Abstract: Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object.

Abstract: Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.

Abstract: Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.

Abstract: Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object.