Abstract: An antenna device according to an embodiment of the present disclosure includes a dielectric layer, a first electrode layer disposed on an upper surface of the dielectric layer, the first electrode layer including a radiator and having a first mesh structure, and a second electrode layer disposed on a lower surface of the dielectric layer, the second electrode layer having a second mesh structure. The first mesh structure and the second mesh structure are aligned to be offset or staggered from each other with respect to the dielectric layer in a planar view.

Abstract: An antenna package according to an embodiment of the present disclosure includes a first antenna device including a first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the first circuit board, a second antenna unit integrated with the second circuit board, and an antenna driving integrated circuit chip mounted on the second circuit board and electrically connected to the first antenna unit and the second antenna unit. Multi-axial radiation is implemented using the antenna package with high efficiency and reliability.

Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, an antenna unit disposed on a top surface of the dielectric layer, the antenna unit including a radiator and a transmission line connected to the radiator, a dummy electrode separated from the antenna unit on the top surface of the dielectric layer, the dummy electrode at least partially surrounding the antenna unit, and a blocking pattern arranged around the antenna unit in the dummy electrode. Radiation interruption from the dummy electrode is prevented by the blocking pattern to improve radiation reliability.

Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a radiator and a dummy electrode. The radiator is disposed on the upper surface of the dielectric layer. The radiator includes a first mesh structure, and the first mesh structure includes a first antenna electrode line and a second antenna electrode line which cross each other. The dummy electrode is spaced apart from the radiator by the separation region on the upper surface of the dielectric layer. The dummy electrode includes a second mesh structure, and the second mesh structure includes a first dummy electrode line and a second dummy electrode line which cross each other. A spacing distance between the first dummy electrode line and the radiator is different from a spacing distance between the second dummy electrode line and the radiator at the separation region.

Abstract: An antenna package according to an exemplary embodiment of the present invention includes a first antenna device which includes a first antenna unit including a first radiator, a second antenna device which includes a second antenna unit including a second radiator whose polarization direction is perpendicular to the first radiator, a first circuit board electrically connected with the first antenna unit, a second circuit board electrically connected with the second antenna unit, and a third circuit board on which at least one antenna driving integrated circuit (IC) chip electrically and independently connected to the first circuit board and the second circuit board is mounted. By supplying power to two antenna devices having different polarization directions, respectively, signal interference and signal loss may be prevented, and dual polarization may be implemented.

Abstract: An antenna element according to an exemplary embodiment includes a radiation body, a first transmission line extending from the radiation body in a first direction, a second transmission line extending from the radiation body in a second direction, a first signal pad extending from an end of the first transmission line in the first direction, and a second signal pad extending from an end of the second transmission line in the second direction.

Abstract: An antenna structure of an embodiment of the present invention includes a film antenna including a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer, and a flexible circuit board including a power supply wiring electrically connected to the antenna electrode layer. A bonding region is defined by a region in which the antenna electrode layer and the power supply wiring are overlapped with each other in a planar direction, and the bonding region has a length of 1.5 mm or less. Signal efficiency and radiation reliability may be improved by adjusting a length of the bonding region.

Abstract: An antenna structure according to an embodiment of the present invention includes a film antenna including a dielectric layer, an upper electrode layer disposed on an upper surface of the dielectric layer and including a radiation pattern, a transmission line, and a ground pad, and a lower ground layer disposed on a lower surface of the dielectric layer, and a flexible circuit board including a core layer, a power supply wiring layer disposed on a lower surface of the core layer and electrically connected to the transmission line, and a ground plate disposed on an upper surface of the core layer and disposed in overlapping with the power supply wiring layer in a planar direction. Thereby, it is possible to reduce a radiation signal generated from the power supply wiring through the ground plate, suppress a noise of the antenna and increase radiation efficiency.

Abstract: An antenna structure according to an embodiment includes an antenna device, a circuit board connected to the antenna device and including an inner insulation layer, and an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board. A portion of the inner insulation layer covered by the outer insulation layer may have a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.

Abstract: An antenna structure according to an embodiment includes an antenna device including an antenna unit, a circuit board electrically connected to the antenna unit, an insulating layer covering the antenna device and a portion of the circuit board, and an air layer formed between the antenna device and the insulating layer to partially cover the antenna unit.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a first circuit board electrically connected to the antenna device. The first circuit board includes a first core layer, a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit, a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer, and a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer. The first shielding barrier at least partially covers the first connector in a planar view.

Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a radiation pattern disposed on a top surface of the dielectric layer, a signal pad electrically connected to the radiation pattern, and a ground pad spaced apart from the signal pad and having an isolation space. A length of the isolation space is greater than a length of the signal pad.

Abstract: An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

Abstract: An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

Abstract: An antenna package according to an embodiment includes an antenna device comprising an antenna unit, and a connector electrically connected to the antenna unit. The connector includes an insulator having a dielectric constant from 2 to 3.5 and a loss tangent from 0.0015 to 0.007 measured by a resonance method at 10 GHz, and a conductive connection structure insulated by the insulator and electrically connected to the antenna unit.

Abstract: An apparatus for inspecting an antenna includes a stage including a ground on which an antenna device is disposed, an inspection board configured to be in contact with and connected to the antenna device, a connection maintaining unit for maintaining a contact and connection between the antenna device and the inspection board, and an inspection unit mounted or connected to the inspection board to inspect the antenna device.

Abstract: An antenna stack structure according to an embodiment includes a protective layer, and an antenna electrode layer formed directly on a surface of the protective layer. The antenna electrode layer includes a first electrode layer and a second electrode layer having a lower reflectance than that of the first electrode layer. A visual recognition of electrode are prevented by the second electrode layer.

Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a first electrode layer disposed on a top surface of the dielectric layer, the first electrode layer including a radiation pattern, a second electrode layer disposed on a bottom surface of the dielectric layer, and a flexible circuit board connecting the first electrode layer and the second electrode layer with each other along a lateral portion of the dielectric layer. Efficiency of grounding and noise removing may be improved by the flexible circuit board.

Abstract: An antenna element according to an exemplary embodiment includes a radiation body, a first transmission line extending from the radiation body in a first direction, a second transmission line extending from the radiation body in a second direction, a first signal pad extending from an end of the first transmission line in the first direction, and a second signal pad extending from an end of the second transmission line in the second direction.

Abstract: An antenna structure includes a dielectric layer, a radiation pattern on the dielectric layer and a signal pad on the dielectric layer. The signal pad includes a bonding region that is electrically connected to the radiation pattern and is configured to be bonded to an external circuit structure, and a margin region adjacent to the bonding region. Impedance mismatching is prevented by the margin region so that radiation efficiency is improved.