Abstract: An apparatus for measuring a mask error and a method for measuring a mask error are provided. The apparatus for measuring a mask error includes a stage configured to accommodate a reference mask having a reference pattern, and a target mask adjacent to the reference mask such that a mask pattern of the target mask faces the reference pattern, a light source configured to irradiate the first beam onto the reference mask and the target mask, a light receiving unit including an image sensor, and the image sensor configured to receive a composite image including a first image generated from the reference pattern and a second image generated from the mask pattern, and generate a third image from the first image and the second image, and a measuring unit configured to measure an error of the mask pattern from the third image.

Abstract: An apparatus for measuring a mask error and a method for measuring a mask error are provided. The apparatus for measuring a mask error includes a stage configured to accommodate a reference mask having a reference pattern, and a target mask adjacent to the reference mask such that a mask pattern of the target mask faces the reference pattern, a light source configured to irradiate the first beam onto the reference mask and the target mask, a light receiving unit including an image sensor, and the image sensor configured to receive a composite image including a first image generated from the reference pattern and a second image generated from the mask pattern, and generate a third image from the first image and the second image, and a measuring unit configured to measure an error of the mask pattern from the third image.

Abstract: A method of aligning an object may include obtaining a first actual image of a first pattern on the object, setting the first actual image as a first reference image, obtaining a second actual image of a second pattern on the object, comparing the second actual image with the first reference image to obtain first relative position difference values of the second actual image with respect to the first reference image, and converting the first relative position difference values into first absolute position difference values with respect to a reference point on the object.

Abstract: An apparatus for inspecting, measuring, or inspecting and measuring a reflective photomask may comprise a light illuminating part including a light source and beam shaping part; a stage configured to cause the light generated to be incident at an angle through the beam shaping part; and/or a light detector configured to receive optical image information of the photomask mounted on the stage. An apparatus for inspecting, measuring, or inspecting and measuring a reflective photomask may comprise a light illuminating part including a light source and configured to adjust a progress direction of light from the light source at an angle; a stage in a direction at which the light is irradiated from the light illuminating part at the angle and configured to mount the photomask; a slit plate between the light illuminating part and the stage; and/or a light detector configured to receive image information of the photomask.

Abstract: A method of forming a photomask using a calibration pattern that may exactly transfer a desired pattern to a substrate. The method includes providing one-dimensional calibration design patterns each having first design measures and providing two-dimensional calibration design patterns each having second design measures; obtaining one-dimensional calibration measured patterns using the one-dimensional calibration design patterns and obtaining two-dimensional calibration measured patterns using the two-dimensional calibration design patterns; obtaining first measured measures of the one-dimensional calibration measured patterns and obtaining second measured measures of the two-dimensional calibration measured patterns; establishing a correlation between the first measured measures and the second measured measures; and converting a main measured measure of a main pattern into a corresponding one of the first measured measures using the correlation.

Abstract: A method of forming a photomask using a calibration pattern that may exactly transfer a desired pattern to a substrate. The method includes providing one-dimensional calibration design patterns each having first design measures and providing two-dimensional calibration design patterns each having second design measures; obtaining one-dimensional calibration measured patterns using the one-dimensional calibration design patterns and obtaining two-dimensional calibration measured patterns using the two-dimensional calibration design patterns; obtaining first measured measures of the one-dimensional calibration measured patterns and obtaining second measured measures of the two-dimensional calibration measured patterns; establishing a correlation between the first measured measures and the second measured measures; and converting a main measured measure of a main pattern into a corresponding one of the first measured measures using the correlation.

Abstract: A method of fabricating a photomask may include forming a light-shielding layer and a first resist film on a substrate, forming a first resist pattern by exposing first exposed regions of the first resist film to a first exposure source that may have a first energy, forming a first light shielding pattern by etching the selectively exposed light-shielding layer by using the first resist pattern as an etching mask, removing the first resist pattern, forming a second resist film on the first light-shielding layer, exposing second exposed regions of the second resist film that may have a desired pattern shape to a second exposure source that may have a second energy, forming a second light shielding pattern by etching the selectively exposed first light shielding pattern by using the second resist pattern as an etching mask, and removing the second resist pattern.

Abstract: A method of fabricating a photomask may include forming a light-shielding layer and a first resist film on a substrate, forming a first resist pattern by exposing first exposed regions of the first resist film to a first exposure source that may have a first energy, forming a first light shielding pattern by etching the selectively exposed light-shielding layer by using the first resist pattern as an etching mask, removing the first resist pattern, forming a second resist film on the first light-shielding layer, exposing second exposed regions of the second resist film that may have a desired pattern shape to a second exposure source that may have a second energy, forming a second light shielding pattern by etching the selectively exposed first light shielding pattern by using the second resist pattern as an etching mask, and removing the second resist pattern.

Abstract: A method of fabricating a photomask may include forming a light-shielding layer and a first resist film on a substrate, forming a first resist pattern by exposing first exposed regions of the first resist film to a first exposure source that may have a first energy, forming a first, light shielding pattern by etching the selectively exposed light-shielding layer by using the first resist pattern as an etching mask, removing the first resist pattern, forming a second resist film on the first light-shielding layer, exposing second exposed regions of the second resist film that may have a desired pattern shape to a second exposure source that may have a second energy, forming a second light shielding pattern by etching the selectively exposed first light shielding pattern by using the second resist pattern as an etching mask, and removing the second resist pattern.

Abstract: The present invention relates to a waveguide amplifier which is comprised of silica or silica-related material co-doped with silicon nanoclusters and rare earth elements, and more particularly, to a waveguide amplifier with higher efficiency enhanced by top-pumping method and focusing means for pumping light. The waveguide amplifier of the present invention comprises of: (a) a substrate; (b) an optical waveguide including: a lower cladding layer formed on the substrate; a core layer which is made of silica or silica-related material co-doped with silicon nanoclusters and rare earth elements on the lower cladding layer and has a refractive index higher than that of the lower cladding; and an upper cladding layer formed on the core layer; and (c) a light source, spaced apart from the waveguide, for optically pumping the waveguide, wherein the waveguide amplifier operates by exciting the rare earth elements through electron-hole combinations in the silicon nanoclusters.

Abstract: Thin film for optical applications, light-emitting structure using the same and the fabrication method thereof are disclosed. The present invention provides a silica or silica-related thin film for optical applications in which silicon nanoclusters and rare earth elements are co-doped. The average size of the silicon nanoclusters is less than 3 nm and the concentration of the rare earth elements is less than 0.1 atomic %. The ratio of the rare earth element concentration to that of silicon nanoclusters is controlled to range from 1 to 10 in the thin film. The thin film emits light by exciting the rare earth elements through electron-hole recombinations in the silicon nanoclusters. According to the present invention, the conditions such as the size and concentration of the silicon nanoclusters, the concentration of the rare earth element, and their concentration ratio are specifically optimized to fabricate optical devices with better performance.

Abstract: The present invention relates to a input light signal waveguide amplifier which is comprised of silica or silica-related material co-doped with silicon nanoclusters and rare earth elements, and more particularly, to a pumping light h 100 waveguide amplifier with higher efficiency enhanced by top-pumping method and focusing means for pumping light. The waveguide amplifier of the present invention comprises of: (a) a substrate; (b) an optical waveguide including: a lower cladding layer formed on the substrate; a core layer which is made of silica or silica-related material co-doped with silicon nanoclusters and rare earth elements on the lower cladding layer and has a refractive index higher than that of the lower cladding; and an upper cladding layer formed on the core layer; and (c) a light source, spaced apart from the waveguide, for optically pumping the waveguide, wherein the waveguide amplifier operates by exciting the rare earth elements through electron-hole combinations in the silicon nanoclusters.

Abstract: Thin film for optical applications, light-emitting structure using the same and the fabrication method thereof are disclosed. The present invention provides a silica or silica-related thin film for optical applications in which silicon nanoclusters and rare earth elements are co-doped. The average size of the silicon nanoclusters is less than 3 nm and the concentration of the rare earth elements is less than 0.1 atomic %. The ratio of the rare earth element concentration to that of silicon nanoclusters is controlled to range from 1 to 10 in the thin film. The thin film emits light by exciting the rare earth elements through electron-hole recombinations in the silicon nanoclusters. According to the present invention, the conditions such as the size and concentration of the silicon nanoclusters, the concentration of the rare earth element, and their concentration ratio are specifically optimized to fabricate optical devices with better performance.