Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: A multi-layered substrate is manufactured utilizing a sheet material. The sheet material is a dielectric material with a dielectric adhesive coated on one side. A catalyst layer is at a boundary between the dielectric material and the adhesive. The catalyst layer is thin in comparison to the dielectric material and the dielectric adhesive. In the manufacture of the multi-layered substrate, the material is processed using patterning and metallizing steps. During this manufacture the processed sheet material may be supported with a releasable layer. Laminating additional sheet materials onto previously processed sheets produces multiple layers. These additional sheets are then processed. Multiple lamination steps may be performed in order to obtain an end product of a desired number of layers.

Abstract: A multi-chip module (MCM) having a substrate including a first surface, a second surface and a multi-layer interconnection arrangement disposed between the two surfaces. A high-density thin-film circuit region is provided on the substrate first surface to interconnect a plurality of integrated circuit chips and the multi-layer interconnection arrangement. The integrated circuit chips are powered through the high-density thin-film circuit region, which receives power from the multi-layer interconnection arrangement. A plurality of discrete on-board voltage converter devices, mounted on at least one substrate surface, provide uniform power supply distribution to multi-layer interconnection arrangement power planes, converting an MCM input voltage and current to a relatively lower output voltage and a relatively higher output current.

Abstract: A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. The cooling arrangement includes a plurality of U-shaped thermally conductive members, each having a set of leg portions connected with a top portion and an open end disposed over a respective one of the substrates. In addition, a first inner surface of at least one of the leg portions is in thermal contact with at least one of the integrated circuit elements. The cooling arrangement further includes a housing member containing therein the U-shaped members and includes a cooling plate arrangement in thermal contact with the housing and the top portions of the U-shaped members.

Abstract: A multi-layered substrate is manufactured utilizing a sheet material. The sheet material is a dielectric material with a dielectric adhesive coated on one side. A catalyst layer is at a boundary between the dielectric material and the adhesive. The catalyst layer is thin in comparison to the dielectric material and the dielectric adhesive. In the manufacture of the multi-layered substrate, the material is processed using patterning and metallizing steps. During this manufacture the processed sheet material may be supported with a releasable layer. Laminating additional sheet materials onto previously processed sheets produces multiple layers. These additional sheets are then processed. Multiple lamination steps may be performed in order to obtain an end product of a desired number of layers.

Abstract: A multi-chip module (MCM) having a substrate including a first surface, a second surface and a multi-layer interconnection arrangement disposed between the two surfaces. A high-density thin-film circuit region is provided on the substrate first surface to interconnect a plurality of integrated circuit chips and the multi-layer interconnection arrangement. The integrated circuit chips are powered through the high-density thin-film circuit region, which receives power from the multi-layer interconnection arrangement. A plurality of discrete on-board voltage converter devices, mounted on at least one substrate surface, provide uniform power supply distribution to multi-layer interconnection arrangement power planes, converting an MCM input voltage and current to a relatively lower output voltage and a relatively higher output current.

Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. The cooling arrangement includes a plurality of U-shaped thermally conductive members, each having a set of leg portions connected with a top portion and an open end disposed over a respective one of the substrates. In addition, a first inner surface of at least one of the leg portions is in thermal contact with at least one of the integrated circuit elements. The cooling arrangement further includes a housing member containing therein the U-shaped members and includes a cooling plate arrangement in thermal contact with the housing and the top portions of the U-shaped members.

Abstract: A system and method for connecting a laterally installable card longitudinally through an opening in an external wall of a computer system chassis, while the remaining cards of the computer system remain under power and operational. The system includes a carrier with guides and a first system connector for receiving the card. The carrier also includes a related, second system connector configured for longitudinal mating with a system connector on the chassis. The computer system incorporates light pipes that function as guides for the insertion of the carrier into the chassis, where the light pipes can be illuminated to indicate which card is to be changed. A handle provides for the insertion of the carrier into the chassis, and a locking mechanism on the chassis secures the carrier in an installed position.

Abstract: An improved apparatus is disclosed for removing and installing faulty printed circuit cards laterally through a side wall of a computer system, while the remaining cards of the computer system remain under power and operational. The computer system incorporates zero insertion force (ZIF) connectors for receiving the printed circuit cards, and a special interlock mechanism prevents each ZIF connector from being moved from its open position to its closed position until an associated card has been fully installed into the connector. In addition, a special centering mechanism is used to adjustably position the printed circuit card with its electrical contacts precisely aligned with the contacts of the ZIF connector.

Abstract: An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via.

Abstract: A spring-biased heat sink assembly for a multi-chip module that has several integrated circuit chips on a substrate. Thermal paste provides a thermal connection between a heat sink and the chips. A beam spring applies pressure to the back side of the substrate, maintaining a constant force that urges the chips against the heat sink and avoids mechanical stress that would otherwise result from lateral motion of the chips such as from differential expansion. A flat flexible cable connects the module with other circuitry.