Patents by Inventor Han-Joon Kim

Han-Joon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143114
    Abstract: A driving circuit includes: a display driver to generate a horizontal synchronization signal and a vertical synchronization signal according to a first clock signal of a first oscillator; a sensor driver to generate a touch signal according to a second clock signal of a second oscillator; and a determination circuit to detect a cycle of at least one of the horizontal synchronization signal or the vertical synchronization signal according to the second clock signal, and output a detection signal when the cycle is out of a range. The determination circuit is a part of the display driver or the sensor driver.
    Type: Application
    Filed: June 26, 2023
    Publication date: May 2, 2024
    Inventors: Jun Young KO, Tae Hyeon YANG, Han Su CHO, Tae Joon KIM, Hyun Wook CHO, Jae Woo CHOI
  • Publication number: 20240125566
    Abstract: There is provided a heat transfer member which is made of an aluminum alloy including silicon (Si), iron (Fe), and magnesium (Mg). The aluminum alloy further includes at least one or two or more of copper (Cu), manganese (Mn), zinc (Zn), titanium (Ti), calcium (Ca), tin (Sn), phosphorus (P), chromium (Cr), zirconium (Zr), nickel (Ni), strontium (Sr), and vanadium (V).
    Type: Application
    Filed: April 13, 2023
    Publication date: April 18, 2024
    Applicant: Lemon Metal Inc.
    Inventors: Se Joon HWANG, Han Goo KIM, Kwang Hoon PARK
  • Publication number: 20240127950
    Abstract: Provided is a disease prediction method and apparatus. The disease prediction apparatus may receive a medical image and clinical information, identify, from the medical image, quantitative data comprising a volume of at least one anatomical structure, and predict a disease occurrence based on the clinical information and the quantitative data. An artificial intelligence model may be used for each of identification of an anatomical structure and prediction of the disease occurrence. The disclosure was supported by the “AI Precision Medical Solution (Doctor Answer 2.0) Development” project hosted by Seoul National University Bundang Hospital (Project Serial No.: 1711151151, Project No.: S0252-21-1001).
    Type: Application
    Filed: July 19, 2023
    Publication date: April 18, 2024
    Applicant: Medicalip Co., Ltd.
    Inventors: Sang Joon Park, Jong Min Kim, Han Jae Chung
  • Publication number: 20240095894
    Abstract: Disclosed is a medical image conversion method and apparatus. The medical image conversion apparatus trains a first artificial intelligence model to output a second contrast-enhanced image, based on first learning data including a pair of a first contrast-enhanced image and a first non-contrast image, and trains a second artificial intelligence model to output a second non-contrast image, based on second learning data including a pair of the first non-contrast image of the first learning data and the second contrast-enhanced image. The disclosure was supported by the “AI Precision Medical Solution (Doctor Answer 2.0) Development” project hosted by Seoul National University Bundang Hospital (Project Serial No.: 1711151151, Project No.: S0252-21-1001).
    Type: Application
    Filed: July 19, 2023
    Publication date: March 21, 2024
    Applicant: Medicalip Co., Ltd.
    Inventors: Sang Joon Park, Jong Min Kim, Han Jae Chung, Seung Min Ham
  • Publication number: 20230329654
    Abstract: Limited precision of head standardization is a problem in the prior art. In the present invention, positioning of a patient head is standardized using two cameras, namely, a first digital camera 11 and a second digital camera 12. In a profile positioning step, while a display on a first monitor 13 is viewed, the vertical position of the first digital camera 11 is adjusted, and instructions are given to the patient to adjust the forward-backward position of the head so that the point of intersection of a first vertical reference line VL1 and a first horizontal reference line HL1 corresponding to the camera optical axis of the first digital camera 11 is in the center of the ear canal of the patient.
    Type: Application
    Filed: September 9, 2021
    Publication date: October 19, 2023
    Inventor: Han-Joon KIM
  • Publication number: 20230316057
    Abstract: The present specification discloses an arithmetic processing device which has a high processing rate with a low cost. The arithmetic processing device according to the present specification is an arithmetic processing device comprising a fetch unit which reads data required for a calculation for performing processing of a neural network from a memory, and provides the data to an arithmetic unit. The fetch unit may include: a fetch buffer into which data stored in each of data memory slices is fetched; and an interface controller for assigning a node ID corresponding to each of the data memory slices to the data fetched into the fetch buffer, and controlling a timing of outputting the fetched data according to the node ID.
    Type: Application
    Filed: October 12, 2020
    Publication date: October 5, 2023
    Applicant: FuriosaAl Co.
    Inventors: Han Joon Kim, Young Geun Choi, Byung Chul Hong
  • Publication number: 20230270527
    Abstract: Improvement is required in many aspects in order to enhance a treatment effect by reliably applying necessary orthodontic force for moving teeth. The present invention provides a mouthpiece type removable orthodontic appliance including a base portion (10), and a fitting portion (20) provided on the base portion. The base portion (10) is a thin plate formed of an inelastic material and extending along the shape of an occlusal surface of a dental arch of a jaw on which the orthodontic appliance is fitted. The fitting portion (20) includes a movement member (30, 40) to be fitted on a tooth intended to be moved, and a gripping member (50, 60) to be fitted on a tooth unintended to be moved.
    Type: Application
    Filed: June 3, 2021
    Publication date: August 31, 2023
    Inventor: Han-Joon KIM
  • Publication number: 20230244620
    Abstract: The present specification discloses a calculation processing device which has a high processing rate with low cost. The calculation processing device according to the present specification is a calculation processing device including a fetch unit which reads, from a memory, data required for a calculation to perform processing of a neural network, and provides the data to a calculation unit. The fetch unit may comprise: multiple routers each having a data processing mapping table in which a scheme of processing input data is recorded according to a node identifier (ID) of the input data; and a fetch network controller which controls respective data processing mapping tables of the multiple routers.
    Type: Application
    Filed: October 12, 2020
    Publication date: August 3, 2023
    Applicant: FuriosaAl Co.
    Inventors: Han Joon Kim, Young Geun Choi, Byung Chul Hong
  • Publication number: 20230080939
    Abstract: A semiconductor device includes a dielectric layer, a conductive layer formed over the dielectric layer, and a reduction sacrificial layer formed between the dielectric layer and the conductive layer, wherein the reduction sacrificial layer includes a first reduction sacrificial material having higher electronegativity than the dielectric layer, and a second reduction sacrificial material having higher electronegativity than the first reduction sacrificial material.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 16, 2023
    Inventors: Sang Young LEE, Kyung Woong PARK, Han Joon KIM
  • Publication number: 20230029417
    Abstract: Methods and systems for a near-field communication. In one aspect, a method of fabricating a relay for a near-field communication system comprises the steps of providing a flexible substrate; and providing an electric circuit on the flexible substrate, wherein the electric circuit comprises a hub inductor pattern configured to receive and transmit via electro-magnetic induction; one or more terminal inductor patterns laterally spaced apart from the hub inductor pattern relative to a surface of the flexible substrate and configured to receive and transmit via electro-magnetic induction; and a connecting trace between the hub inductor and the one or more terminal inductors.
    Type: Application
    Filed: November 17, 2020
    Publication date: January 26, 2023
    Inventors: John S Y HO, Rongzhou LIN, Han-Joon KIM, Sippanat ACHAVANANTHADITH, Selman Ahmet KURT
  • Patent number: 11532527
    Abstract: A semiconductor device includes a dielectric layer, a conductive layer formed over the dielectric layer, and a reduction sacrificial layer formed between the dielectric layer and the conductive layer, wherein the reduction sacrificial layer includes a first reduction sacrificial material having higher electronegativity than the dielectric layer, and a second reduction sacrificial material having higher electronegativity than the first reduction sacrificial material.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: December 20, 2022
    Assignee: SK hynix Inc.
    Inventors: Sang Young Lee, Kyung Woong Park, Han Joon Kim
  • Publication number: 20220351903
    Abstract: A semiconductor device includes: a first electrode; a second electrode; and a multi-layered stack including a hafnium oxide layer of a tetragonal crystal structure which is positioned between the first electrode and the second electrode, wherein the multi-layered stack includes: a seed layer for promoting tetragonal crystallization of the hafnium oxide layer and having a tetragonal crystal structure; and a booster layer for boosting a dielectric constant of the hafnium oxide layer.
    Type: Application
    Filed: July 8, 2022
    Publication date: November 3, 2022
    Inventors: Se-Hun KANG, Han-Joon KIM, Ki-Vin IM
  • Patent number: 11410813
    Abstract: A semiconductor device includes: a first electrode; a second electrode; and a multi-layered stack including a hafnium oxide layer of a tetragonal crystal structure which is positioned between the first electrode and the second electrode, wherein the multi-layered stack includes: a seed layer for promoting tetragonal crystallization of the hafnium oxide layer and having a tetragonal crystal structure; and a booster layer for boosting a dielectric constant of the hafnium oxide layer.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: August 9, 2022
    Assignee: SK hynix Inc.
    Inventors: Se-Hun Kang, Han-Joon Kim, Ki-Vin Im
  • Publication number: 20220245436
    Abstract: A device for processing convolution operations includes: a processor that executes, in a neural network, a convolution operation on input data in a form of width×height×input channel and on a filter in a form of K×K×input channel or K×K to correspond to a form of the input data, K being an integer greater than or equal to one, and that generates output data in a form of width×height×output channel; and a reader that sequentially reads, from a memory storing the input data, a data group having more pieces of data than unit data throughput of an operator, and provides the data group to the operator to reuse at least one piece of data constituting the data group in the convolution operation. The processor executes, by using one or more operators identical to the operator, the convolution operation multiple times based on the unit data throughput.
    Type: Application
    Filed: June 2, 2020
    Publication date: August 4, 2022
    Applicant: FuriosaAI Co.
    Inventors: Han Joon Kim, Young Geun Choi, Byung Chul Hong, Min Jae Kim, Bon Cheol Gu
  • Publication number: 20210183718
    Abstract: A semiconductor device includes a dielectric layer, a conductive layer formed over the dielectric layer, and a reduction sacrificial layer formed between the dielectric layer and the conductive layer, wherein the reduction sacrificial layer includes a first reduction sacrificial material having higher electronegativity than the dielectric layer, and a second reduction sacrificial material having higher electronegativity than the first reduction sacrificial material.
    Type: Application
    Filed: March 2, 2021
    Publication date: June 17, 2021
    Inventors: Sang Young LEE, Kyung Woong PARK, Han Joon KIM
  • Patent number: 11023660
    Abstract: The present invention relates to a data sharing service system, and a method and a device for a data sharing service, and to the data sharing service in a multi-device environment. Particularly, the present invention enables a user to summarize information on content being used or to transmit data on specific content to terminal device of another party by using a messenger, so that the user can gather the contents of interested articles (or books) to manage the contents by compiling statistics and the user can easily notify the other party of the contents of the articles (or books) without requiring the user to write out the interested contents one by one when using the messenger.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: June 1, 2021
    Assignee: SK PLANET CO., LTD.
    Inventors: Hai Gang Roh, Han Joon Kim
  • Publication number: 20210142946
    Abstract: A semiconductor device includes: a first electrode; a second electrode; and a multi-layered stack including a hafnium oxide layer of a tetragonal crystal structure which is positioned between the first electrode and the second electrode, wherein the multi-layered stack includes: a seed layer for promoting tetragonal crystallization of the hafnium oxide layer and having a tetragonal crystal structure; and a booster layer for boosting a dielectric constant of the hafnium oxide layer.
    Type: Application
    Filed: May 4, 2020
    Publication date: May 13, 2021
    Inventors: Se-Hun KANG, Han-Joon KIM, Ki-Vin IM
  • Patent number: 10964614
    Abstract: A semiconductor device includes a dielectric layer, a conductive layer formed over the dielectric layer, and a reduction sacrificial layer formed between the dielectric layer and the conductive layer, wherein the reduction sacrificial layer includes a first reduction sacrificial material having higher electronegativity than the dielectric layer, and a second reduction sacrificial material having higher electronegativity than the first reduction sacrificial material.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: March 30, 2021
    Assignee: SK hynix Inc.
    Inventors: Sang Young Lee, Kyung Woong Park, Han Joon Kim
  • Patent number: 10642777
    Abstract: A method and system for maximizing bandwidth of a Peripheral Component Interconnect Express (PCIe) Peer-to-Peer (P2P) connection determine a maximum bandwidth and a maximum read request size of a first device, determining a maximum bandwidth and a minimum payload size of a second device, calculate a calculated maximum payload size of the second device by using the maximum read request size of the first device and a bandwidth ratio between the first device and the second device, compare the minimum payload size of the second device with the calculated maximum payload size, and set an operational payload size of the second device to the calculated maximum payload size when the calculated maximum payload size is equal to or greater than the minimum payload size.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: May 5, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Uk Kim, Han-Joon Kim, Jae-Hong Min
  • Publication number: 20200105633
    Abstract: A semiconductor device includes a dielectric layer, a conductive layer formed over the dielectric layer, and a reduction sacrificial layer formed between the dielectric layer and the conductive layer, wherein the reduction sacrificial layer includes a first reduction sacrificial material having higher electronegativity than the dielectric layer, and a second reduction sacrificial material having higher electronegativity than the first reduction sacrificial material.
    Type: Application
    Filed: December 27, 2018
    Publication date: April 2, 2020
    Inventors: Sang Young LEE, Kyung Woong PARK, Han Joon KIM