Abstract: An alloy consisting of titanium, zirconium, cobalt, and nickel, and its fabrication.

Abstract: The present invention discloses a microwave heating system for desorbing contaminated soil, comprising: a feeding module; a heating cavity; a first microwave suppression cavity; a second microwave suppression cavity; a conveyor belt; a feeding device; and an exhaust module. The feeding device is arranged above the first microwave suppression cavity or the second microwave suppression cavity, and the feeding device contains a microwave absorber material. The invention further discloses a microwave heating process for desorption of polluted soil. With the microwave heating system and process for desorbing contaminated soil, the contaminated soil can be heated quickly and uniformly, and quickly cooled and taken out smoothly.

Abstract: An efficient blasting method for similar cutting in a rock tunnel is provided, which relates to the technical field of rock tunneling. The method includes the following steps: drilling: drilling central holes, lower cutting holes, upper cutting holes, auxiliary holes and peripheral holes in a cross section area for tunnel construction; filling explosives: filling explosives into the central holes, the lower cutting holes, the upper cutting holes, the auxiliary holes and the peripheral holes; and blasting: blasting following blast holes in turn to complete full-face one-time blasting in a millisecond delay blasting mode. The method is applicable for construction scenes of drilling and blasting methods.

Abstract: A method of producing a disconnect clutch includes producing a disconnect clutch, configured to selectively connect an engine and an electric machine, such that the disconnect clutch exhibits a clutch transfer function that causes a transmission output shaft torque variability that is less than a predetermined threshold during a simulated starting of the engine using the electric machine.

Abstract: The present disclosure provides a method for photo-curing 4D printing of a multi-layer structure with an adjustable shape recovery speed, and a multi-layer structure printed thereby. The multi-layer structure printed by the method for photo-curing 4D printing of the multi-layer structure with the adjustable shape recovery speed includes a plurality of deformation units sequentially connected in series, and each of the plurality of the deformation units includes two slow layers, a fast layer, and a transition layer; and the fast layer is arranged between the two slow layers, and the transition layer is arranged between at least one of the two slow layers and the fast layer. In the present disclosure, a low cross-linking layer is doped with a nanocarbon light-absorbing material to solve the problem that the low cross-linking layer is prone to over-curing when a high cross-linking layer is printed on the low cross-linking layer.

Abstract: An antibacterial peptide P104 and a lysin LysP53 with broad-spectrum lytic activity and applications thereof are provided. The amino acid sequence of the antibacterial peptide P104 is shown as SEQ ID NO: 1, and the gene sequence of the antibacterial peptide P104 is shown as SEQ ID NO: 3. The amino acid sequence of the lysin LysP53 is shown as SEQ ID NO: 2, and the gene sequence of the lysin LysP53 is shown as SEQ ID NO: 4. The antibacterial peptide P104 and the lysin LysP53 have lytic activity against Gram-negative bacteria, such as Acinetobacter baumannii, Pseudomonas aeruginosa, Klebsiella pneumoniae and Escherichia coli The lysin LysP53 can be subjected to soluble expression by Escherichia coli, and the activity of the lysin is high. Therefore, they have good application prospects in the research and development of anti-infective drugs.

Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: The present disclosure relates to systems, methods, and computer readable media for predicting surplus capacity on a set of server nodes and determining a quantity of deferrable virtual machines (VMs) that may be scheduled over an upcoming period of time. This determination of VM quantity may be determined while minimizing risks associated with allocation failures on the set of server nodes. This disclosure described systems that facilitate features and functionality related to improving utilization of surplus resource capacity on a plurality of server nodes by implementing VMs having some flexibility in timing of deployment while also avoiding significant risk caused as a result of over-allocated storage and computing resources. In one or more embodiments, the quantity of deferrable VMs is determined and scheduled in accordance with rules of a scheduling policy.

Abstract: Methods and apparatuses of boundary refinement for instance segmentation. The methods for instance segmentation include receiving an image and an instance mask identifying an instance in the image; extracting a set of image patches from the image based on a boundary of the instance mask; generating a refined mask patch for each of the set of image patches based on at least a part of the instance mask corresponding to the each of the set of image patches; and refining the boundary of the instance mask based on the refined mask patch for each of the set of image patches.

Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Abstract: In certain aspects, a circuit for multi-mode calibration can include a resistor input. The circuit can also include a first comparator connected to the resistor input and to a first plurality of voltage sources. The circuit can also include a first pull-up driver. The circuit can further include a logic pull-up code generator to calibrate the first pull-up driver. The circuit can additionally include a replica of the first pull-up driver. The circuit can also include a first pull-down driver and a second comparator connected to the replica, the first pull-down driver, and a second plurality of voltage sources. The second comparator can compare a voltage of a middle point between the first pull-down driver and the second pull-up driver to one of the second plurality of voltage sources. The circuit can further include a logic pull-down code generator.

Abstract: In certain aspects, a circuit for multi-mode calibration can include a resistor input. The circuit can also include a first comparator connected to the resistor input and to a first plurality of voltage sources. The circuit can also include a first pull-up driver. The circuit can further include a logic pull-up code generator to calibrate the first pull-up driver. The circuit can additionally include a replica of the first pull-up driver. The circuit can also include a first pull-down driver and a second comparator connected to the replica, the first pull-down driver, and a second plurality of voltage sources. The second comparator can compare a voltage of a middle point between the first pull-down driver and the second pull-up driver to one of the second plurality of voltage sources. The circuit can further include a logic pull-down code generator.

Abstract: Provided is a peptide and method in preventing or treating infections caused by a wide spectrum of pathogens, including bacteria and fungus in hosts such as plants and animals. Methods of preventing or treating plant diseases and infection in animals are also provided.

Abstract: The present invention relates to population of T cells with reduced expression of SIGLEC15, wherein the T cells are derived from sentinel lymph nodes in a subject having a cancer. The invention also relates to methods for obtaining such T cells, as well as to their use in therapy and pharmaceutical compositions comprising such T cells.

Abstract: Exemplary deposition methods may include delivering a boron-containing precursor and a nitrogen-containing precursor to a processing region of a semiconductor processing chamber. The methods may include providing a hydrogen-containing precursor with the boron-containing precursor and the nitrogen-containing precursor. A flow rate ratio of the hydrogen-containing precursor to either of the boron-containing precursor or the nitrogen-containing precursor may be greater than or about 2:1. The methods may include forming a plasma of all precursors within the processing region of the semiconductor processing chamber. The methods may include depositing a boron-and-nitrogen material on a substrate disposed within the processing region of the semiconductor processing chamber.

Abstract: A method for generating adversarial examples for a Graph Neural Network (GNN) model. The method includes: determining vulnerable features of target nodes in a graph based on querying the GNN model, wherein the graph comprising nodes including the target nodes and edges, each of the edges connecting two of the nodes; grouping the target nodes into a plurality of clusters according to the vulnerable features of the target nodes; and obtaining the adversarial examples based on the plurality of clusters.

Abstract: An apparatus and method in a wireless communication system and a computer readable storage medium. The apparatus comprises a processing circuit, which is configured to: configure a sounding reference signal (SRS) mapping structure for a user equipment on the basis of at least the number of antenna ports of the user equipment and the number of transmitting beams and/or receiving beams to be scanned; and notify the user equipment of the SRS mapping structure, wherein the SRS mapping structure at least comprises SRS resource settings for achieving uplink beam management and channel state information (CSI) acquisition at the same time, thereby reducing the system time delay and improving the uplink resource utilization rate.

Abstract: A data processing method and data processing apparatus are provided. The data processing method includes: acquiring multiple input tensors as input parameters for calculation process; for each input tensor, using M input sub-tensors that are combined to represent the input tensor; for each of the input tensors, replacing the input tensors with the M input sub-tensors that are combined to represent the input tensor, and performing the calculation process to obtain a calculation result. The data processing method increases the applicable scenarios of calculation process, effectively utilizes the powerful calculation ability of the originally provided low-accuracy floating points, and greatly improves the overall calculation efficiency.

Abstract: Provided are flux-compatible epoxy-phenol adhesive compositions useful as a low gap underfill and novel phenols useful therein. The flux-compatible epoxy-phenol adhesive compositions include an epoxy component including an epoxy compound having a cycloaliphatic, alicyclic or mixed cycloaliphatic-aromatic backbone, a multifunctional phenolic component, and a catalyst. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.