Abstract: Compounds of formula I ##SPC1##wherein R denotes hydrogen or an aliphatic or aromatic radical. These compounds are prepared by irradiation of succinylsuccinic acid or diesters thereof, in the crystalline state, with UV light rays or with .gamma.-radiation.

Abstract: Adducts containing epoxide groups, which have been (so-called) "advanced" with polyesters containing rings are obtained by reacting adducts containing epoxide groups, which have been obtained by reaction of certain long-chain aliphatic polyesters with diepoxide compounds in excess, with polyesterdicarboxylic acids, containing carbocyclic or heterocyclic rings, while heating, 0.3 - 0.5 carboxyl group equivalent of the polyester-dicarboxylic acid containing rings being employed per 1 epoxide equivalent of the adduct containing epoxide groups. Curing of the (so-called) "advanced" adducts containing epoxide groups gives flexible moulded materials which are distinguished, in particular, by high tear propagation resistance.

Abstract: Curable epoxide resin mixtures based on long-chain adducts containing epoxide groups, which are obtained by reaction of certain long-chain aliphatic polyesters with an excess of diepoxide compounds, polycarboxylic acid anhydrides and linear polyester-dicarboxylic acids containing carbocyclic or heterocyclic rings, which mixtures contain, per 1 equivalent of epoxide groups, 0.2-0.8 mol of polycarboxylic acid anhydride and 0.8-0.2 equivalent of carboxyl groups of the polyester-dicarboxylic acid. Curing of these epoxide resin mixtures gives flexible moulding materials which are distinguished by high tear propagation resistance.

Abstract: The polyglycidyl compounds according to the invention can be manufactured by reacting epihalogenohydrin with compounds of the formula IV ##EQU1## OR THE FORMULA V ##EQU2## in which (1.) n denotes 2, 3 or 4, (2.) A represents a 2-valent, 3-valent or 4-valent organic radical which either contains a N-heterocyclic or cycloaliphatic ring or 2 N-heterocyclic rings or 2 phenylene rings, (3.) either B deontes the --CH.sub.2.O.CO--radical and m denotes the number 1, or B denotes the radical ##EQU3## and m denotes 0, and 4.) R.sup.1 represents a divalent radical, which contains at least one hydrantoin ring or uracil ring. During the reaction hydrogen halide splits off. From curable mixtures containing polyglycidyl compounds according to the invention and a curing agent such as hexahydrophthalic anhydride or phthalic anhydride are obtained products with good mechanical and electrical properties.

Abstract: Diepoxides manufactured by epoxidation of diacetals or diketals from .DELTA..sup.3 -cyclohexene-1,1-dimethanol or its homologues and dialdehydes or diketones which apart from the two aldehyde groups or keto groups only contain hydrocarbon radicals, for example the diepoxide of the formula ##SPC1##The new diepoxides couple good mechanical properties with a significantly higher heat distortion point according to Martens than the known epoxidised diacetals of similar constitution, in which the acetal groups are interrupted by an alkylene-oxyalkylene chain instead of by an alkylene chain which is free of ether oxygen.

Abstract: Curable epoxide resin mixtures based on adducts, containing epoxide groups, which are obtained by reaction of certain long-chain aliphatic polyesters with an excess of diepoxide compounds, and linear or slightly branched polyesters, containing carbocyclic or heterocyclic rings and possessing 3 or 4 terminal carboxyl groups, and having an average molecular weight of 600 - 6,000, 0.7 - 1.2 equivalents of carboxyl groups being present in the curable mixture per 1 equivalent of epoxide groups. Curing these epoxide resin mixtures gives flexible moulded materials which are distinguished by high tear propagation resistance.

Abstract: Compounds of aromatic amines with polycarboxylic acids which possess at least 2 glycidyl groups bonded to the nitrogen atoms of the amide groups, such as, for example, N,N'-diglycidylsebacic acid dianilide or N,N'-diglycidyltetra-hydrophthalic acid dianilide. These compounds, together with curing agents for epoxide resins, are suitable for the manufacture of mouldings, coatings or adhesive bonds.