Patents by Inventor Hang Wu

Hang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240176955
    Abstract: Provided are a text processing method, a model training method, a device, and a storage medium. The text processing method includes: obtaining a source text; inputting the source text into a sequence-to-sequence model, to obtain a target sequence corresponding to the source text; and converting the target sequence into a target table.
    Type: Application
    Filed: August 30, 2022
    Publication date: May 30, 2024
    Inventors: Jiacheng ZHANG, Xueqing WU, Hang LI
  • Patent number: 11996351
    Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Tsung Hsiao, Jen Yu Wang, Chung-Jung Wu, Tung-Liang Shao, Chih-Hang Tung
  • Patent number: 11997795
    Abstract: A suction nozzle assembly used in manufacture for the gentlest handling of delicate components such as a camera lens includes a suction nozzle rod and a suction nozzle member. The suction nozzle rod includes a first through hole. The suction nozzle member includes a main body and a suction nozzle located on both sides of the main body. The main body includes a second through hole connected to the first through hole, and a third through hole connected to the second through hole. The suction nozzle includes at least one suction nozzle hole connected to the third through hole. The disclosure also provides a suction device having the suction nozzle assembly.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: May 28, 2024
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Kai-Ke Cheng, Hang Wu, Yan-Xin Feng, Peng-Cheng Niu
  • Patent number: 11991531
    Abstract: A method is provided. The method includes receiving a first dimension set, extracting a first latent feature set from the first dimension set, training a first base predictor based on the first feature set, generating a second dimension set based on the first dimension set, the second dimension set having fewer dimensions than the first dimension set, extracting a second latent feature set from the second dimension set, training a second base predictor based on the second feature set, and generating a traffic prediction based on the first base predictor and the second base predictor.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: May 21, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chengming Hu, Xi Chen, Ju Wang, Hang Li, Jikun Kang, Yi Tian Xu, Xue Liu, Di Wu, Seowoo Jang, Intaik Park, Gregory Lewis Dudek
  • Publication number: 20240145316
    Abstract: A bonding tool includes a bonding monitoring system. The bonding monitoring system may include one or more sensors that are configured to generate bonding wave propagation data associated with a bonding operation. As a bond between a top semiconductor substrate and a bottom semiconductor substrate propagates from respective centers to respective perimeters of the top semiconductor substrate and the bottom semiconductor substrate, the one or more sensors of the bonding monitoring system generates the bonding wave propagation data. A controller that communicates with the one or more sensors receives the bonding wave propagation data from the one or more sensors. The controller may monitor the bonding wave propagation based on the bonding wave propagation data and/or may determine various performance parameters of the bonding operation, such as a bonding wave propagation rate and/or a bonding wave propagation uniformity, among other examples.
    Type: Application
    Filed: April 10, 2023
    Publication date: May 2, 2024
    Inventors: Chung-Jung WU, Jeng-Nan HUNG, Chih-Hang TUNG
  • Publication number: 20240136251
    Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang
  • Patent number: 11968125
    Abstract: A data transmission method includes: determining, by a regional access device, a message that needs to be transmitted includes M pieces of QoS information; and after the regional access device determines that a device identifier in a first piece of QoS information is consistent with a device identifier of the regional access device, updating a QoS value of the message that needs to be transmitted with a first QoS value in the first piece of QoS information, and forwarding the updated message that needs to be transmitted. The first piece of QoS information is any one of the M pieces of QoS information.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: April 23, 2024
    Assignee: CHINA UNIONPAY CO., LTD.
    Inventors: Lijun Zu, Hang Yuan, Jintan Wu, Hongmei Chu
  • Patent number: 11961732
    Abstract: A method includes depositing a first work-function layer and a second work-function layer in a first device region and a second device region, respectively, and depositing a first fluorine-blocking layer and a second fluorine-blocking layer in the first device region and the second device region, respectively. The first fluorine-blocking layer is over the first work-function layer, and the second fluorine-blocking layer is over the second work-function layer. The method further includes removing the second fluorine-blocking layer, and forming a first metal-filling layer over the first fluorine-blocking layer, and a second metal-filling layer over the second work-function layer.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Ching Lee, Chung-Chiang Wu, Shih-Hang Chiu, Hsuan-Yu Tung, Da-Yuan Lee
  • Patent number: 11955459
    Abstract: A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11955405
    Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jen Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Patent number: 11941663
    Abstract: A location-aware electronic device is provided. The electronic device trains feature extraction layers, reconstruction layers, and classification layers. The training may be based on a reconstruction loss and/or a clustering loss. The electronic device processes a fingerprint to obtain an augmented fingerprint using randomization based on statistics of the fingerprint. The feature extraction layers provide feature data to both the reconstruction layers and the classification layers. The classification layers operate on the codes to obtain an estimated location label. An application processor operates on the estimated location label to provide a location-aware application result to a person.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Xi Chen, Hang Li, Chenyi Zhou, Xue Liu, Di Wu, Gregory L. Dudek
  • Publication number: 20240096825
    Abstract: A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.
    Type: Application
    Filed: February 8, 2023
    Publication date: March 21, 2024
    Inventors: Chen-Hua YU, Chih-Hang TUNG, Kuo-Chung YEE, Yian-Liang KUO, Jiun-Yi WU
  • Publication number: 20240097005
    Abstract: Disclosed is a semiconductor device and semiconductor fabrication method. A semiconductor device includes: a gate structure over a semiconductor substrate, having a high-k dielectric layer, a p-type work function layer, an n-type work function layer, a dielectric anti-reaction layer, and a glue layer; and a continuous metal cap over the gate structure formed by metal material being deposited over the gate structure, a portion of the anti-reaction layer being selectively removed, and additional metal material being deposited over the gate structure. A semiconductor fabrication method includes: receiving a gate structure; flattening the top layer of the gate structure; precleaning and pretreating the surface of the gate structure; depositing metal material over the gate structure to form a discontinuous metal cap; selectively removing a portion of the anti-reaction layer; depositing additional metal material over the gate structure to create a continuous metal cap; and containing growth of the metal cap.
    Type: Application
    Filed: January 12, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Hang Chiu, Jui-Yang Wu, Kuan-Ting Liu, Weng Chang
  • Publication number: 20240093410
    Abstract: A method for preparing an ultra-fine and uniform acrylamide-based polymer hydrogel filament. The method comprises: formulating a reaction solution of acrylamide-based polymer under ice bath conditions, and drawing the reaction solution into a reaction tube by a syringe; parabolically bending the two ends of the reaction tube upward; hanging the reaction tube for 2 h-8 h, and performing a baking reaction to obtain an acrylamide-based polymer hydrogel; vacuum drying the reaction tube for 4 h-8 h to obtain a dry filament of acrylamide-based polymer; cutting the reaction tube to obtain a plurality of short polymerization tubes having a preset length; pushing the dry filament of acrylamide-based polymer out of the short tube by a stainless steel wire; purifying same in a soaking solution to obtain an expanded filament of acrylamide-based polymer; and drying same to obtain a acrylamide-based polymer hydrogel filament having a preset external diameter.
    Type: Application
    Filed: November 2, 2021
    Publication date: March 21, 2024
    Inventors: Yongsong Xu, Jian Wu, Hang Tang, Chuan Qin, Lei Mu, Fei Chen
  • Patent number: 11935957
    Abstract: Semiconductor device structures having gate structures with tunable threshold voltages are provided. Various geometries of device structure can be varied to tune the threshold voltages. In some examples, distances from tops of fins to tops of gate structures can be varied to tune threshold voltages. In some examples, distances from outermost sidewalls of gate structures to respective nearest sidewalls of nearest fins to the respective outermost sidewalls (which respective gate structure overlies the nearest fin) can be varied to tune threshold voltages.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chiang Wu, Wei-Chin Lee, Shih-Hang Chiu, Chia-Ching Lee, Hsueh Wen Tsau, Cheng-Yen Tsai, Cheng-Lung Hung, Da-Yuan Lee, Ching-Hwanq Su
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Patent number: 11910642
    Abstract: A display apparatus includes a first substrate, a pixel structure, a second substrate, and an anti-reflection structure. The pixel structure is disposed on the first substrate, and has an active element and a pixel electrode electrically connected to the active element. The second substrate is disposed opposite to the first substrate. The anti-reflection structure is disposed on the second substrate and is located between the first substrate and the second substrate. The anti-reflection structure includes a first insulating layer and a metal layer. The first insulating layer is disposed on the second substrate. The metal layer is disposed on the first insulating layer. The first insulating layer is located between the second substrate and the metal layer. The first insulating layer has an opening, the metal layer has an opening, and the opening of the first insulating layer and the opening of the metal layer overlap with the pixel electrode.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: February 20, 2024
    Assignee: Au Optronics Corporation
    Inventors: Chun-Cheng Hung, Zhu-Hang Wu, Che-Yuan Chang, Chee-Wai Lau, Mao-Hsun Cheng
  • Publication number: 20230399190
    Abstract: The present disclosure discloses a magnetic transmission mechanism for a correction tape. The magnetic transmission mechanism includes a first rotating magnet and a second rotating magnet. The first rotating magnet and the second rotating magnet are connected to each other by magnetic attraction in a contact or non-contact manner. One of the first rotating magnet and the second rotating magnet is an active member and the other is a follower rotating under magnetic attraction along with the active member. The magnetic transmission mechanism is in connection between a tape supply mechanism and a tape take-up mechanism of the correction tape. The present disclosure has the following beneficial effects: the structure is simple, the magnetic attraction principle is applied to the transmission between the tape supply mechanism and the tape take-up mechanism of the correction tape, and provides a new option for the transmission between the spools of the correction tape.
    Type: Application
    Filed: September 23, 2021
    Publication date: December 14, 2023
    Inventor: HANG WU
  • Publication number: 20230007818
    Abstract: A suction nozzle assembly used in manufacture for the gentlest handling of delicate components such as a camera lens includes a suction nozzle rod and a suction nozzle member. The suction nozzle rod includes a first through hole. The suction nozzle member includes a main body and a suction nozzle located on both sides of the main body. The main body includes a second through hole connected to the first through hole, and a third through hole connected to the second through hole. The suction nozzle includes at least one suction nozzle hole connected to the third through hole. The disclosure also provides a suction device having the suction nozzle assembly.
    Type: Application
    Filed: May 11, 2022
    Publication date: January 5, 2023
    Inventors: KAI-KE CHENG, HANG WU, YAN-XIN FENG, PENG-CHENG NIU
  • Patent number: 11498453
    Abstract: The invention provides an equalizing device for a vehicle soft-packed battery and an equalizing method for the soft-packed battery. According to the equalizing method for the vehicle soft-packed battery, a battery to be equalized is connected to a parallel equalization circuit by using an equalizing device for a vehicle soft-packed battery, battery cells to be equalized are sequentially equalized by adopting a first-in first-out sequence, and the SOC of each cell equalized is maintained within a preset range; and the number of the cells entering the equalizing device for the vehicle soft-packed battery is N, and the equalizing time of the battery cells is T. The equalizing device for the vehicle soft-packed battery comprises a holder clamping type or a copper sheet compressing type.
    Type: Grant
    Filed: July 3, 2020
    Date of Patent: November 15, 2022
    Assignee: UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY
    Inventors: Yuejiu Zheng, Wei Yi, Hang Wu, Long Zhou