Abstract: The invention relates to a device for delivering electronic components, in particular SMD components, to an insertion unit. The electronic components are kept ready in the form of a bar unit. A control unit interacts with an actuating unit in each case arranged on delivery rails of a delivery unit, so that the assignment of the bar unit to a predefined delivery rail is made possible, by the actuating unit being brought into a locked position in which the delivery rail is blocked or into an unlocked position in which the delivery rail is released.

Abstract: An apparatus for placing electrical components on a circuit board, having a placement unit and a feed unit for feeding the components thereto. The feed unit contains a magazine with an associated identification medium and a monitoring unit. Component-related data is stored in the identification medium. The monitoring unit is used to compare the component-related data with placement-related data which are predetermined by a central data processing unit to effect an accurate match between the two.

Abstract: An apparatus is provided for applying solder paste to the contact elements of ball grid array components, which is economical to manufacture and simple to handle, and which nonetheless offers the possibility of being able to apply a desired amount of solder precisely to the contact elements of a ball grid array component.