Patents by Inventor Ham-Ming Hsieh

Ham-Ming Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7301604
    Abstract: A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: November 27, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Hung Lin, Louie Liu, Li-Kong Turn, Chi-Hung Liao, Ham-Ming Hsieh, Yi-Chang Sung, Hsin-Chun Chiang
  • Publication number: 20050185170
    Abstract: A method and system for identifying a defocus wafer by mapping a topography of each wafer in a first wafer batch using a level sensor apparatus (100); calculating a focus spot deviation (402) from the data, the focus spot deviation (402) corresponding to a height by which a focus spot of a photo exposure module would be defocused by the topography; converting the focus spot deviation (402) to a corresponding wafer stage set point to which the photo exposure module is set, to focus the focus spot on each wafer in the wafer batch; and identifying a defocus wafer in the wafer batch, as a wafer having a topography that would defocus the focus spot, even when the photo exposure module is set to the wafer stage set point.
    Type: Application
    Filed: February 25, 2004
    Publication date: August 25, 2005
    Inventors: Chun-Hung Lin, Louie Liu, Li-Kong Turn, Chi-Hung Liao, Ham-Ming Hsieh, Yi-Chang Sung, Hsin-Chun Chiang