Abstract: A method of separating a workpiece into a plurality of sections includes generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, and dividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, wherein the one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece.

Abstract: A method of separating a workpiece into a plurality of sections includes generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, and dividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, wherein the one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece.

Abstract: The invention relates to a method for severing brittle flat materials, for example made of glass, ceramic, silicon, gallium arsenide or sapphire. The method includes the step of heating the flat material along desired dividing lines below its melting temperature by means of a laser alone desired separating lines. Then the material is shocked by a coolant jet so that a thermally-induced mechanical stress difference brings about a material separation. Traces are formed in the flat material in advance along the separation lines, so that the flat material has a lower breaking stress along the traces than in the unworked flat material, and the separation with the laser takes place along these traces.

Abstract: The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.

Abstract: The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are generated in that the disk is first cooled proceeding from its underside at least along the planned severing lines toward the upper side of the disk, and the upper side of the disk is then acted upon by a laser beam along the planned severing lines. The description also relates to an apparatus for carrying out the method.

Abstract: The invention relates to a method and to a device for the mechanical structuring of thin-film solar cells which are carried on a flexible carrier layer in the form of a material web. The material web is held on a support, where the groove areas, into which grooves are introduced for structuring with a mechanical scoring tool, are pulled onto elastic bases, by holding the material web by frictional engagement over adjacent groove-free areas.

Abstract: The present invention relates to a method of dividing a plane-parallel plate made of a brittle material into a plurality of individual plates having a specified edge length, in which break-off cuts are made along specified scored lines that form a lattice-like pattern by introducing thermally induced stresses by means of a laser beam, and in which, after making the break-off cuts along a first working direction, the resultant plate strips are spaced out at intervals in that a framed stretch film to which the plane-parallel plate is bonded is stretched by means of a vacuum device. The invention also relates to a device with a special clamping table for use in carrying out the method.

Abstract: The invention relates to a method for severing brittle flat materials, for example made of glass, ceramic, silicon, gallium arsenide or sapphire. The method includes the step of heating the flat material along desired dividing lines below its melting temperature by means of a laser along desired separating lines. Then the material is shocked by a coolant jet so that a thermally-induced mechanical stress difference brings about a material separation. Traces are formed in the flat material in advance along the separation lines, so that the flat material has a lower breaking stress along the traces than in the unworked flat material, and the separation with the laser takes place along these traces.

Abstract: The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are generated in that the disk is first cooled proceeding from its underside at least along the planned severing lines toward the upper side of the disk, and the upper side of the disk is then acted upon by a laser beam along the planned severing lines. The description also relates to an apparatus for carrying out the method.

Abstract: In accordance with the method of the invention, flat workpieces of brittle material, e.g., sapphire, glass ceramic, or glass, can be severed by inducing thermomechanical stresses, particularly along severing lines of the same direction, with a laser beam having a beam spot with asymmetric radiation density distribution on the workpiece by a relative movement in different directions in that a mirror-symmetric change in radiation density is brought about exclusively by changing the method parameters.

Abstract: The invention is directed to a device by which two plastic parts can be welded together along their contacting joining surfaces (workpiece) quasi-simultaneously by laser radiation along a joining contour. The beam bundle emitted by a laser diode is coupled into a first gradient index lens by a light-conducting fiber. The first gradient index lens concentrates the beam bundle on a workpiece surface, this first gradient index lens being deflected relative to the exit surface of the light-conducting fiber so that the beam bundle scans a joining contour on the workpiece surface in order to heat, plasticize and weld the workpiece quasi-simultaneously. A plurality of such devices may be put together to form a more complex device in order to apply radiation to larger joining contours simultaneously and quasi-simultaneously.

Abstract: A device for welding a plurality of thermoplastic plastic parts (parts to be joined) forming a hollow body with an opening by a laser, comprising a vacuum holder having a vacuum chamber which communicates with a vacuum pump, is open on one side and, together with the hollow body, forms a closed chamber that can be evacuated. When a vacuum is applied, the vacuum holder holds the hollow body stationary, holds the joined parts together and enables testing of the tightness of the weld.

Abstract: In a method for joining plastic structural component parts by laser radiation, it is the object of the invention to prevent impairment of the surface quality by the falling in of material of the quality surface in thin-walled plastic structural component parts when the latter are connected to another part. A first thin-walled plastic structural component part having a quality surface is formed so as to be absorbent for the laser radiation and is welded by the transmission radiation method on a side located opposite from the quality surface to a second plastic structural component part which is transparent to the laser radiation.

Abstract: A device for welding a plurality of thermoplastic plastic parts (parts to be joined) forming a hollow body with an opening by a laser, comprising a vacuum holder having a vacuum chamber which communicates with a vacuum pump, is open on one side and, together with the hollow body, forms a closed chamber that can be evacuated. When a vacuum is applied, the vacuum holder holds the hollow body stationary, holds the joined parts together and enables testing of the tightness of the weld.