Patents by Inventor Hanae Hata
Hanae Hata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8633103Abstract: In order to achieve the highly reliable and highly functional semiconductor device capable of the high-speed transmission by stacking thin chips and substrates, a connecting process and a connecting structure capable of making a solid connection at a low temperature with a low load and maintaining the shape of a connecting portion even if the connecting portion is heated in the stacking process and the subsequent mounting process are provided. In a semiconductor device in which semiconductor chips or wiring boards on which semiconductor chips are mounted are stacked, a connecting structure between electrodes of the stacked semiconductor chips or wiring boards includes a pair of electrodes mainly made of Cu and a solder layer made of Sn—In based alloy sandwiched between the electrodes, and Sn—Cu—Ni intermetallic compounds are dispersed in the solder layer.Type: GrantFiled: June 13, 2010Date of Patent: January 21, 2014Assignee: Renesas Electronics CorporationInventors: Hanae Hata, Masato Nakamura, Nobuhiro Kinoshita, Jumpei Konno, Chiko Yorita
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Publication number: 20110012263Abstract: In order to achieve the highly reliable and highly functional semiconductor device capable of the high-speed transmission by stacking thin chips and substrates, a connecting process and a connecting structure capable of making a solid connection at a low temperature with a low load and maintaining the shape of a connecting portion even if the connecting portion is heated in the stacking process and the subsequent mounting process are provided. In a semiconductor device in which semiconductor chips or wiring boards on which semiconductor chips are mounted are stacked, a connecting structure between electrodes of the stacked semiconductor chips or wiring boards includes a pair of electrodes mainly made of Cu and a solder layer made of Sn—In based alloy sandwiched between the electrodes, and Sn—Cu—Ni intermetallic compounds are dispersed in the solder layer.Type: ApplicationFiled: June 13, 2010Publication date: January 20, 2011Inventors: Hanae HATA, Masato Nakamura, Nobuhiro Kinoshita, Jumpei Konno, Chiko Yorita
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Publication number: 20100309641Abstract: A method of forming narrow-pitch flip-chip bonding electrodes and wire bonding electrodes at the same time is provided so as to reduce the cost of a substrate. In addition, a low-cost solder supply method and a flip-chip bonding method to a thin Au layer are provided. A stacked layer of a Cu layer 23 and a Ni layer 24 is employed as the electrode structure, and an Au layer 25 is plated on the outer periphery thereof. In the flip-chip bonding, dissolution of Au into the solder is minimized by employing a metal jet system in the soldering to the electrodes, so that the formation of Sn—Au having a high melting point is prevented, and at the same time, the wire-bondable Au layer 25 is ensured.Type: ApplicationFiled: March 21, 2008Publication date: December 9, 2010Applicant: RENESAS TECHNOLOGY CORP.Inventors: Hanae Hata, Masato Nakamura, Masaki Nakanishi, Nobuhiro Kinoshita
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Patent number: 7722962Abstract: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.Type: GrantFiled: December 19, 2001Date of Patent: May 25, 2010Assignee: Renesas Technology Corp.Inventors: Tasao Soga, Hanae Hata, Toshiharu Ishida, Kanko Ishida, legal representative, Tetsuya Nakatsuka, Masahide Okamoto, Kazuma Miura
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Publication number: 20060145352Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.Type: ApplicationFiled: January 23, 2006Publication date: July 6, 2006Applicant: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Hata, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
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Publication number: 20060061974Abstract: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.Type: ApplicationFiled: December 19, 2001Publication date: March 23, 2006Inventors: Tasao Soga, Hanae Hata, Toshiharu Ishida, Kanko Ishida, Tetsuya Nakatsuka, Masahide Okamoto, Kazuma Miura
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Patent number: 6872465Abstract: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.Type: GrantFiled: March 7, 2003Date of Patent: March 29, 2005Assignee: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Hata, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
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Publication number: 20040177997Abstract: It is an object of the present invention to provide an electronic device using completely new soldered connection, and more particularly to achieve flip chip bonding on a high temperature side in a temperature hierarchy connection as an alternative method for high Pb containing solder including a large mount of Pb. The object can be achieved by using a configuration in which metallic balls including a single metal, an alloy, a chemical compound or a mixture thereof are connected by Sn or In for pads between a chip and a substrate.Type: ApplicationFiled: April 29, 2004Publication date: September 16, 2004Inventors: Hanae Hata, Tasao Soga, Toshiharu Ishida, Kazuma Miura, Kanko Ishida
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Publication number: 20040007384Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.Type: ApplicationFiled: March 7, 2003Publication date: January 15, 2004Applicant: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Hata, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
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Publication number: 20030224197Abstract: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.Type: ApplicationFiled: March 7, 2003Publication date: December 4, 2003Applicant: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Hata, Tetsuya Nakatsuka, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
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Publication number: 20030184986Abstract: A circuit board has a first electrode and a second electrode connected with respective electrodes of a chip and a first insulating layer with openings provided at respective positions corresponding to the first electrode and the second electrode. The openings of the first insulating layer are shaped so that the first insulating layer does not cover at least a region below the chip on the peripheral edges of the first and second electrodes.Type: ApplicationFiled: February 20, 2003Publication date: October 2, 2003Applicant: Hitachi, Ltd.Inventors: Tasao Soga, Hanae Hata, Toshiharu Ishida, Masahide Okamoto, Syougo Senoo, Toshiyuki Kagami, Akihiro Sakashita
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Patent number: 6563225Abstract: There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al—Mg—Ge—Zn alloy, said Al particles being connected to each other by said Al—Mg—Ge—Zn alloy phase.Type: GrantFiled: February 27, 2002Date of Patent: May 13, 2003Assignee: Hitachi, Ltd.Inventors: Tasao Soga, Toshiharu Ishida, Kazuma Miura, Hanae Hata, Masahide Okamoto, Tetsuya Nakatsuka
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Publication number: 20020149114Abstract: There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al—Mg—Ge—Zn alloy, said Al particles being connected to each other by said Al—Mg—Ge—Zn alloy phase.Type: ApplicationFiled: February 27, 2002Publication date: October 17, 2002Inventors: Tasao Soga, Toshiharu Ishida, Kazuma Miura, Hanae Hata, Masahide Okamoto, Tetsuya Nakatsuka