Abstract: A heat conducting composition containing a curable silicone resin (A) and 70 to 98% of a thermally conductive powder (B) containing 30 to 75% of aluminum nitride particles (B-1) having a 50% particle size of 50 to 150 ?m, 10 to 30% by mass of aluminum nitride particles (B-2) having a 50% particle size of 15 to less than 50 ?m, 5 to 15% of a metal oxide (B-3) other than zinc oxide having a 50% particle size of 1 to less than 20 ?m, and 10 to 40% of zinc oxide (B-4) having a 50% particle size of 0.1 to less than 1 ?m and a BET specific surface area of less than 9.0 m2/g. The metal oxide (B-3) and the zinc oxide (B-4) are both surface treated with a surface treatment agent selected from a silane coupling agent having an C10-C22 alkyl group and ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane.

Abstract: Provided is a method for producing a surface-treated thermally conductive filler, the method including treating the surface of the thermally conductive filler with an alkoxysilane having a specific structure by the chemical vapor deposition method.

Abstract: A thermally conductive resin composition includes an epoxy resin and a thermally conductive powder. The thermally conductive powder includes aluminum nitride having a silicon-containing oxide coating on a surface thereof and another thermally conductive powder. The content of the epoxy resin is 1% by mass or more and 20% by mass or less based on the total amount of the thermally conductive resin composition. The content of the thermally conductive powder is 80% by mass or more and 99% by mass or less based on the total amount of the thermally conductive resin composition. The content of the aluminum nitride having a silicon-containing oxide coating on a surface thereof is 10% by mass or more and 70% by mass or less based on the total amount of the thermally conductive resin composition. The content of the other thermally conductive powder is 10% by mass or more and 89% by mass or less based on the total amount of the thermally conductive resin composition.

Abstract: A thermally conductive composition comprising: a filler; and a polymer component, wherein the filler comprises at least one surface-treated filler selected from the group consisting of the following filler (A) and filler (B): Filler (A): A filler surface-treated by a chemical vapor deposition method using a siloxane having one SiH group Filler (B): A filler surface-treated by a chemical vapor deposition method using a siloxane having two or more SiH groups, wherein at least one group selected from the group consisting of an unsubstituted alkyl group having 6 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms having a substituent, and a group having a specific structure is further bonded to a silicon atom on a surface of the filler and introduced.

Abstract: A thermally conductive urethane resin composition comprising a castor oil-based polyol, a polyisocyanate compound, and a filler, wherein an equivalent ratio [NCO/OH] of isocyanato groups of the polyisocyanate compound to hydroxyl groups of the castor oil-based polyol is from 0.8 to 1.6, the filler comprises a filler (A) having an average particle diameter of 0.03 to 10 ?m, and the filler (A) has been surface-treated with a specific surface treatment agent.

Abstract: A heat conducting composition including: a polymer component (A); a surface-treated filler (B) obtained by surface-treating a filler with ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, with the ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane having an adhesion percentage to the filler of from 20.0 to 50.0% by mass; and a silicon-containing oxide-coated nitride (C) having a nitride and a silicon-containing oxide coating that coats the nitride.

Abstract: A surface-treated filler obtained by surface-treating a surface of a filler with ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, wherein an adhesion percentage of the ?-butyl-?-(2-trimethoxysilylethyl)polydimethylsiloxane to the filler is from 20.0 to 50.0% by mass.

Abstract: A thermally conductive composition contains a resin composition and a thermally conductive filler, wherein the resin composition contains a vinyl group-containing silicone resin having a viscosity ranging from 40,000 mPa·s to 200,000,000 mPa·s at 25° C. and a polysiloxane compound having at least one hydroxy group at an end, having no vinyl group, and having a weight-average molecular weight (Mw) of 10,000 or more and 20,000 or less, the mass ratio of the vinyl group-containing silicone resin to the polysiloxane compound [the vinyl group-containing silicone resin/the polysiloxane compound] is 50/50 or more and less than 90/10, the content of the thermally conductive filler ranges from 300 parts by mass to 5,000 parts by mass with respect to 100 parts by mass of the resin composition, and a cured product of the thermally conductive composition has a thermal conductivity of 1.0 W/mk or more.

Abstract: A thermally conductive composition contains a resin composition and a thermally conductive filler, wherein the resin composition contains a liquid silicone resin having a viscosity ranging from 20 mPa·s to 200,000,000 mPa·s at 25° C. as measured according to JIS Z8803:2011 and a polysiloxane compound having at least one hydroxy group not directly bound to a silicon atom at an end, and having no vinyl group; the mass ratio of the liquid silicone resin to the polysiloxane compound [the liquid silicone resin/the polysiloxane compound] is 50/50 or more and less than 90/10, the content of the thermally conductive filler ranges from 300 parts by mass to 5,000 parts by mass with respect to 100 parts by mass of the resin composition, and a cured product of the thermally conductive composition has a thermal conductivity of 1.0 W/mk or more as measured according to ISO22007-2.

Abstract: A thermally conductive composition containing a filler and a polymer component, wherein the filler includes a filler (A) surface-treated with a silylated castor oil derivative obtained by reacting isocyanate silane with a castor oil-based polyol.

Abstract: Provided is a thermally conductive composition containing a liquid resin, a thermally conductive powder, and a dispersant, in which the liquid resin has a viscosity of 10 mPa·s or more and 2,000 mPa·s or less at 25° C., the dispersant is an acrylic silicone, and at least one of the liquid resin and the thermally conductive powder contains an alkyl group having 4 or more carbon atoms.

Abstract: The thermally conductive resin composition of the present invention contains (a) a matrix component, (b) a larger-diameter thermally conductive inorganic powder, (c) a smaller-diameter thermally conductive inorganic powder, and (d) a vulcanizing agent and/or curing agent. The surface of the smaller-diameter thermally conductive inorganic powder is selectively treated with a silane compound represented by R(CH3)aSi(OR?)3-a (wherein R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R? is an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1) or a partially hydrolyzed product thereof, and the amount thereof is smaller than the amount necessary to coat the entire surface area of the smaller-diameter thermally conductive inorganic powder.

Abstract: A thermal diffusion sheet of the present invention includes a graphite sheet and thermally conductive adhesive layers attached to both principal surfaces of the graphite sheet. The thermally conductive adhesive layer on a first surface is substantially the same in size as the graphite sheet. The thermally conductive adhesive layer on a second surface is relatively larger in size than the thermally conductive adhesive layer on the first surface, and the entire periphery of the thermally conductive adhesive layer on the second surface lies outside the graphite sheet. The adhesive strength of the thermally conductive adhesive layers on the first and second surfaces after exposure to 40° C. for 168 hours is reduced by no more than 20% relative to the initial adhesive strength. A hardened material of a polymer component of the thermally conductive adhesive layers on the first and second surfaces has a thermal conductivity of 0.6 W/m·K or more.

Abstract: The thermally conductive resin composition of the present invention contains (a) a matrix component, (b) a larger-diameter thermally conductive inorganic powder, (c) a smaller-diameter thermally conductive inorganic powder, and (d) a vulcanizing agent and/or curing agent. The surface of the smaller-diameter thermally conductive inorganic powder is selectively treated with a silane compound represented by R(CH3)aSi(OR?)3-a (wherein R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R? is an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1) or a partially hydrolyzed product thereof, and the amount thereof is smaller than the amount necessary to coat the entire surface area of the smaller-diameter thermally conductive inorganic powder.

Abstract: A thermal diffusion sheet of the present invention includes a graphite sheet and thermally conductive adhesive layers attached to both principal surfaces of the graphite sheet. The thermally conductive adhesive layer on a first surface is substantially the same in size as the graphite sheet. The thermally conductive adhesive layer on a second surface is relatively larger in size than the thermally conductive adhesive layer on the first surface, and the entire periphery of the thermally conductive adhesive layer on the second surface lies outside the graphite sheet. The adhesive strength of the thermally conductive adhesive layers on the first and second surfaces after exposure to 40° C. for 168 hours is reduced by no more than 20% relative to the initial adhesive strength. Ahardened material of a polymer component of the thermally conductive adhesive layers on the first and second surfaces has a thermal conductivity of 0.6 W/m·K or more.

Abstract: The present invention provides a thermal conductive composition formed by blending a thermal conductive filler of not less than 600 mass parts to 100 mass parts of a liquid silicone having a viscosity in a range of 20 to 2000 mPa·s. Since the thermal conductive composition is not crosslinked further or cured at a normal temperature of 25° C., it keeps a putty state, and the thermal conductivity is not less than 3 W/m·K. A heat-dissipating putty sheet according to the present invention is formed by applying the thus obtained thermal conductive composition onto a release sheet. The heat-dissipating putty sheet having a thickness ranging from 0.5 mm to 3 mm can be released manually from a release base, or it can be transferred from a release sheet to a heat-generating part or a dissipator so as to be attached to a desired position easily.

Abstract: A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 ?g/cm2 per unit surface area. The amount of volatile corrosive gas generated from the sheet is not more than 10 ?g/cm2 per unit surface area. The sheet has a thermal conductivity of 0.5 to 20 W/m·K. This thermally conductive sheet generates fewer volatile substances and can be used even in a closed place.

Abstract: A thermally conductive sheet includes, as a main component, an acrylic polymer into which a thermally conductive filler is mixed, and an inner layer or one side of the sheet is a solventless, adhesive elastic product layer, and a cured thin film layer is formed integrally with a surface layer portion on at least one selected from the top and bottom surfaces of the sheet. Thus, there are provided a thermally conductive sheet having high thermal conductivity, good dimensional stability, softness, excellent loading characteristics and resistance to cracking, by using a polymer compound that does not create the possibility that a low molecular weight substance such as a monomer or an oligomer will bleed out, and a method for producing the thermally conductive sheet.

Abstract: The present invention provides a thermal conductive composition formed by blending a thermal conductive filler of not less than 600 mass parts to 100 mass parts of a liquid silicone having a viscosity in a range of 20 to 2000 mPa·s. Since the thermal conductive composition is not crosslinked further or cured at a normal temperature of 25° C., it keeps a putty state, and the thermal conductivity is not less than 3 W/m·K. A heat-dissipating putty sheet according to the present invention is formed by applying the thus obtained thermal conductive composition onto a release sheet. The heat-dissipating putty sheet having a thickness ranging from 0.5 mm to 3 mm can be released manually from a release base, or it can be transferred from a release sheet to a heat-generating part or a dissipator so as to be attached to a desired position easily.

Abstract: A thermally conductive sheet includes a polyolefin elastomer mixed with a thermally conductive filler. The amount of volatile organic gas generated from the sheet is not more than 1000 &mgr;g/cm2 per unit surface area. The amount of volatile corrosive gas generated from the sheet is not more than 10 &mgr;g/cm2 per unit surface area. The sheet has a thermal conductivity of 0.5 to 20 W/m·K. This thermally conductive sheet generates fewer volatile substances and can be used even in a closed place.