Abstract: The present invention relates to an improved light emitting diode (LED) assembly and method of manufacture which enables the fixing of LED chips to a much broader range of surfaces or objects, amongst other benefits. In particular, the invention relates to a metal core printed circuit board (MCPCB) including on a first surface an LED die, and on a second surface a heat spreader substrate. In a preferred embodiment, the MCPCB is a longitudinal rivet (or screw or the like) whereby the first surface is on the head of the rivet and the second surface extends along its length, the MCPCB rivet being adapted for quick and simple installation to a heat sink and/or PCB or MCPCB.

Abstract: The present invention relates to an improved light emitting diode (LED) assembly and method of manufacture which enables the fixing of LED chips to a much broader range of surfaces or objects, amongst other benefits. In particular, the invention relates to a metal core printed circuit board (MCPCB) including on a first surface an LED die, and on a second surface a heat spreader substrate. In a preferred embodiment, the MCPCB is a longitudinal rivet (or screw or the like) whereby the first surface is on the head of the rivet and the second surface extends along its length, the MCPCB rivet being adapted for quick and simple installation to a heat sink and/or PCB or MCPCB.

Abstract: A method for causing an action to be performed in a device, the method including the steps of in a processing system of the device, receiving an indication of movement of at least a portion of the device, the movement being associated with an action option, and causing the action to be performed in respect of the movement.