators; and 3) calculating the unit commitment model considering the security region of the wind turbine generators by using mixed-integer linear programming method, and obtaining the operation result of the unit commitment considering the security region of the wind turbine generators with frequency response control. The present invention can be widely used in the setting of frequency response parameters of wind turbine generators dispatched in the prior art and the start-stop and output plans of synchronous generator.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: October 3, 2023
    Assignees: State Grid Qinghai Electric Power Research Institute, Chongqing University, State Grid Qinghai Electric Power Company, State Grid Corporation of China
    Inventors: Yue Fan, Senlin Yang, Juan Yu, Xiaoku Yang, Ling Dong, Jun Kang, Maochun Wang, Yongqiang Han, Zhifang Yang, Rui Song, Xuebin Wang, Juelin Liu, Haiting Wang, Xiaokan Gou, Guobin Fu, Chunmeng Chen, Pengsheng Xie, Yanhe Li, Shichang Zhao, Xuan Wang, Ying Liang, Jun Yang, Shujie Zhang, Ming Xiao, Jiatian Gan, Guoqiang Lu, Yujie Ding, Dongning Zhao, Jia Yang, Ke Liu, Shaofei Wang, Yongfei Ma, Jie Zhang, Aizhen Zhu, Kaixuan Yang, Shuxian Yuan
  • Publication number: 20230299181
    Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to single fin structures and methods of manufacture. The structure includes: an active single fin structure; a plurality of dummy fin structures on opposing sides of the active single fin structure; source and drain regions formed on the active single fin structure and the dummy fin structures; recessed shallow trench isolation (STI) regions between the dummy fin structures and the active single fin structure and below a surface of the dummy fin structures; and contacts formed on the source and drain regions of the active single fin structure with a spacing of at least two dummy fin structures on opposing sides of the contacts.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 21, 2023
    Inventors: Haiting WANG, Hong YU, Zhenyu HU