Abstract: Provided is a manufacturing apparatus that manufactures a high-quality manufacturing object by using component information per unit of individual electronic component or per unit of package in a plurality of electronic components that have been packaged. The manufacturing apparatus is a manufacturing apparatus that manufactures a product by taking out each electronic component from packaged components in which a plurality of electronic components are packaged.

Abstract: An information administration system configured of: a component information management apparatus (4) including a component information storing unit (41) storing component information after sectionalizing the component information into public information and non-public information, and also sectionalizing the non-public information into information for designing and information for manufacturing, and an encryption processing unit (42) encrypting the non-public information; a designing information management apparatus (2) including a first component information receiving unit (24) receiving the component information, a first decryption unit (25) decrypting non-public component information for designing, and a designing information storing unit (22) storing designing information that is designed by adding the received component information thereto; and a manufacturing apparatus (3) including a second decryption unit (33) decrypting the received non-public component information for manufacturing, and a drive cont

Abstract: Provided is a manufacturing apparatus that manufactures a high-quality manufacturing object by using component information per unit of individual electronic component or per unit of package in a plurality of electronic components that have been packaged. The manufacturing apparatus is a manufacturing apparatus that manufactures a product by taking out each electronic component from packaged components in which a plurality of electronic components are packaged.

Abstract: There is provided a 3-dimensional coordinate specifying device which can accurately specify a set or sets of optional coordinates in a 3-dimensional space by a simple manipulation. The 3-dimensional coordinate specifying device includes a standard plane setting section 22 for setting an optional standard flat plane 31 in a 3-dimensional space, a standard point determining section 23 for determining values of coordinates of an optional point on the set standard flat plane 31, a light beam emitting section 25 for emitting an imaginary light beam 33 at an optional angle from the determined standard point 32, a point specifying section 26 for specifying an optional point on the emitted imaginary light beam, and a coordinate calculating section 27 for calculating 3-dimensional coordinates of the specified point.

Abstract: An information administration system configured of: a component information management apparatus (4) including a component information storing unit (41) storing component information after sectionalizing the component information into public information and non-public information, and also sectionalizing the non-public information into information for designing and information for manufacturing, and an encryption processing unit (42) encrypting the non-public information; a designing information management apparatus (2) including a first component information receiving unit (24) receiving the component information, a first decryption unit (25) decrypting non-public component information for designing, and a designing information storing unit (22) storing designing information that is designed by adding the received component information thereto; and a manufacturing apparatus (3) including a second decryption unit (33) decrypting the received non-public component information for manufacturing, and a drive cont

Abstract: There is provided a 3-dimensional coordinate specifying device which can accurately specify a set or sets of optional coordinates in a 3-dimensional space by a simple manipulation. The 3-dimensional coordinate specifying device includes a standard plane setting section 22 for setting an optional standard flat plane 31 in a 3-dimensional space, a standard point determining section 23 for determining values of coordinates of an optional point on the se standard flat plane 31, a light beam emitting section 25 for emitting an imaginary light beam 33 at an optional angle from the determined standard point 32, a point specifying section 26 for specifying an optional point on the emitted imaginary light beam, and a coordinate calculating section 27 for calculating 3-dimensional coordinates of the specified point.

Abstract: Wiring pattern characteristic evaluation mounting boards in which characteristics of wiring patterns formed on the mounting boards are previously evaluated when the mounting boards are manufactured in mass-production, and more particularly relates to such wiring pattern characteristic evaluation mounting boards in which characteristics of wiring patterns to a high frequency pulse signal or a high speed pulse signal are evaluated.

Abstract: Wiring pattern characteristic evaluation mounting boards in which characteristics of wiring patterns formed on the mounting boards are previously evaluated when the mounting boards are manufactured in mass-production, and more particularly relates to such wiring pattern characteristic evaluation mounting boards in which characteristics of wiring patterns to a high frequency pulse signal or a high speed pulse signal are evaluated.