Abstract: A high heat resistant, low elastic modulus and fire resistant resin and its compounds are provided. The resin mainly comprises a thermo-hardening resin, a chain extender and a softening agent. Wherein the thermo-hardening resin amounts to 70˜92 wt % in the composite formula, the chain extender amounts to 3˜20 wt % in the composite formula and the softening agent amounts to 5˜10 wt % in the composite formula. The compound composed of 35˜50 wt % of the resin and 50˜65 wt % of a thermal conductive powder has a high thermal conductivity and a low elastic modulus, and is high heat resistant and fire resistant. The compound composed of 60˜95 wt % of the resin and 5˜40 wt % of a multifunctional polyester has a low dielectric constant and a low elastic modulus, and is high heat resistant and fire resistant.

Abstract: A double-sided metal drilling entry board for drilling comprises a metal bottom layer, a soft metal surface layer and a binding layer, in which the binding layer is disposed between the metal bottom layer and the soft metal surface layer to bind the metal bottom layer and the soft metal surface layer.

Abstract: A drilling entry board for a printed circuit board (PCB) includes a metal substrate and a lubricating copolymer. The lubricating copolymer is bonded on the metal substrate surface and comprises a water-soluble structure and a water insoluble structure.

Abstract: A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.