Abstract: The actuator device according to the present embodiment comprises: a holder; a reflective member disposed on the holder; a rigid mover coupled to the holder; a first magnet disposed on the rigid mover; a second magnet generating a repulsive force with the first magnet; and a first driving magnet for tilting the holder, wherein the first driving magnet comprises a first surface in a direction directing toward the reflective member, wherein the second magnet comprises a first surface in a direction directing toward the reflective member, wherein the first surface of the first driving magnet comprises a first region that is the most adjacent to the second magnet, and wherein a first region of the first driving magnet having a polarity different from that of the first surface of the second magnet.

Abstract: Methods and systems are provided for learning a neural network and to determine a pose of a vehicle in an environment. A first processor performs a first feature extraction on sensor-based image data to provide a first feature map. The first processor also performs a second feature extraction on the aerial image data to provide a second feature map. Both feature maps are correlated to provide a correlation result. The first processor learns a neural network using the correlation result and ground-truth data, wherein each of the first feature extraction and the second feature is learned to extract a portion of features from the respective image data. A geo-tagged second feature map can then be retrieved by an on-board processor of the vehicle which, along with on-board processed sensor-based data by the network trained by the first processor, determines the pose of the vehicle.

Abstract: Methods and systems are provided for learning a neural network and to determine a pose of a vehicle in an environment. A first processor performs a first feature extraction on sensor-based image data to provide a first feature map. The first processor also performs a second feature extraction on the aerial image data to provide a second feature map. Both feature maps are correlated to provide a correlation result. The first processor learns a neural network using the correlation result and ground-truth data, wherein each of the first feature extraction and the second feature is learned to extract a portion of features from the respective image data. A geo-tagged second feature map can then be retrieved by an on-board processor of the vehicle which, along with on-board processed sensor-based data by the network trained by the first processor, determines the pose of the vehicle.

Abstract: A semiconductor package includes a frame having a cavity and having a wiring structure connecting first and second surfaces opposing each other; a connection structure disposed on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a semiconductor chip disposed in the cavity and having a connection pad connected to the first redistribution layer; an encapsulant encapsulating the semiconductor chip; and a second redistribution layer having a redistribution pattern and a connection via connecting the wiring structure and the redistribution pattern. The connection via includes a first via connected to the wiring structure and a second via disposed on the first via and connected to the redistribution pattern, a lower surface of the second via has an area larger than an area of an upper surface of the first via.

Abstract: Disclosed are a flexible display and an electronic device including the same, in the flexible display, a back plate has an improved structure so as to stably support a display panel even during repeated folding and unfolding operations, and also the flexible display can prevents sagging or deformation of specific constituent elements therein.

Abstract: A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.

Abstract: A semiconductor package includes a frame having a cavity and having a wiring structure connecting first and second surfaces opposing each other; a connection structure disposed on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a semiconductor chip disposed in the cavity and having a connection pad connected to the first redistribution layer; an encapsulant encapsulating the semiconductor chip; and a second redistribution layer having a redistribution pattern and a connection via connecting the wiring structure and the redistribution pattern. The connection via includes a first via connected to the wiring structure and a second via disposed on the first via and connected to the redistribution pattern, a lower surface of the second via has an area larger than an area of an upper surface of the first via.

Abstract: Disclosed are a flexible display and an electronic device including the same, in the flexible display, a back plate has an improved structure so as to stably support a display panel even during repeated folding and unfolding operations, and also the flexible display can prevents sagging or deformation of specific constituent elements therein.

Abstract: A foldable display device that enables convenient and easy coupling of a display panel to a housing is provided. The foldable display device includes a mounting member provided at a location between a lower plate and the housing and is capable of realizing a slim bezel design by eliminating coupling portions protruding from both ends of the lower plate and by improving the coupling structure between the lower plate and the housing using the mounting member.

Abstract: A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.

Abstract: Disclosed are a flexible display and an electronic device including the same, in the flexible display, a back plate has an improved structure so as to stably support a display panel even during repeated folding and unfolding operations, and also the flexible display can prevents sagging or deformation of specific constituent elements therein.

Abstract: A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.

Abstract: A semiconductor device includes: a chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the chip; a connection member disposed on the active surface of the chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member; and an under bump metallurgy (UBM) layer at least partially embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad partially embedded in the passivation layer and a UVM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other. A portion of a side surface of the UBM pad is exposed through an opening formed in the passivation layer and the opening surrounds the UBM pad.

Abstract: Disclosed are a flexible display and an electronic device including the same, in the flexible display, a back plate has an improved structure so as to stably support a display panel even during repeated folding and unfolding operations, and also the flexible display can prevents sagging or deformation of specific constituent elements therein.

Abstract: A foldable display device that enables convenient and easy coupling of a display panel to a housing is provided. The foldable display device includes a mounting member provided at a location between a lower plate and the housing and is capable of realizing a slim bezel design by eliminating coupling portions protruding from both ends of the lower plate and by improving the coupling structure between the lower plate and the housing using the mounting member.

Abstract: A semiconductor device includes: a chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the chip; a connection member disposed on the active surface of the chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member; and an under bump metallurgy (UBM) layer at least partially embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad partially embedded in the passivation layer and a UVM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other. A portion of a side surface of the UBM pad is exposed through an opening formed in the passivation layer and the opening surrounds the UBM pad.

Abstract: A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.

Abstract: A semiconductor device includes: a chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the chip; a connection member disposed on the active surface of the chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member; and an under bump metallurgy (UBM) layer at least partially embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad partially embedded in the passivation layer and a UVM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other. A portion of a side surface of the UBM pad is exposed through an opening formed in the passivation layer and the opening surrounds the UBM pad.

Abstract: The present invention relates to a printed circuit board including: a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad of which a portion is embedded in the second insulator and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pattern formed on the second insulator, and it is possible to reduce a size of the via without increasing an aspect ratio.

Abstract: There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns is formed by stacking two or more plating layers.