Abstract: The apparatus and process to compensate for variations in thickness of molding tools and of moldable materials used in an embossing process to be carried out under a vacuum, while ensuring high dimensional stability, and to ensure different molding depths. For achieving this object, a chamber is employed having a pair of oppositely lying chamber parts, of which one is fixed to the framework and the other is adjustable, having side walls which comprise an inner part and an outer part. The inner part is fastened to the fixed chamber part and the outer part, on the outwardly facing end face to of which the adjustable chamber part comes to bear against the force of a spring during the closing of the chamber, is displaceable along guide elements on the fixed chamber part between two stops.

Abstract: In a micro diaphragm pump which has a pump body consisting of two parts, one part including two valve chambers with a pump chamber disposed therebetween and in communication with the valve chambers by passages, a diaphragm extends across and closes the chambers and forms, in the areas of the valve chambers, valve membranes for inlet and outlet valves which are integrally formed, both on one side of the diaphragm, both pump body parts being sealingly connected to the diaphragm.

Abstract: A method of making microstructure bodies of plastic material. A microstructured plate-like base body which is made by any known molding procedure and which has a first side serving as a first reference plane and a second side which has plastic microstructures projecting therefrom is covered at its second side with a material layer that engages the microstructures, whereupon the material layer is machined to provide a second reference surface parallel to the first reference surface and the base body is then machined parallel to the second reference surface to expose the microstructures projecting therefrom and the material layer is finally removed selectively with respect to the plastic material to release the microstructured bodies.

Abstract: In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold.