Patents by Inventor Hak Sim

Hak Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157878
    Abstract: A luggage board for a vehicle includes a core layer; a first layer covering a portion of the core layer; and a second layer covering a remaining portion of the core layer except for a region covered by the first layer. End portions of the first layer and the second layer disposed on a side surface of the core layer are bonded to each other.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Hanwha Advanced Materials Corporation
    Inventors: Hee Sang PARK, Won Jong Lee, Sang Eun Jahng, Yeon Sim Yoon, Seung Kun Lee, Seok Cheol Kim, Dong Han Lee, Hak Bong Lee, Eun Gi Kim, Jae Sung Byun
  • Publication number: 20070177662
    Abstract: A line card is proposed in which one or more DMT processing modules 1 communicate with a data link layer platform, such as an ATM, POSPHY or Ethernet processor. The data relating to a single symbol is transmitted between the data link layer platform and a given one of DMT processing modules in a plurality of data portions spaced apart in time. The data portions relating to different channels of a given DMT processing module (or to different DMT processing modules) are interleaved in time. Since the data portions of a given symbol are spaced apart in time, the data relating to a single symbol is transmitted over a longer time period than in conventional devices which reduces the effective burstiness of the traffic, and thus reduces the memory requirements of the data link layer platform.
    Type: Application
    Filed: February 1, 2006
    Publication date: August 2, 2007
    Inventors: Raj Jain, Hak Sim
  • Publication number: 20060115142
    Abstract: An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.
    Type: Application
    Filed: January 13, 2006
    Publication date: June 1, 2006
    Inventor: Hak Sim
  • Publication number: 20060056525
    Abstract: Techniques which reduce the computational burden of the IFFT/FFT section of a DSL data transmission/reception apparatus, taking into account the nature of conventional IFFT/FFT algorithms. These algorithms operate using “butterflies” representing complex calculations performed on input values. The butterflies are here referred to as “simple” if all the input values are zero or if only one input value is non-zero. The invention proposes that the tones which have non-zero amplitudes are selected to maximize (or at least increase) the number of simple butterflies. This is done either in designing the band plans of the communication, or in designing the band plan of a mode of operation of the apparatus having a reduced data transmission rate. The IFFT/FFT section receives information indicating that the IFFT/FFT algorithm can be simplified based on knowledge of which of the input values will be zero, and changes its mode of operation accordingly.
    Type: Application
    Filed: March 4, 2005
    Publication date: March 16, 2006
    Inventors: Raj Jain, Hak Sim
  • Publication number: 20060041734
    Abstract: An ethernet switch associates addresses in a look-up table with received MAC addresses using a CRC algorithm, so that correspondence data about each MAC address can be stored in the corresponding section of the look-up table. When, as the look-up table is constructed, a given MAC address A0 hashes to an address H0 which is already associated with a previous MAC address, the MAC address is re-hashed using Walsh codes W1,m to provide a different look-up table address H1. This procedure can be performed any number of times y to generate different addresses Hn for n=1, . . . y. If it is performed sufficiently frequently, then it is likely that an address will be found which is free. In this way, the number of MAC addresses which will typically be associated with a single look-up table address is reduced, preferably to only one.
    Type: Application
    Filed: July 1, 2002
    Publication date: February 23, 2006
    Inventors: Swee Lim, Hak Sim
  • Publication number: 20050243856
    Abstract: An Ethernet switch has at least one ingress/egress port 1 which is operable in two modes, in a first mode as a GE port and in a second mode as a plurality of FE ports. The port has 8 MAC interfaces 3 each of which is capable of receiving/transmitting FE packets, and at least one of the MAC interfaces can be configured to receive/transmit GE packets. Thus, the port has two modes of operation. The port further includes receive and transmit modules 5, 7 which receive GE and FE packets from, and transmit GE and FE packets to, the interfaces. If there are 8 such ports in the Ethernet switch, then by switching different numbers of the ports between the two modes, the switch may operate in 9 different modes: as 8 GE ports, 7 GE ports and 8 FE ports, 2 GE ports and 48 FE ports, 1 GE port and 56 FE ports, or simply as 64 FE ports.
    Type: Application
    Filed: September 6, 2002
    Publication date: November 3, 2005
    Applicant: Infineon Technologies AG
    Inventors: Shridhar Mubaraq Mishra, Tina Zhang, Chunfeng Hu, Hak Sim
  • Publication number: 20050013474
    Abstract: An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.
    Type: Application
    Filed: July 14, 2004
    Publication date: January 20, 2005
    Inventor: Hak Sim
  • Publication number: 20040086198
    Abstract: A system for inspecting components is provided. The system includes a light source illuminating a component feature so as to create a specular or non-lambertian reflection off the component feature. An image sensor is positioned to receive the specular or non-lambertian reflection and to generate point brightness data and point position data, such as for a point of light reflected off the component feature. A height measurement system receives the point brightness data and the point position data and generates feature height data.
    Type: Application
    Filed: November 5, 2002
    Publication date: May 6, 2004
    Inventors: Gerald Brown, Richard Goedeken, Charles Harris, Hak Sim, Weerakiat Wahawisan