Patents by Inventor Han Liu

Han Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240156649
    Abstract: A highly extensible nonwoven web is provided. The highly extensible nonwoven web may include continuous multi-component fibers. The continuous multi-component fibers may include polypropylene, wherein the polypropylene has a crystallinity of less than about 41%. The polypropylene may have a melting temperature of less than about 161° C. The highly extensible nonwoven web may define a plurality of apertures. The apertures may be patterned. The highly extensible nonwoven web may form a portion of an absorbent article.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Han XU, Meganne FRISCH, Jaroslav KOHUT, Sascha KREISEL, Jiri KUMMER, Fang LIU, Michael J. RODDY, Patricia ROLON, Eric R. SCHURDAK
  • Publication number: 20240160906
    Abstract: A computing system including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer included in an MoE model. The processing devices are configured to execute the MoE layer at least in part by, during a first collective communication phase between the processing devices, splitting each of a plurality of first input tensors along a first dimension to obtain first output tensors. Executing the MoE layer further includes processing the first output tensors at a respective a plurality of expert sub-models to obtain a plurality of second input tensors. Executing the MoE layer further includes, during a second collective communication phase between the processing devices, receiving the second input tensors from the expert sub-models and concatenating the second input tensors along the first dimension to obtain second output tensors. Executing the MoE layer further includes outputting the second output tensors as output of the MoE layer.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Yifan XIONG, Changho HWANG, Wei CUI, Ziyue YANG, Ze LIU, Han HU, Zilong WANG, Rafael Omar SALAS, Jithin JOSE, Prabhat RAM, Ho-Yuen CHAU, Peng CHENG, Fan YANG, Mao YANG, Yongqiang XIONG
  • Publication number: 20240162109
    Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 16, 2024
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke
  • Publication number: 20240160894
    Abstract: A computing system is provided, including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer included in an MoE model. The MoE layer includes a plurality of expert sub-models that each have a respective plurality of parameter values. The MoE layer is configured to be switchable between a data parallel mode and an expert-data-model parallel mode without conveying the respective parameter values of the expert sub-models among the plurality of processing devices.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Yifan XIONG, Changho HWANG, Wei CUI, Ziyue YANG, Ze LIU, Han HU, Zilong WANG, Rafael Omar SALAS, Jithin JOSE, Prabhat RAM, Ho-Yuen CHAU, Peng CHENG, Fan YANG, Mao YANG, Yongqiang XIONG
  • Patent number: 11984453
    Abstract: An array substrate includes: a first substrate (10), including a plurality of sub-pixel regions (101) arranged in an array along a row direction (X) and a column direction (Y); a pixel circuit layer, including a plurality of sub-pixel circuits; a planarization layer (17), provided with a first via hole (170) located in the sub-pixel regions (101), and includes at least one pattern portion (171), the pattern portion (171) includes a plurality of pattern units (171a) arranged in an array along the row direction (X) and the column direction (Y); and a reflective electrode layer, wherein the reflective electrode layer includes a plurality of reflective electrodes (18) that are mutually disconnected, each of the reflective electrodes (18) is located in one of the sub-pixel regions (101) and is electrically connected to the sub-pixel circuit through the first via hole (170).
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: May 14, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jiguo Wang, Jian Sun, Zhao Zhang, Liang Tian, Weida Qin, Zhen Wang, Han Zhang, Wenwen Qin, Xiaoyan Yang, Yue Shan, Wei Yan, Jian Zhang, Deshuai Wang, Yadong Zhang, Jiantao Liu
  • Patent number: 11984516
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: May 14, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11981684
    Abstract: The present disclosure relates to certain macrocyclic compounds that inhibit SRC and MET, and/or CSF1R, pharmaceutical compositions containing such compounds, and methods of using such compounds to treat cancer.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: May 14, 2024
    Assignee: TURNING POINT THERAPEUTICS, INC.
    Inventors: Jingrong Jean Cui, Evan W. Rogers, Jane Ung, Jeffrey Whitten, Dayong Zhai, Wei Deng, Xin Zhang, Zhongdong Huang, Jing Liu, Han Zhang
  • Publication number: 20240154010
    Abstract: Embodiments of the present disclosure relates to a semiconductor device structure. The structure includes a source/drain epitaxial feature disposed over a substrate, a first interlayer dielectric (ILD) disposed over the source/drain epitaxial feature, a second ILD disposed over the first ILD. The second ILD includes a first dopant species having an atomic radius equal to or greater than silicon and a second dopant species having an atomic mass less than 15. The structure also includes a first conductive feature disposed in the second ILD, and a second conductive feature disposed over the source/drain epitaxial feature, the second conductive feature extending through the first ILD and in contact with the first conductive feature.
    Type: Application
    Filed: January 22, 2023
    Publication date: May 9, 2024
    Inventors: Meng-Han Chou, Kuo-Ju Chen, Su-Hao Liu, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20240155402
    Abstract: One wireless sensing method includes: generating a measurement request frame, wherein the measurement request frame is configured to carry indication information for phase report from a sensing responder, and sending the measurement request frame to the sensing responder. Another wireless sensing method includes: generating a measurement report frame, wherein the measurement report frame is configured to carry phase information, and sending the measurement report frame to a sensing initiator.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Applicant: MEDIATEK INC.
    Inventors: Tsung-Han Tsai, Hsuan-Yu Liu, Shuling Feng
  • Patent number: 11978210
    Abstract: The present disclosure relates to the technical field of growth environment control for plants, and provides a light regulation method, system, and apparatus for a growth environment of leafy vegetables. The method includes: obtaining a growth environment image and growth environment light parameters of leafy vegetables; inputting the growth environment image into an image segmentation model to obtain an initial pixel segmentation map; determining a leaf area of the leafy vegetables according to the initial pixel segmentation map by using a Class Activation Mapping (CAM)-K algorithm; inputting the leaf area and the growth environment light parameters of the leafy vegetables into a leafy vegetable growth index prediction model to obtain a growth index of the leafy vegetables; adjusting the growth environment light parameters according to the growth index of the leafy vegetables. This disclosure achieves automated and intelligent control of light conditions in the growth environment of leafy vegetables.
    Type: Grant
    Filed: October 20, 2023
    Date of Patent: May 7, 2024
    Assignee: China Agricultural University
    Inventors: Yaoguang Wei, Dong An, Han Li, Jincun Liu, Daoliang Li, Yingyi Chen
  • Publication number: 20240139715
    Abstract: A bed grading material includes fibers, a hardening agent, and a binder. The fibers include alumina, and the bed grading material may include a catalyst. The bed grading material can include a mixture of different fibers and can be vacuum formed, pressed, wet-laid, extruded, or 3D printed. The bed grading material may be beneficially incorporated into a reactor.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 2, 2024
    Inventors: Kevin E. SITERS, Chih-Han LIU, Ran W. RIOUX
  • Publication number: 20240145596
    Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 2, 2024
    Inventors: Su-Hao Liu, Kuo-Ju Chen, Kai-Hsuan Lee, I-Hsieh Wong, Cheng-Yu Yang, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Syun-Ming Jang, Meng-Han Chou
  • Publication number: 20240145691
    Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.
    Type: Application
    Filed: March 14, 2023
    Publication date: May 2, 2024
    Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
  • Publication number: 20240143529
    Abstract: A method for a host computer to access a target device via a remote extender. The target device is connected to the remote extender, and a target device driver corresponding to the target device is installed on the host computer. The method includes setting up a logic transmission pipe between the host computer and the remote extender with a network connection as the underlying transmission path, and handling an I/O request from the target device driver to access the target device via the logic transmission pipe. The method is used to allow the target device to be treated by the host computer as a local resource. Additionally, the disclosure provides a system for accessing the remote target device and a remote extender thereof.
    Type: Application
    Filed: March 9, 2023
    Publication date: May 2, 2024
    Inventors: YU-HAN LIU, SHENG-CHE CHUEH, CHONG-LI HUANG
  • Publication number: 20240146903
    Abstract: This disclosure relates generally to video coding and particularly to methods and systems for determining context for coding and decoding various syntax elements of a video stream in inter prediction modes. Various example implementations are disclosed for limiting numbers of possible coding contexts for syntax elements related to the inter prediction mode, and for selecting coding contexts for a current block based on coding information of spatially neighboring blocks and temporal motion prediction information.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 2, 2024
    Applicant: TENCENT AMERICA LLC
    Inventors: Han GAO, Xin ZHAO, Liang ZHAO, Shan LIU
  • Publication number: 20240146902
    Abstract: This disclosure relates generally to video coding and particularly to methods and systems for determining context for coding and decoding various syntax elements of a video stream in inter prediction modes. Various example implementations are disclosed for limiting numbers of possible coding contexts for syntax elements related to the inter prediction mode, and for selecting coding contexts for a current block based on coding information of spatially neighboring blocks and temporal motion prediction information.
    Type: Application
    Filed: March 16, 2023
    Publication date: May 2, 2024
    Applicant: TENCENT AMERICA LLC
    Inventors: Han GAO, Xin ZHAO, Liang ZHAO, Shan LIU
  • Publication number: 20240147718
    Abstract: Some embodiments of the present application are directed towards an integrated circuit (IC). The integrated circuit includes a semiconductor substrate including a logic region and a memory cell region. A logic device is arranged on the logic region. A memory device is arranged on the memory cell region. An isolation structure extends into a top surface of the semiconductor substrate, and laterally separates the logic region from the memory cell region. The isolation structure includes dielectric material and has an uppermost surface and a slanted upper surface extending from the uppermost surface to an edge of the isolation structure proximate to memory cell region.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Meng-Han Lin, Chih-Ren Hsieh, Chen-Chin Liu, Chih-Pin Huang
  • Patent number: 11971452
    Abstract: A device and a method for nondestructively detecting a transient characteristic of a conductive screw of a turbo-generator rotor are provided. The device includes a personal computer (PC), an extremely-steep pulse generator, an ultra-high-frequency double-isolation transformer, and a pulse emitting and coupling module, which are connected in sequence. The pulse emitting and coupling module is connected to a load. A synchronous pulse receiving non-inductive divider circuit synchronously receives a characteristic waveform from the load, and the synchronous pulse receiving non-inductive divider circuit is connected to an ultra-high-speed analog/digital (A/D) module through a nonlinear saturation amplifying circuit that amplifies a signal. The PC receives a signal from the ultra-high-speed A/D module. The load includes a positive or negative excitation lead loop that is in a 180° symmetrical and instantaneous short-circuit state and a rotor shaft.
    Type: Grant
    Filed: April 25, 2021
    Date of Patent: April 30, 2024
    Assignee: HANGZHOU HENUOVA TECHNOLOGY CO., LTD.
    Inventors: Yuewu Zhang, Jianxi Liu, Yanxing Bao, Weihua Zha, Qianyi Zhang, Dongbing Liu, Weixing Yang, Xu Han, Miaoye Li, Zirui Wang, Junliang Liu, Jie Luo, Weitao Shen, Yu Fu, Han Gao
  • Patent number: 11973027
    Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Tze-Liang Lee, Meng-Han Chou, Kuo-Ju Chen, Huicheng Chang, Tsai-Jung Ho, Tzu-Yang Ho