Patents by Inventor Hans Somerma

Hans Somerma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6909345
    Abstract: The invention relates to a waveguide manufacturing and a waveguide manufactured with the method, which can be integrated into a circuit structure manufactured with the multilayer ceramic technique. The core part (23, 33, 43, 53a, 53b, 53c) of the waveguide is formed by a unit assembled of ceramic layers, which is limited in the yz plane by two impedance discontinuities and in the xz plane by two planar surfaces (24, 25, 34, 35, 54a, 54c, 55a, 55b, 55c) made of conductive material. The conductive surfaces can be connected to each other by vias made of conductive material (38, 39, 48, 49). The waveguide manufactured with the method according to the invention is a fixed part of the circuit structure as a whole.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: June 21, 2005
    Assignee: Nokia Corporation
    Inventors: Olli Salmela, Esa Kemppinen, Hans Somerma, Pertti Ikäläinen, Markku Koivisto
  • Patent number: 6778037
    Abstract: The invention relates to structures, by which part of the incoming high-frequency energy can be separated to its own path (out1) or energies coming from different paths can be combined to a common path. The basic idea of the invention is that all components of the dividing or combining means are integrated into a monolithic structure in an insulating material, preferably multilayer ceramics. The transmission line strips (311) and other conductors are formed by printing conductive material on the outer surface of the ceramic piece (301) and in its interlayers, when required. The conductors between the surfaces are formed by filling the hole made through the layer or layers with conductive material. The resistive components (321) parallel with and between the surfaces are formed in a similar manner. The structure according to the invention is relatively small and reliable, and its manufacturing costs are low.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: August 17, 2004
    Assignee: Nokia Corporation
    Inventors: Olli Salmela, Esa Kemppinen, Markku Koivisto, Hans Somerma, Pertti Ikäläinen, Petri Savolainen
  • Patent number: 6356172
    Abstract: An assembly for supporting a substrate of an integrated circuit and forming a cavity resonator with the substrate. The assembly includes a baseplate in which a cavity for the cavity resonator is integrally formed. A substrate is mounted over the cavity resonator in the baseplate and an excitation coupling extends into the cavity of the cavity resonator.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: March 12, 2002
    Assignee: Nokia Networks Oy
    Inventors: Markku Koivisto, Olli Salmela, Hans Somerma, Kalle Jokio