Abstract: The invention relates to the surfaces of the polygon (2) and/or the plunger foot plate (3) of a high-pressure pump for a diesel motor, at least one of the surfaces having cavities at least in the contact area between the polygon (2) and the plunger foot plate (3). According to the invention the face of the plunger foot plate (3) lying opposite the polygon (2) is concave, at least in the load-free state and the cavities have a depth of between 5 and 50 ?m, a width of between 30 and 100 ?m and a length of at least 100 ?m, or a diameter ranging between 30 and 100 ?m. The edges of the cavities are rounded. The invention also relates to a method for producing said surfaces, according to which the cavities are first created in the surface by means of chemical etching, blasting using blasting agents or by means of a laser removal process, the surface is subsequently polished in a vibratory grinding process and the edges of the cavities are rounded.

Abstract: The invention relates to the surfaces of the polygon (2) and/or the plunger foot plate (3) of a high-pressure pump for a diesel motor, at least one of the surfaces having cavities at least in the contact area between the polygon (2) and the plunger foot plate (3). According to the invention the face of the plunger foot plate (3) lying opposite the polygon (2) is concave, at least in the load-free state and the cavities have a depth of between 5 and 50 ?m, a width of between 30 and 100 ?m and a length of at least 100 ?m, or a diameter ranging between 30 and 100 ?m. The edges of the cavities are rounded. The invention also relates to a method for producing said surfaces, according to which the cavities are first created in the surface by means of chemical etching, blasting using blasting agents or by means of a laser removal process, the surface is subsequently polished in a vibratory grinding process and the edges of the cavities are rounded.

Abstract: The invention relates to a method for the application of a lubricant layer to a frictionally stressed surface of an object, and to a corresponding object, the lubricant layer, in use, containing boric acid. For production, the object is introduced into a reactor and the reactor is evacuated. Then, to produce an adhesion-promoter layer, a process gas is introduced, which contains boron, nitrogen and/or carbon at least in the form of a compound or releases the corresponding element under process conditions, and penetrates into the region of the surface of the object, in particular by diffusion. To produce an intermediate layer containing boron and oxygen, a second precursor material, which contains boron at least in the form of a compound and releases the boron under process conditions, and a first precursor material, which contains oxygen at least in the form of a compound and releases the oxygen under process conditions, are introduced into the depositing gas phase.

Abstract: A composite structure having a substantially monocrystalline growth substrate and at least one monocrystalline or polycrystalline layer of diamond or diamond-like material arranged on a surface of the growth substrate, the surface of the growth substrate being provided with crystal growth nuclei having crystal axes which exhibit an inclination of not more than 10%, preferably not more than 7%, with respect to corresponding axes of the crystal lattice of the growth substrate, and a process for producing such a composite structure in which the growth substrate is pretreated and growth nuclei are deposited from a nucleating gas phase of known composition for depositing layers of diamond or diamond-like material, in which during the nucleation the growth substrate is raised to a negative electrical potential relative to the nucleating gas phase.

Abstract: The invention relates to a method for producing heteroepitaxial diamond layers on Si-substrates by means of CVD and standard process gases, in which (a) during the nucleation phase a negative bias voltage is applied to the Si-substrate and (b) following the nucleation phase diamond deposition takes place.

Abstract: A microcooling device and a method for its manufacture. The microcooling device has a high heat conductivity, is designed to accommodate electronic components on its exterior surface, and has a channel structure in its interior through which a coolant fluid can flow to carry heat away from the components. The channel structure is formed by a base substrate provided with a plurality of recesses and a cover layer externally covering the recesses, the cover layer being made from an electrically insulating and heat-conducting material, and being such that the electronic components can be mounted directly thereon.

Abstract: A composite structure for electronic components, having a base substrate with a flat side provided with a depression, and having a cover layer which is disposed on the flat side structured by the depression, and the depression being covered to form a hollow structure. The depression in the base substrate is created prior to the deposition of the cover layer and has a clear width measured parallel to the flat side that is less than one-half of its clear depth measured before the cover layer is applied. The vapor phase deposited cover layer is formed from a material which has a sufficiently high surface tension to promote three-dimensional growth of the vapor phase deposited layer.

Abstract: An organic layer for subsequent coating with a cover layer which is harder than the organic layer, and a process for surface treatment of the organic layer. In order to improve the quality of a subsequently applied cover layer, growth nuclei for the cover layer, which exhibit sp.sup.2 and/or sp.sup.3 bonding orbital hybridization, are arranged and/or exposed on the free surface of the organic layer.

Abstract: A layer construction with an organic layer and a transparent cover layer which covers the organic layer and which is harder than the organic layer, and a process for producing such a layer construction in which the cover layer is deposited on the surface of the organic layer from a precursor material present in the gas phase. In order to improve the optical quality of the layer construction, the cover layer, at least in a transition region between the organic layer and the cover layer, is deposited with an index of refraction which differs by a maximum of 20%, in particular by a maximum of 10%, from the index of refraction of the underlying organic layer.

Abstract: The invention relates to a composite structure for electronic components comprising a growth substrate, an intermediate layer having substantially a crystallographic lattice structure arranged on the growth substrate, and a diamond layer applied on top of the intermediate layer, and to a process for producing a composite structure of this type. In order to obtain a diamond layer of highest quality, the intermediate layer has substantially a zinc blende or diamond or a calcium fluoride structure, in which at the outset of the intermediate layer the difference between the lattice constant of the intermediate layer and the lattice constant of the growth substrate, relative to the lattice constant of the growth substrate, is less than 20%, in particular less than 10%, and in which at the transition from the intermediate layer to the diamond layer for the lattice constant of the intermediate layer and the lattice constant of the diamond layer the value of the expression .vertline.(n*a.sub.ZS -m*a.sub.D).vertline.

Abstract: An arrangement of a plurality of microcooling devices provided with electrical components, each microcooling device having a closed channel structure for a coolant to flow through, and being provided with electrical conductors for the electronic components and with externally carried fluid ducts for a coolant which flows through the channel structures. A covering layer which forms one of at least two flat sides of the microcooling device is made from an electrically insulating material with good heat conductivity. The electronic components are arrayed on this cover layer and on the opposite flat side of each microcooling device. Adjacent microcooling devices which are provided with electronic components on confronting flat sides are arranged with their components spaced apart or staggered with respect to one another, and the components of one microcooling device preferably are in contact with the cover layer of the adjacent microcooling device.

Abstract: A layer construction with an organic layer and a transparent cover layer which covers the organic layer and which is harder than the organic layer, and a process for producing such a layer construction in which the cover layer is deposited on the surface of the organic layer from a precursor material present in the gas phase. In order to improve the optical quality of the layer construction, the cover layer, at least in a transition region between the organic layer and the cover layer, is deposited with an index of refraction which differs by a maximum of 20%, in particular by a maximum of 10%, from the index of refraction of the underlying organic layer.

Abstract: The invention relates to a semiconductor composite structure for an electronic component. The semiconductor composite structure comprises a diamond layer, which is substantially undoped except for unavoidable impurities, one side of which is covered by a doped diamond-free semiconductor layer, with the layers being arranged on a growth substrate. The discontinuity which exists at the transition between the semiconductor layer and the diamond layer with respect to the conduction band and/or the valence band, is such that in the semiconductor layer charge carriers, which are excited optically and/or thermally, can be conducted in the valence band and/or conduction band of the undoped diamond layer with a decrease in their potential energy.

Abstract: An organic layer for subsequent coating with a cover layer which is harder than the organic layer, and a process for surface treatment of the organic layer. In order to improve the quality of a subsequently applied cover layer, growth nuclei for the cover layer, which exhibit sp.sup.2 and/or sp.sup.3 bonding orbital hybridization, are arranged and/or exposed on the free surface of the organic layer.

Abstract: The invention relates to a composite structure for electronic components comprising a growth substrate, an intermediate layer having substantially a crystallographic lattice structure arranged on the growth substrate, and a diamond layer applied on top of the intermediate layer, and to a process for producing a composite structure of this type. In order to obtain a diamond layer of highest quality, the intermediate layer has substantially a zinc blende or diamond or a calcium fluoride structure, in which at the outset of the intermediate layer the difference between the lattice constant of the intermediate layer and the lattice constant of the growth substrate, relative to the lattice constant of the growth substrate, is less than 20%, in particular less than 10%, and in which at the transition from the intermediate layer to the diamond layer for the lattice constant of the intermediate layer and the lattice constant of the diamond layer the value of the expression.vertline.(n*a.sub.ZS -m*a.sub.D).vertline.