Abstract: Methods and apparatus for reducing post PECVD vacuum and abatement system fouling. Chamber cleaning times are reduced leading to increased efficiency and lower cost fabrication processes by introducing F2 or a fluorine containing gas into the PECVD system. When using F2, the cleaning gas may be introduced directly to desired locations of the system where it can interact without activation with unwanted deposits. Alternatively, the cleaning gas may be activated in-situ in the equipment using existing plasma discharge equipment, or the cleaning gas may be activated using an RPS and then introduced to the desired location in its already activated state.