Abstract: Methods for determining a prediction value, an encoder, and a decoder are provided. Reconstructed values of neighboring samples of a current block are acquired, and then filtered to obtain a reference value set of the current block. When a size of the current block is smaller than a preset threshold value, a first constant value is calculated according to a bit depth value of a luma component of a sample in the current block. A difference between the first constant value and a first reference value in the reference value set is determined as a first prediction input value in a prediction input value set. Other prediction input values in the prediction input value set other than the first prediction input value are determined according to the reference value set. Prediction values of samples at specific positions in the current block is calculated and then filtered.

Abstract: Provided are a picture encoding and decoding method, an encoder, a decoder and a storage medium. The decoder decodes a bitstream to obtain a size, a coding mode, and residuals of a current block; when the coding mode of the current block is an MIP mode, calculates a second offset based on the size of the current block, a first offset and reconstructed values of adjacent pixels corresponding to the current block; determines a first prediction value of the current block according to the second offset; and determines a reconstructed value of the current block based on the first prediction value.

Abstract: This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.

Abstract: This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.

Abstract: This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.

Abstract: This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.

Abstract: This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.

Abstract: This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000 ° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.

Abstract: This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.

Abstract: This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.

Abstract: This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various elements of an electrical circuit.

Abstract: This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents.

Abstract: The invention relates to UV-curable dielectric ink formulations useful in digital manufacturing electric circuitry and devices. These compositions are useful in inkjet printing of electronic materials.

Abstract: The process for making silver powder particles with very small size crystallites uses a combination of gum arabic and maleic acid with the reduction of a silver salt with ascorbic acid. Silver thick film paste containing these silver powder particles can be used in electronic applications to form electrodes for semiconductor devices and, in particular, solar cells.

Abstract: The process for making silver powder particles with very small size crystallites uses a combination of gum arabic and maleic acid with the reduction of a silver salt with ascorbic acid. Silver thick film paste containing these silver powder particles can be used in electronic applications to form electrodes for semiconductor devices and, in particular, solar cells.

Abstract: The process for making silver powder particles with small size crystallites uses a combination of gum arabic and maleic acid with the reduction of a silver salt with ascorbic acid, Silver thick film paste containing these silver powder particles can be used in electronic applications to form electrodes for semiconductor devices and, in particular, solar cells.

Abstract: Embodiments of the invention relate to a silicon semiconductor device, and a conductive thick film composition for use in a solar cell device.

Abstract: This invention provides a method of making a photovoltaic cell. The method uses an etching composition comprising one or more onium salts selected from the group consisting of iodonium salts and sulfonium and an organic medium to etch the anti-reflection coating. Also provided is a photovoltaic cell made by this method.

Abstract: This invention provides a method of making a photovoltaic cell. The method uses an etching composition comprising one or more onium salts selected from the group consisting of iodonium salts and sulfonium and an organic medium to etch the anti-reflection coating. Also provided is a photovoltaic cell made by this method.

Abstract: The process for making silver powder particles with small size crystallites uses a combination of gum arabic and maleic acid with the reduction of a silver salt with ascorbic acid. Silver thick film paste containing these silver powder particles can be used in electronic applications to form electrodes for semiconductor devices and, in particular, solar cells.