Abstract: The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

Abstract: The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

Abstract: The present invention is directed to an RF device that includes a ceramic layer characterized by a ceramic layer dielectric constant and includes an RF circuit arrangement having a predetermined geometry and predetermined electrical characteristics. The ceramic layer dissipates thermal energy generated by the RF circuit via substantially the entire ceramic surface area. A first dielectric layer comprises a thermoplastic material and has a predetermined first thickness and a first dielectric constant. The predetermined electrical characteristics of the RF circuit arrangement are a function of the ceramic layer dielectric constant. A relative softness of the thermoplastic material is a function of the RF device operating temperature.

Abstract: A coupler circuit that includes two parallel coupled transmission lines (first transmission line and second transmission line) and a third transmission line, one end of the third transmission line connects to the end of first transmission line at one side, the other end of the third transmission line connects to the end of the second transmission line at the other side. Various coupling value and impedance transforming ratio can be achieved by select corresponding even and odd mode impedance of the coupled transmission lines and characteristic impedance of the crossing transmission line.

Abstract: A coupler circuit that includes two parallel coupled transmission lines (first transmission line and second transmission line) and a third transmission line, one end of the third transmission line connects to the end of first transmission line at one side, the other end of the third transmission line connects to the end of the second transmission line at the other side. Various coupling value and impedance transforming ratio can be achieved by select corresponding even and odd mode impedance of the coupled transmission lines and characteristic impedance of the crossing transmission line.